SDI fabsurplus.com is pleased to announce the availability of the following listed used HITACHI S-9300 SEM - CD (CRITICAL DIMENSION).
Please click on the "Send More Details" button at the end of the S-9300 description, if you'd like to get more details, photos and specifications of this SEM - CD (CRITICAL DIMENSION), and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This HITACHI S-9300 SEM - CD (CRITICAL DIMENSION) is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.

HITACHI S-9300 Equipment Details

SDI ID: 101020
Manufacturer: HITACHI
Model: S-9300
Version: 200 mm
Vintage: 01.06.2005
Quantity: 1
Sales Condition: inquire
Lead Time: 2 months
Sales Price: Inquire

Completely refurbished to standard specification.

Scanning Electron Microscope for Measurement of Critical Dimensions, type Hitachi S9300



Substrate diameter

150 mm


3nm (30A) at 0.8kV


1k to 300k

Repeatability of measurements

3nm (3 sigma)

Measurement range

0,1-2,0 um


1k to 300k


35 wafers/hr

Data processing and saving

Fail data saving

Mode of measurement


Double open Cassettes


Auto transfer of wafers from cassetteto

chamber robot


Sensor of presence wafer into cassettes

If the cassette has no wafer at any selected slot and was selected to load, the robot arm vacuum sensor recognizes the absence of the wafer and an error message occurs to indicate that no wafer was found at that slot.

Robot system for moving wafer

Random access with use of 2 cassettes and more

Automatic loading and unloading

Automatic evacuation and automatic


Step position: feed back to linear scale

Through Laser feedback



Electron optical system

Electron Gun

Schottky emission source

Accelerating Voltage:

500V to 1600V, 10V steps, Probe current: 4~24pA

Electromagnetic Lens

3-Stage Electromagnetic Lens System with boosting voltage

Objective aperture

4-opening, click-stop, heated aperture is

selectable/adjustable outside the vacuum

Scan Coil

2-Stage Electromagnetic Deflection

Wafer Imaging Ability

Entire Surface of 12 inch wafer


3nm (800V)

Field of view: 1.2mm

SECS/GEM communication interface

Dual XY Hitachi Microscale

DSP Image Processing

BSE Mode Functionality

Multipoint Measurement Function

Edge Roughness Function


Attachments: 5 Files
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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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