SDI fabsurplus.com is pleased to announce the availability of the following listed used ASM AeroLED Ball Bonder for RGB LED Panels.
Please click on the "Send More Details" button at the end of the AeroLED description, if you'd like to get more details, photos and specifications of this Ball Bonder for RGB LED Panels, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This ASM AeroLED Ball Bonder for RGB LED Panels is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
| SDI ID: | 102504 |
|---|---|
| Manufacturer: | ASM |
| Model: | AeroLED |
| Description: | Ball Bonder for RGB LED Panels |
| Version: | Inquire |
| Vintage: | 01.06.2017 |
| Quantity: | 1 |
| Sales Condition: | as is where is |
| Lead Time: | immediately |
| Sales Price: | Inquire |
| Comments: | The ASM AeroLED Ball Bonder is a PC controlled Thermosonic Ball Bonder designed for handling Laminate PCB panels. It consists of a very accurate voice coil controlled bond head mounted on a precision linear motor driven X/Y table, dual optics CCD controlled targeting system, a DSP controlled ultrasonic generator, PC based PR System using MMX technology and magazine to magazine elevator and indexer. Standard Machine features and system description Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High accuracy workholder with linear indexer Multiple magazine input / output elevator system for magazines Light weight voice-coil wire clamp assembly Strong window clamp force CCD camera with RR-mode capability and dual magnification optics Individual target point programmable coaxial and ring LED lighting system Built-in Inline Vision inspection system Real time monitoring of bonding parameters bond force, bond power and position Intelligent looping control incorporates auto tuning technology for loop trajectory profiling Loop profiles to cover low loop, square loop, normal reverse, ground and J-wire looping Enhanced EFO and non-stick detection control Real time monitoring of FAB Post-bond monitoring module (post bond inspection and statistical management system) Menu and graphics driven man-machine interface Combined hard disk and USB port for data and program storage Features • High speed and high resolution • X-power dual directional transducer • Precision ball size formation • Easy loop programming feature (ECP) • Copper bonding capable • Real time monitoring features • Full traceability logging • Automatic magazine changing system • Quick product changeover • Low maintenance requirements • Easy to change heat block and window clamp WIRE BONDING CAPABILITIES Wire Type Au, Cu, Ag Wire Size 0.5 - 2.0 mil Speed Up to 24 wires/sec Accuracy ±3.0 um @ 3 σ MATERIAL HANDLING CAPABILITIES True Bonding Area 56 - 90 mm Leadframe Length 140 - 300 mm Width <= 100 mm Thickness 0.1 - 0.8 mm Magazine Length 140 - 305 mm Width 32 - 115 mm Height <= 180 mm MACHINE DETAILS Width 1,200 mm Depth 900 mm Height 1,760 mm Weight 800 kg POWER 1200 W VOLTAGE 220 VAC CYCLES 50/60 Hz AIR PRESSURE 5 BAR, 150 LPM Spare Parts Kit available for extra cost. Video demo avaiable upon request |
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| Attachments: | 4 Files |
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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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