SDI fabsurplus.com is pleased to announce the availability of the following listed used ASM AeroLED Ball Bonder for RGB LED Panels.
Please click on the "Send More Details" button at the end of the AeroLED description, if you'd like to get more details, photos and specifications of this Ball Bonder for RGB LED Panels, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This ASM AeroLED Ball Bonder for RGB LED Panels is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||Ball Bonder for RGB LED Panels|
|Sales Condition:||as is where is|
The ASM AeroLED Ball Bonder is a PC controlled Thermosonic Ball Bonder designed for handling Laminate PCB panels. It consists of a very accurate voice coil controlled bond head mounted on a precision linear motor driven X/Y table, dual optics CCD controlled targeting system, a DSP controlled ultrasonic generator, PC based PR System using MMX technology and magazine to magazine elevator and indexer.
Standard Machine features and system description
Ultra-fine pitch and small ball bonding capabilities
High frequency transducer operating at 138 kHz
Applicable wire size of 0.6mil-2.0mil
High speed XY table with linear motor technology
High accuracy workholder with linear indexer
Multiple magazine input / output elevator system for magazines
Light weight voice-coil wire clamp assembly
Strong window clamp force
CCD camera with RR-mode capability and dual magnification optics
Individual target point programmable coaxial and ring LED lighting system
Built-in Inline Vision inspection system
Real time monitoring of bonding parameters bond force, bond power and position
Intelligent looping control incorporates auto tuning technology for loop trajectory profiling
Loop profiles to cover low loop, square loop, normal reverse, ground and J-wire looping
Enhanced EFO and non-stick detection control
Real time monitoring of FAB
Post-bond monitoring module (post bond inspection and statistical management system)
Menu and graphics driven man-machine interface
Combined hard disk and USB port for data and program storage
• High speed and high resolution
• X-power dual directional transducer
• Precision ball size formation
• Easy loop programming feature (ECP)
• Copper bonding capable
• Real time monitoring features
• Full traceability logging
• Automatic magazine changing system
• Quick product changeover
• Low maintenance requirements
• Easy to change heat block and window clamp
WIRE BONDING CAPABILITIES
Au, Cu, Ag
0.5 - 2.0 mil
Up to 24 wires/sec
±3.0 um @ 3 σ
MATERIAL HANDLING CAPABILITIES
True Bonding Area 56 - 90 mm
Leadframe Length 140 - 300 mm
Width <= 100 mm
Thickness 0.1 - 0.8 mm
Magazine Length 140 - 305 mm
Width 32 - 115 mm
Height <= 180 mm
Width 1,200 mm
Depth 900 mm
Height 1,760 mm
Weight 800 kg
1200 W VOLTAGE 220 VAC
CYCLES 50/60 Hz
AIR PRESSURE 5 BAR, 150 LPM
Spare Parts Kit available for extra cost.
Video demo avaiable upon request
Send Me More Details about this item.
The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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