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ASM AeroLED Ball Bonder for RGB LED Panels for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used ASM AeroLED Ball Bonder for RGB LED Panels.
Please click on the "Send More Details" button at the end of the AeroLED description, if you'd like to get more details, photos and specifications of this Ball Bonder for RGB LED Panels, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This ASM AeroLED Ball Bonder for RGB LED Panels is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


ASM AeroLED Equipment Details

SDI ID: 102504
Manufacturer: ASM
Model: AeroLED
Description: Ball Bonder for RGB LED Panels
Version: Inquire
Vintage: 01.06.2017
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

The ASM AeroLED Ball Bonder is a PC controlled Thermosonic Ball Bonder designed for handling Laminate PCB panels. It consists of a very accurate voice coil controlled bond head mounted on a precision linear motor driven X/Y table, dual optics CCD controlled targeting system, a DSP controlled ultrasonic generator, PC based PR System using MMX technology and magazine to magazine elevator and indexer.

Standard Machine features and system description

Ultra-fine pitch and small ball bonding capabilities

High frequency transducer operating at 138 kHz

Applicable wire size of 0.6mil-2.0mil

High speed XY table with linear motor technology

High accuracy workholder with linear indexer

Multiple magazine input / output elevator system for magazines

Light weight voice-coil wire clamp assembly

Strong window clamp force

CCD camera with RR-mode capability and dual magnification optics

Individual target point programmable coaxial and ring LED lighting system

Built-in Inline Vision inspection system

Real time monitoring of bonding parameters bond force, bond power and position

Intelligent looping control incorporates auto tuning technology for loop trajectory profiling

Loop profiles to cover low loop, square loop, normal reverse, ground and J-wire looping

Enhanced EFO and non-stick detection control

Real time monitoring of FAB

Post-bond monitoring module (post bond inspection and statistical management system)

Menu and graphics driven man-machine interface

Combined hard disk and USB port for data and program storage

Features

• High speed and high resolution

• X-power dual directional transducer

• Precision ball size formation

• Easy loop programming feature (ECP)

• Copper bonding capable

• Real time monitoring features

• Full traceability logging

• Automatic magazine changing system

• Quick product changeover

• Low maintenance requirements

• Easy to change heat block and window clamp

WIRE BONDING CAPABILITIES

Wire Type

Au, Cu, Ag

Wire Size

0.5 - 2.0 mil

Speed

Up to 24 wires/sec

Accuracy

±3.0 um @ 3 σ

MATERIAL HANDLING CAPABILITIES

True Bonding Area 56 - 90 mm

Leadframe Length 140 - 300 mm

Width <= 100 mm

Thickness 0.1 - 0.8 mm

Magazine Length 140 - 305 mm

Width 32 - 115 mm

Height <= 180 mm

MACHINE DETAILS

Width 1,200 mm

Depth 900 mm

Height 1,760 mm

Weight 800 kg

POWER

1200 W VOLTAGE 220 VAC

CYCLES 50/60 Hz

AIR PRESSURE 5 BAR, 150 LPM

Spare Parts Kit available for extra cost.

Video demo avaiable upon request

Categories:
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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

July 2021 Update
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