SDI fabsurplus.com is pleased to announce the availability of the following listed used SEC Model 860 Eagle Flip Chip Bonder.
Please click on the "Get Quote" button at the end of the Model 860 Eagle description, if you'd like to get a quotation, photos and specifications of this Flip Chip Bonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This SEC Model 860 Eagle Flip Chip Bonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Model:||Model 860 Eagle|
|Description:||Flip Chip Bonder|
|Sales Condition:||as is where is|
Precision servo-motor driven Z motion with the option of choosing from 2 closed loop bond control ranges from 5 grams to 10 kilograms; your choice of one range per configuration.
Extend-retract cube beam splitter viewing system with fiber optic illuminators including color CCD video camera; 14" monitor with a magnification range of 20X to 200X.
Simplified flat panel display for viewing the cycle and prompting operator action via joystick as process proceeds, providing time and temperature readouts. Internal PC for controlling bond load, temperature profiles, process times and machine cycle. Hard drive and 3.5" floppy disk drive included.
Workstage (3 options available)
Micrometer adjusted workstage holder for movement over either a small or large open area in X, Y and theta during pickup; easily detachable, modular workstage not included – choose from a 1-1/2" rapid (to 400 degrees C) heat-up stage for small substrates, a 4" preset fixed stage (to maximum of 350 degrees C) for large area heating, or a cold, unheated 4" stage.
4" square work chuck with vacuum hold down for either fixed heat or unheated stage or a 3/4" square flat vacuum chuck for rapid heat-up; custom work chucks available.
Thermocompression bond head with fixed pick-up tool for operation from cold temperature up to 250 degrees C; includes temperature ramping feature (for adhesive applications) during placement process.
· Die sizes up to 2.0” sq.
· 1 Micron placement accuracy. (Actual die placement accuracy depends on the application).
· Magnification up to 560X
· Viewable area 2.0 ‘’ square. (With optional X-Y motorized viewer
· Stages 1”, 2”, 4” square standard. (other sizes and shapes available)
· Stage temperatures to 450 C (depends on stage selected)
· Stage temperature ramp rate: 1” rapid heat-15 C/sec, 2” rapid heat-10 C/sec
· Bond head temp to 400 C. (depends on bond head selected)
· Bond load 10g to 10Kg (depends on bond head selected).
· Power: 120/220V, 10/5 amp. 50-60 Hz
· Compressed Air: 60 psi
· Vacuum: 10” Hg
· Gas: 40 psi (cover gas for spot heating)
· Weight: System: 300 lbs. - Shipping: 400 lbs
Please check the attachments below for more information.
The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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