TDK AFM-1505 Flip Chip Bonder for Sale

SDI fabsurplus.com is pleased to announce the availability of the following listed used TDK AFM-1505 Flip Chip Bonder.
Please click on the "Get Quote" button at the end of the AFM-1505 description, if you'd like to get a quotation, photos and specifications of this Flip Chip Bonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This TDK AFM-1505 Flip Chip Bonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.

TDK AFM-1505 Equipment Details

SDI ID: 102792
Manufacturer: TDK
Model: AFM-1505
Description: Flip Chip Bonder
Version: Assembly
Vintage: 31.05.2017
Quantity: 1
Sales Condition: as is where is
Lead Time: Inquire
Sales Price: Inquire
In Fab - Disconnected, Decontaminated, Not Deinstalled TDK Corporation AFM-1505 Compact Ultrasonic BonderFeature :• Flexible design for the various process (Ultrasonic· Thermosonic • C4 • Thermal Compression· Eutectic • Transfer etc.)• Process and machine proposal based on the sufficient experiencesPre heater tableBond heater tableAuto nozzle cleaningUltrasonic checkingBump collapse height measurementBump absence detectionBad mark detectionWafer theta axis correctionWafer expansionHot blowNozzle surface monitoringLANNozzle bonding counterProduction management dataSpecifications :Method : Face Down Flip Chip Bonding (Option: Face Up / High Precision Mounting) Bonding Process : Ultrasonic· Thermosonic • C4 • Thermal Compression· Eutectic· Transfer etc. Mounting Tact Time : MAX: 0.78sec/chip (Including 0.2sec process time) Accuracy : ±7µm/3o (Option ±5µm,±3µm) Max Load : 25N (Option 50N, 1 DON, 200N, 500N) Chip Size MAX: 2.5W X 2.50 X 1.0T mm  (Option MAX:20.0W X 20.00 mm)Chip Size MIN: 0.3WX 0.3DX 0.1T mmChip Supply : 5-. 6, B, 12 Inch Wafer, Tray etc (Wafer magazine auto loading)Substrate Size MAX: 180W X 120D X 3.0T mm (Option MAX: 8 inch wafer) Substrate Size MIN: 50W X 50D X 0.3T mm Substrate Supply : Substrate• Package Tray•Wafer Tray etc. Machine Size : 1,200W X1 ,504D X1 ,650H mm Machine Weight : approx. 1,800kgPower : AC200V or AC220V 3phase 50/60Hz 30A Compressed Air : Pressure : 0.5Mpa Consumption :approx. 30NL/min Connection: R 1/4 or Joint for 10mm tube Vacuum : -80 kPa or more

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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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