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TEL Tokyo Electron ACT 8 Photo Resist Coat and Develop System, Dual Block, 4C 4D for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used TEL Tokyo Electron ACT 8 Photo Resist Coat and Develop System, Dual Block, 4C 4D.
Please click on the "Get Quote" button at the end of the ACT 8 description, if you'd like to get a quotation, photos and specifications of this Photo Resist Coat and Develop System, Dual Block, 4C 4D, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This TEL Tokyo Electron ACT 8 Photo Resist Coat and Develop System, Dual Block, 4C 4D is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


TEL Tokyo Electron ACT 8 Equipment Details

SDI ID: 102899
Manufacturer: TEL Tokyo Electron
Model: ACT 8
Description: Photo Resist Coat and Develop System, Dual Block, 4C 4D
Version: 200 mm
Vintage: 01.06.2006
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

DUV, Dual Block, 4C4D1IFB, 6PHP, Full Oven Configured, Right to Left, 4UNCs, ASML

Peripheral parts of the system included:
Chemical Supply System #1
Photo Resist and HMDS Supply
2,200 x 700 x 1,900 (L x W x H, mm)

Chemical Supply System #2
Solvent and Develop Solutions Supply
2,600 x 900 x 1,900 (L x W x H, mm)

AC Power Rack
900 x 800 x 2,000 (L x W x H, mm)

Thermo Control Unit
INR-244-211D-45
450 x 1,050 x 1,400 (L x W x H, mm)

Temp & Humidity Controller
TEL OEM Shinwa ESA-4
950 x 750 x 1,000 (L x W x H, mm)

General Configuration:-

A. Wafer Size : 200mm, Deep UV Application, Double Block System
B. Wafer Flow : Right to Left (CSB Unit is in Right side and Interface Station Unit is in Left side)
C. Process Block : 2ea (Dual Block System)
D. Block #1
E.
a TEL Clean Track ACT 8 EC/Equipment Controller #3
b Stage/Indexer : 4 Uni-Cassettes CSB/Cassette Stage Block
c CRA/Cassette Block Robotics Arm : 1ea
d FFU: Installed
Block #2
a
2-1 Standard Coat Unit
1 4 Standard Photo Resist Dispense Nozzles
2 4 TEL OEM RDS Photo Resist Pumps
3 1 Solvent Pre-wet RRC/Reduced Resist Coat Nozzle
4 1 Side Rinse Nozzle (Programmable Side Rinse EBR)
5 Dual Back Rinse Nozzles
6 Coat Cup Temperature Synchronized Control System
7 Photo Resist Temperature Control
8 Motor Flange Temperature Control
9 Photo Resist Drain Type : Direct Gravity Drain Type
10 Auto Dummy Dispense System
11 Photo Resist Bottle Quantity :
     RESIST 1 RESIST 2 RESIST 3 RESIST 4
2-1    1        1         1       1
2-2    1        1         1       1

2-2 Standard Coat Unit : Same as 2-1 Standard Coat Unit
c 2-3 BCT (Bottom ARC /Anti Reflecting Coat) Unit
1 2 Standard Dispense Nozzles
2 2 TEL OEM RDS Photo Resist Pumps
3 1 Solvent Pre-wet RRC/Reduced Resist Coat Nozzle
4 1 Side Rinse Nozzle (Programmable Side Rinse EBR)
5 Dual Back Rinse Nozzles
6 Coat Cup Temperature Synchronized Control System
7 Photo Resist Temperature Control
8 Motor Flange Temperature Control
9 Photo Resist Drain Type : Direct Gravity Drain Type
10 Auto Dummy Dispense System
11 Photo Resist Bottle Quantity
    RESIST 1 RESIST 2
2-3 1         1
2-4 1         1
d. 2-4 BCT (Bottom ARC /Anti Reflecting Coat) Unit : Same as 2-3 BCT
e. PRA/Process Block Robotics Arm : 1ea
e. ADH/Adhesion Process Station : 2ea
f. LHP/Low Temperature Hot Plate Station : 6ea
g. CPL/Chilling Pate Process Station : 4ea
h. TCP/Transition Chill Plate : 1ea
i. TRS/Transition Stage Unit : 1ea
j. CWH/Cup Washer Holder Unit : 1ea
k. SHU/Shuttle Module : 2ea

Block #3
a.
3-1 NDP (New Develop) Unit
1 1 SH Nozzles with Motorized Type
2 Develop Temperature Control
3 Motor Flange Temperature Control
4 Drain Type : Direct Gravity Drain Type
5 Top Rinse Nozzle
6 Dual Back Rinse Nozzle
7 Auto Damper
8 Auto Dummy Dispense System
b. 3-2 NDP (New Develop) Unit : Same as 3-1 (New Develop Unit)
c. 3-3 NDP (New Develop) Unit : Same as 3-1 and 3-2 (New Develop Unit)
d. 3-4 NDP (New Develop) Unit : Same as 3-1, 3-2 and 3-3 (New Develop Unit)
e. PRA/Process Block Robotics Arm : 1ea
f. LHP/Low Temperature Hot Plate Process Station : 4ea
g. CPL/Chill Pate Process Station : 3ea
h. TRS/Transition Stage Unit : 1ea.
i. PHP/High Precision Hot Plate Process Station : 4ea
Block #4
a. IRA/Interface Robotics Arm : 1ea
b. Interface for ASML PAS5500 Step/Scanner Series
c. WEE/Wafer Edge Exposure Process Station :1ea
d. THS/Temporary Holding Stage : 1ea
e. SBU/Stationary Buffer Unit : 2ea
f. TRS/Transition Stage Unit : N/A
g. CPL/Chill Plate Process Station : N/A.
h. EIS/Interface Stage Module : 1ea
i. FFU: Installed
T&H/Temperature and Humidity Controller : 1ea
- TEL OEM Shinwa ESA-4
I.
External Chemical Supply System/Cabinet #1 (HMDS and Photo Resist)
a.
HMDS Supply System
1 HMDS Chemical Type : 1ea
2 Manual Supply System Type with 3 Liter Teflon Buffer Tanks (2)
3 Buffer Tanks (3 Liter/Tank, Teflon, N2 Bubbling) for 2 ADH Units
b.
Photo Resist Supply System
1 Total 12 Bottles
2 Bottle Auto Switch-off/Exchange : N/A
J.
External Chemical Supply System/Cabinet #2 (Solvent and Develop Solutions)
c.
Solvent Supply System for 2 Standard COT (2-1 and 2-2) and 2 BCT (2-3 and 2-4)
1 Solvent Chemical Type : 1ea
2 Bulk-Fill CSS/Central Chemical Supply Type with 3 Liter Teflon Buffer Tanks (2)
3 Buffer Tanks (3 Liter/Tank, Teflon) to support 4 Standard of COT
d.
Develop Supply System for 4 Develop Units
1 Develop Chemical Type : 1ea
2 Bulk-Fill CSS/Central Chemical Supply Type with 3 Liter Teflon Buffer Tanks (4)
3 4 Buffer Tanks (3 Liter/Tank, Teflon) to support 4 Develop Units
K.
TEL OEM TCU/Temperature Control Unit : 1ea

(SMC Circulator Pumps and Thermo-controller with 13 Channels)
1 2 Chilling Channel for 4 Coat Spin Units
2 2 Chilling Channel for 4 Develop Spin Units
3 7 Chilling Channel for 7 CPL/Chill Plate Process Station Units
L.
Robots : Total 4 Robots (1 CSB Robot, 2 Main Arm Robots and 1 Interface Station Robot)
M. Power Transformer AC Cabinet : 208VAC, 3 Phases, 50/60Hz
N.
Software Options
a. Software Version : 3.04

O. Safety Regulation Compliance : TEL S2-93 Safety Specification
P. Utility connection Position
a.Connection Position : Bottom/Back Side


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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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