TEL Tokyo Electron Clean Track ACT8 Photo Resist Coat and Develop System, DUV,Single Block, 2c, 2d, ASML for Sale

DUV, Single Block, 2C2D1IFB, 3PHP, Right to Left Flow, 4UNCs, ASML PAS5500

1. Maker : TEL/Tokyo Electron Limited
2. Model : Clean Track ACT 8
3. Description : Photo Resist Coat and Develop System
4. Vintage : 1998
5. Serial Number : TBA
6. Configuration

1. Block Diagram (Right to Left Wafer Flow)
    2,290 x 1,570 x 2,685 (L x W x H by mm)

Chemical Supply System
Develop, Solvent and HMDS Supply
1,400 x 700 x 1,810 (L x W x H, mm)

Thermo Control Unit
SMC INR-244-211D-45
450 x 1,050 x 1,400 (L x W x H, mm)

Temp & Humidity Controller
TEL OEM Shinwa T&H-ESA-2
600 x 1200 x 1000 (L x W x H, mm)

AC Power Rack
600 x 600 x 1,600 (L x W x H, mm)

2) Cable Lengths

No. From            To      Length
                            Power   Signal
1.  AC Power Rack   PRB2    13 M
    AC Power Rack   TCU     13 M
    AC Power Rack   T + H   13 M
2   Chemical Cab.   PRB2    13 M
    Chemical Cab.   TCU              13 M
    Chemical Cab.   T + H            13 M

3) Chemical Cabinet Layout Details

1           2           3           4
2-5 ADH     Solvent     2-3 DEV     2-4 DEV
HMDS        Filter      Filter      Filter
Buffer      Tray        Tray        Tray
Tank Tray   

4           5           6           7
Solvent     10L                     DEV
3L Buffer   Drain                   3L Buffer
Tank 2ea    Tank Tray               Tank 2ea

4) General Configuration
 A. Wafer Size : 200mm, DUV/Deep UV Application, Single Block System
 B. Wafer Flow : Right to Left (CSB Unit is in Right side and Interface Station Unit is in Left side)
 C. Process Block : 1ea (Single Block System)
 D. Block #1
  a. TEL Clean Track ACT 8 EC/Equipment Controller #2
  b. Stage/Indexer : Open Uni-Cassette CSB/Cassette Stage Block
  c. CRA/Cassette Block Robotics Arm : 1ea
  d. FFU: N/A

 E. Block #2
  a. 2-1 Standard Coat Unit including:
    1. 4 Standard Photo Resist Dispense Nozzles
    2. 4 TEL OEM RRC F-T201 Photo Resist Pumps
    3. 1 Solvent Pre-wet RRC/Reduced Resist Coat Nozzle
    4. 1 Side Rinse Nozzle (Programmable Side Rinse EBR)
    5. Dual Back Rinse Nozzles
    6. Coat Cup Temperature Synchronized Control System
    7. Photo Resist Temperature Control
    8. Motor Flange Temperature Control
    9. Photo Resist Drain Type : Auto Drain (SMC Drain Pump Type)
   10. Auto Dummy Dispense System
   11. Photo Resist Bottle Configuration:
            Resist#1 Resist#2 Resist#3 Resist#4
Coater 2-1  1 Bottle 1 Bottle 1 Bottle 1 Bottle
Coater 2-2  N/A      1 Bottle 1 Bottle N/A

  b. 2-2 TCT (Top ARC/Anti-Reflecting Coat) Unit including:
    1. 2 Standard Photo Resist Dispense Nozzles
    2. 2 TEL OEM RRC F-T201 Photo Resist Pumps
    3. 1 Solvent Pre-wet RRC/Reduced Resist Coat Nozzle
    4. 1 Side Rinse Nozzle (Programmable Side Rinse EBR)
    5. Dual Back Rinse Nozzles
    6. Coat Cup Temperature Synchronized Control System
    7. Photo Resist Temperature Control
    8. Motor Flange Temperature Control
    9. Photo Resist Drain Type : Auto Drain (SMC Drain Pump Type)
   10. Auto Dummy Dispense System
   11. Photo Resist Bottle Quantity :
            Resist#1 Resist#2 Resist#3 Resist#4
Coater 2-1  1 Bottle 1 Bottle 1 Bottle 1 Bottle
Coater 2-2  N/A      1 Bottle 1 Bottle N/A

  c. 2-3 Develop Unit, including:
    1. 1 Stream Nozzle
    2. Develop Temperature Control
    3. Motor Flange Temperature Control
    4. Drain Type : Direct Gravity Drain Type
    5. Top Rinse Nozzle
    6. Dual Back Rinse Nozzle
    7. Auto Damper
    8. Auto Dummy Dispense System
  d. 2-4 Develop Unit : Same as 2-3 Develop Unit
  e. PRA/Process Block Robotics Arm : 1ea
  f. ADH/Adhesion Process Station : 1ea
  g. LHP/Low Temperature Hot Plate Station : 4ea
  h. CPL/Chilling Pate Process Station : 3ea
  i. TRS/Transition Stage Unit : 3ea
  j. CHP/Chilling Hot Plate Process Station : 3ea.
  k. PHP/High Precision Hot Plate Process Station : N/A
  l. CWH/Cup Washer Holder Unit : 1ea

 F. Block #3 : Normal Speed Interface Block, including:
  a. IRA/Interface Robotics Arm : 1ea
  b. Interface for ASML(PAS5500/300C) Scanner.
  c. WEE/Wafer Edge Exposure Process Station :1ea (Deep UV, 365nm)
  d. THS/Temporary Holding Stage : 1ea
  e. SBU/Stationary Buffer Unit : 2ea
  f. TRS/Transition Stage Unit : N/A
  g. CPL/Chill Plate Process Station : N/A
  h. EIS/Interface Stage Module : N/A
  i. FFU: Installed

 G. T&H/Temperature and Humidity Controller : 1ea
   - 1ea of TEL OEM Shinwa T&H-ESA-2

 H. External Chemical Supply System/Cabinet (HMDS, Solvent, Developer)
   a.HMDS Supply System
    1. HMDS Chemical Type: 1ea
    2. Bulk-Fill CSS/Central Chemical Supply Type with 3 Liter Teflon Buffer Tanks (1)
    3. 1 Buffer Tanks (3 Liter/Tank, Teflon, N2 Bubbling) for 1 ADH Unit
   b.Solvent Supply System for 1 Standard COT (2-1) and 1 TCT (2-2)
    1. Solvent Chemical Type: 1ea
    2. Bulk-fill CSS/Central Chemical Supply Type with 3Liter Teflon Buffer Tanks (2
    3. 2 Buffer Tanks (3 Liter/Tank, Teflon) to support 1Standard of COT and 1 TCT
   c.Developer Supply System for 2 Develop Units (2-3 and 2-4)
    1. Developer Chemical Type: 1ea
    2. Bulk-Fill CSS/Central Chemical Supply Type with 3 Liter Teflon Buffer Tanks (2)
    3. 2 Buffer Tanks (3 Liter/Tank, Teflon) to support 2 Develop Units (2-3 and 2-4)

 I. TEL OEM TCU/Temperature Control Unit : 1ea
    (SMC Circulator Pumps and Thermo Controller with 7 Channels)
     a. 2 Chilling Channels for 2 Coat Spin Units (COAT and TARC Spin Unit)
     b. 2 Chilling Channels for 2 Develop Units
     c. 3 Chilling Channel for 3 CPL/Chill Plate Process Station Units

 J. Robots : Total 3 Robots (1 CSB Robot, 1 Main Arm Robots and 1 Interface Station Robot)

 K. Power Transformer AC Cabinet : 208VAC, 3 Phases, 50/60Hz

 L. Software
  a. Software Version : 1.18

 M. Safety Regulation Compliance : TEL S2-93 Safety Specification

 N. Utility connection Position
  a.Connection Position : Bottom/Back Side