SDI fabsurplus.com is pleased to announce the availability of the following listed used Applied Materials Reflexion - Dielectric Dielectric CMP - CMP Equipment.
Please click on the "Send More Details" button at the end of the Reflexion - Dielectric description, if you'd like to get more details, photos and specifications of this Dielectric CMP - CMP Equipment, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Applied Materials Reflexion - Dielectric Dielectric CMP - CMP Equipment is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Model:||Reflexion - Dielectric|
|Description:||Dielectric CMP - CMP Equipment|
|Sales Condition:||as is where is|
Current Condition: Used, In Warehouse - Crated - - Base System Reflexion: 4 head, 3 platen polishing system.�Dry in Dry out. Polisher Skins: Clear P1, P2, P3, and P4: Non-4910 compliant. Gap Wash: 120 degree nozzles(Fan type) Load Cup Wafer Exchanger: Machined SST rings Nova 3090 Ready: None Monitor 1 Location: Cart Monitor 2 Location: None Light Tower: Factory Interface and Polisher Sides - Software LK Software: Reflexion VMIC rp3B6.5_31 Factory Interface: fB4.20_14 beta ISRM / RTPC: N/A RTPC: N/A Interface "A": N/A Nova 3090: N/A Wafer to Wafer iAPC: N/A Within Wafer iAPC: N/A - Factory Interface WIP Delivery Type: OHT/manual delivery FOUP: N/A OHT Light Curtain: NA E84 PI O Sensors and Cables: UPPER E84 SENSORS & CABLES E99 Carrier ID: N/A Docked E99 Reading Capability: N/A Docking Flange Shield: N/A Frame Configuration: N/A Load Ports: TDK TAS300 Load Port Operator Interface: STANDARD Load Port Types: ENHANCED 25 WAFER FOUP Operator Access Switch: Yes - Platen 1 Platen Type: STANDARD (<= 200 RPM) Endpoint: N/A Endpoint: N/A High Pressure Rinse Flow Meter: 0-5 L/min Rinse Arms: High Pressure/Flow Flow Meter: 50-500 ml/min Temperature Control: Platen Cooling Water - Platen 2 Platen Type: STANDARD (<= 200 RPM) Endpoint: N/A Endpoint: N/A High Pressure Rinse Flow Meter: 0-5 L/min Rinse Arms: High Pressure/Flow Flow Meter: 50-500 ml/min Temperature Control: Platen Cooling Water - Platen 3 Platen Type: STANDARD (<= 200 RPM) Endpoint: NA Endpoint: N/A High Pressure Rinse Flow Meter: 0-5 L/min Rinse Arms: High Pressure/Flow Flow Meter: 50-500 ml/min Temperature Control: Platen Cooling Water - Polisher Polisher Technology: SLURRY AND PAD Polishing Head: 5-Zone Contour CIP Cross Break: N/A Pad Wafer Loss Sensor: DARK PAD SENSOR InterPlaten Clean: NO ISRM Laser Key Switch: Yes Slurry Delivery System: 2 x 6 CLC SDS Head 1 Power Cable: 0150-16277 Head 2 Power Cable: 0150-16278 Head 3 Power Cable: 0150-16279 Head 4 Power Cable: 0150-16280 Head 1 Encoder Cable: 0150-16281 Head 2 Encoder Cable: 0150-16282 Head 3 Encoder Cable: 0150-16283 Head 4 Encoder Cable: 0150-16284 G4+ UPA: MKS G4+ UPA: MKS - Cleaner Meg MEGASONICS: One chem direct feed (FM) Transducer: Yes Chemical 1: 1000 ml/min Chemical 2: N/A - Brush Box 1 Brush LDM Type: One chem direct feed (FM) Chemical 1: 1000 ml/min Chemical 2: N/A Brush Box Level Spacer: N/A Brush Box Shaft: N/A Toe In: N/A Slow drain: N/A - Brush Box 2 Brush LDM Type: One chem direct feed (FM) Chemical 1: 1000 ml/min Chemical 2: N/A Brush Box Level Spacer: N/A Brush Box Shaft: NA Toe In: N/A Slow drain: N/A - Dryer Module Dryer Type: SRD Recovery Module: SRD Output Station Dampner: SRD - Damage/Missing parts list
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