SDI fabsurplus.com is pleased to announce the availability of the following listed used Semitool Raider ECD310 ECD (Electro Chemical Deposition) - Deposition Equipment.
Please click on the "Send More Details" button at the end of the Raider ECD310 description, if you'd like to get more details, photos and specifications of this ECD (Electro Chemical Deposition) - Deposition Equipment, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Semitool Raider ECD310 ECD (Electro Chemical Deposition) - Deposition Equipment is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
| SDI ID: | 103118 |
|---|---|
| Manufacturer: | Semitool |
| Model: | Raider ECD310 |
| Description: | ECD (Electro Chemical Deposition) - Deposition Equipment |
| Version: | 300mm |
| Vintage: | Inquire |
| Quantity: | 1 |
| Sales Condition: | as is where is |
| Lead Time: | Inquire |
| Sales Price: | Inquire |
| Comments: | - Base System Descrition - Ulpa Filtration: 70006-401 - Earthquake: No - Exhaust: 3 Adjustable Exhaust - Drip Pans: 1 - LT Process Robot: 610T0300-01 - Station Control - User Interface: Rear - 650T0030-03, Front: 650T0030-501 - Display: English - Operating system: Embedded XP system, Software version - 2.13.4.24 - USB Ports: 2 USB ports - Intermediate station: None - Metrology unit: 90005-81 - Buffer station: 640T0377-01 - Transfer Robot: 610T0300-01 - Factory Interface Options - Manufactor: Semitool Inc. - FOUP / Cassette - Part Number: Entegris- F300 Auto-pod (01-018675) - Wafer Diameter: Wafer Diameter : 300 � 0.25mm - Wafer Pitch: Half Pitch - Wafer Mapping capability: E84 Parallel I/O Sensors (4012-25), E99 Carrier ID Reader, 3 hermos RF tag readers - Number of FOUP: 3 load ports 640T0147-505 - Chemical Connections - Line-1: Catholyte A 180L - Line-2: Anolyte A 65L - Line-3: N/A - Line-4: N/A - Line-5: H2SO4 - Line-6: H2O2 - Line-7: CDA - Line-8: DI - Line-9: N2 - Line-10: House Vacuum - Line-11: CO2 Fire Suppression - Catholyte A - Monitoring - Photospec probe: 90005-01 - pH probe: 61326-16 - Sampling Port: 429T1635-503 - RTA Probe: 90005-50 - Real Time Analyzer : 1 RTA GoldBox - Drain - Concentrated Copper waste: Concentrated Copper waste - Dilute Copper Waste: Dilute Copper Waste - Acid Waste: Yes - Chamber 1: Rinse dry with bevel etch capability - Lift Automation Assy: 200T0085-03 - Mixing tank: 330T0188-01 - Delivery tank: 330T0190-15 - Bowl: 100T0143-09 - Temp control: Heating/Cooling coils - Dryer: N2 - Chamber 2: Rinse dry with bevel etch capability - Lift Automation Assy: 200T0085-03 - Mixing tank: 330T0188-01 - Delivery tank: 330T0190-15 - Bowl: 100T0143-09 - Temp control: incl in tank assy - Dryer: N2 - Chamber 3 : Electroplating chamber with membrane - Automation assy L/R: 240T0057-01 - Catholyte Tank A: 330T0186-515 - Anolyte Tank A: 330T0243-501 - Temp control: Heating/Cooling coils - Anodes : 14400-90 - Membrane: 111T1388-03 - Filters: 7004-63 - Pump: 70959-31 - Debubbler: 119T1289-03 - Ring rinse nozzle: 341T0043-01 - Wafer rinse nozzle: 341T0043-01 - Power supply : 900C0329-01 - Chamber 4: Electroplating chamber with membrane - Automation assy L/R: 240T0057-01 - Catholyte Tank A: 330T0186-515 - Anolyte Tank A: 330T0243-501 - Temp control: Heating/Cooling coils - Anodes : 14400-90 - Membrane: 111T1388-03 - Filters: 7004-63 - Pump: 70959-31 - Debubbler: 119T1289-03 - Ring rinse nozzle: 341T0043-01 - Wafer rinse nozzle: 341T0043-01 - Power supply : 900C0329-01 - Chamber 5:Electroplating chamber with membrane - Automation assy L/R: 240T0057-01 - Catholyte Tank A: 330T0186-515 - Anolyte Tank A: 330T0243-501 - Temp control: Heating/Cooling coils - Anodes : 14400-90 - Membrane: 111T1388-03 - Filters: 7004-63 - Pump: 70959-31 - Debubbler: 119T1289-03 - Ring rinse nozzle: 341T0043-01 - Wafer rinse nozzle: 341T0043-01 - Power supply : 900C0329-01 - Chamber 6: Electroplating chamber with membrane - Automation assy L/R: 240T0057-01 - Catholyte Tank A: 330T0186-515 - Anolyte Tank A: 330T0243-501 - Temp control: Heating/Cooling coils - Anodes : 14400-90 - Membrane: 111T1388-03 - Filters: 7004-63 - Pump: 70959-31 - Debubbler: 119T1289-03 - Ring rinse nozzle: 341T0043-01 - Wafer rinse nozzle: 341T0043-01 - Power supply : 900C0329-01 - Chamber 7:Electroplating chamber with membrane - Automation assy L/R:240T0057-01 - Catholyte Tank A:330T0186-515 - Anolyte Tank A:330T0243-501 - Temp control:Heating/Cooling coils - Anodes :14400-90 - Membrane:111T1388-03 - Filters:7004-63 - Pump:70959-31 - Debubbler:119T1289-03 - Ring rinse nozzle:341T0043-01 - Wafer rinse nozzle:341T0043-01 - Power supply :900C0329-01 - Chamber 8:Electroplating chamber with membrane - Automation assy L/R:240T0057-01 - Catholyte Tank A:330T0186-515 - Anolyte Tank A:330T0243-501 - Temp control:Heating/Cooling coils - Anodes :14400-90 - Membrane:111T1388-03 - Filters:7004-63 - Pump:70959-31 - Debubbler:119T1289-0 |
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