SDI fabsurplus.com is pleased to announce the availability of the following listed used Semitool Raider ECD310 ECD (Electro Chemical Deposition) - Deposition Equipment.
Please click on the "Get Quote" button at the end of the Raider ECD310 description, if you'd like to get a quotation, photos and specifications of this ECD (Electro Chemical Deposition) - Deposition Equipment, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Semitool Raider ECD310 ECD (Electro Chemical Deposition) - Deposition Equipment is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
| SDI ID: | 103118 |
|---|---|
| Manufacturer: | Semitool |
| Model: | Raider ECD310 |
| Description: | ECD (Electro Chemical Deposition) - Deposition Equipment |
| Version: | 300mm |
| Vintage: | Inquire |
| Quantity: | 1 |
| Sales Condition: | as is where is |
| Lead Time: | Inquire |
| Sales Price: | Inquire |
| Comments: | - Base System Descrition - Ulpa Filtration: 70006-401 - Earthquake: No - Exhaust: 3 Adjustable Exhaust - Drip Pans: 1 - LT Process Robot: 610T0300-01 - Station Control - User Interface: Rear - 650T0030-03, Front: 650T0030-501 - Display: English - Operating system: Embedded XP system, Software version - 2.13.4.24 - USB Ports: 2 USB ports - Intermediate station: None - Metrology unit: 90005-81 - Buffer station: 640T0377-01 - Transfer Robot: 610T0300-01 - Factory Interface Options - Manufactor: Semitool Inc. - FOUP / Cassette - Part Number: Entegris- F300 Auto-pod (01-018675) - Wafer Diameter: Wafer Diameter : 300 � 0.25mm - Wafer Pitch: Half Pitch - Wafer Mapping capability: E84 Parallel I/O Sensors (4012-25), E99 Carrier ID Reader, 3 hermos RF tag readers - Number of FOUP: 3 load ports 640T0147-505 - Chemical Connections - Line-1: Catholyte A 180L - Line-2: Anolyte A 65L - Line-3: N/A - Line-4: N/A - Line-5: H2SO4 - Line-6: H2O2 - Line-7: CDA - Line-8: DI - Line-9: N2 - Line-10: House Vacuum - Line-11: CO2 Fire Suppression - Catholyte A - Monitoring - Photospec probe: 90005-01 - pH probe: 61326-16 - Sampling Port: 429T1635-503 - RTA Probe: 90005-50 - Real Time Analyzer : 1 RTA GoldBox - Drain - Concentrated Copper waste: Concentrated Copper waste - Dilute Copper Waste: Dilute Copper Waste - Acid Waste: Yes - Chamber 1: Rinse dry with bevel etch capability - Lift Automation Assy: 200T0085-03 - Mixing tank: 330T0188-01 - Delivery tank: 330T0190-15 - Bowl: 100T0143-09 - Temp control: Heating/Cooling coils - Dryer: N2 - Chamber 2: Rinse dry with bevel etch capability - Lift Automation Assy: 200T0085-03 - Mixing tank: 330T0188-01 - Delivery tank: 330T0190-15 - Bowl: 100T0143-09 - Temp control: incl in tank assy - Dryer: N2 - Chamber 3 : Electroplating chamber with membrane - Automation assy L/R: 240T0057-01 - Catholyte Tank A: 330T0186-515 - Anolyte Tank A: 330T0243-501 - Temp control: Heating/Cooling coils - Anodes : 14400-90 - Membrane: 111T1388-03 - Filters: 7004-63 - Pump: 70959-31 - Debubbler: 119T1289-03 - Ring rinse nozzle: 341T0043-01 - Wafer rinse nozzle: 341T0043-01 - Power supply : 900C0329-01 - Chamber 4: Electroplating chamber with membrane - Automation assy L/R: 240T0057-01 - Catholyte Tank A: 330T0186-515 - Anolyte Tank A: 330T0243-501 - Temp control: Heating/Cooling coils - Anodes : 14400-90 - Membrane: 111T1388-03 - Filters: 7004-63 - Pump: 70959-31 - Debubbler: 119T1289-03 - Ring rinse nozzle: 341T0043-01 - Wafer rinse nozzle: 341T0043-01 - Power supply : 900C0329-01 - Chamber 5:Electroplating chamber with membrane - Automation assy L/R: 240T0057-01 - Catholyte Tank A: 330T0186-515 - Anolyte Tank A: 330T0243-501 - Temp control: Heating/Cooling coils - Anodes : 14400-90 - Membrane: 111T1388-03 - Filters: 7004-63 - Pump: 70959-31 - Debubbler: 119T1289-03 - Ring rinse nozzle: 341T0043-01 - Wafer rinse nozzle: 341T0043-01 - Power supply : 900C0329-01 - Chamber 6: Electroplating chamber with membrane - Automation assy L/R: 240T0057-01 - Catholyte Tank A: 330T0186-515 - Anolyte Tank A: 330T0243-501 - Temp control: Heating/Cooling coils - Anodes : 14400-90 - Membrane: 111T1388-03 - Filters: 7004-63 - Pump: 70959-31 - Debubbler: 119T1289-03 - Ring rinse nozzle: 341T0043-01 - Wafer rinse nozzle: 341T0043-01 - Power supply : 900C0329-01 - Chamber 7:Electroplating chamber with membrane - Automation assy L/R:240T0057-01 - Catholyte Tank A:330T0186-515 - Anolyte Tank A:330T0243-501 - Temp control:Heating/Cooling coils - Anodes :14400-90 - Membrane:111T1388-03 - Filters:7004-63 - Pump:70959-31 - Debubbler:119T1289-03 - Ring rinse nozzle:341T0043-01 - Wafer rinse nozzle:341T0043-01 - Power supply :900C0329-01 - Chamber 8:Electroplating chamber with membrane - Automation assy L/R:240T0057-01 - Catholyte Tank A:330T0186-515 - Anolyte Tank A:330T0243-501 - Temp control:Heating/Cooling coils - Anodes :14400-90 - Membrane:111T1388-03 - Filters:7004-63 - Pump:70959-31 - Debubbler:119T1289-0 |
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