SDI fabsurplus.com is pleased to announce the availability of the following listed used TDK AFM-1503 Flip Chip Bonder - Bonder.
Please click on the "Get Quote" button at the end of the AFM-1503 description, if you'd like to get a quotation, photos and specifications of this Flip Chip Bonder - Bonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This TDK AFM-1503 Flip Chip Bonder - Bonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||Flip Chip Bonder - Bonder|
|Sales Condition:||as is where is|
Current Condition: In Fab - Disconnected, Decontaminated, Deinstalled - TDK Corporation AFM-1503 Compact Ultrasonic Bonder - Country of Origin: Japan Maximum Wafer Size: 8 Inches Does NOT include computer seen on top of machine Manufacturer Name:�TDK Corporation Year:2014 CE marked:�NO Model: AFM-1503 Type of Media Handler:��WAFER Voltage:200 VOLTS Frequency:50/60 HERTZ Phase:3 Current:30 AMPS Recommended Packaging Form:�CRATE - Dimensions: Standard Overall:63 x 53 x 86 IN - 3527 LBS Metric 1600.20 x 1346.20 x 2184.40 mm - 1599.85 kg
The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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