SDI fabsurplus.com is pleased to announce the availability of the following listed used TDK AFM-1503 Flip Chip Bonder - Bonder.
Please click on the "Send More Details" button at the end of the AFM-1503 description, if you'd like to get more details, photos and specifications of this Flip Chip Bonder - Bonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This TDK AFM-1503 Flip Chip Bonder - Bonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||Flip Chip Bonder - Bonder|
|Sales Condition:||as is where is|
Current Condition: In Fab - Disconnected, Decontaminated, Deinstalled - TDK Corporation AFM-1503 Compact Ultrasonic Bonder - Country of Origin: Japan Maximum Wafer Size: 8 Inches Does NOT include computer seen on top of machine Manufacturer Name:�TDK Corporation Year:2014 7 CE marked:�NO Model: AFM-1503 Type of Media Handler:��WAFER Voltage:200 VOLTS Frequency:50/60 HERTZ Phase:3 Current:30 AMPS Recommended Packaging Form:�CRATE - Dimensions: Standard Overall:63 x 53 x 86 IN - 3527 LBS Metric 1600.20 x 1346.20 x 2184.40 mm - 1599.85 kg
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