Multitest MT2168 Pick and Place handler for Sale

Qty 3 sets available, in working condition.

Configuration:-

Base System
1.1 Available Versions:
• ambient, ambient hot (+155° C)
• up to 8 contact sites
1.2 Available Options (Selection)
• Active Temperature Control (ATC)
• Active Socket Purge (ASP)
• High Contact Force
• Soft Touch
• Double Device Detection
2 Package Style Conversion
2.1 Conversion Kits:
• uses conversion kits for easy package style conversion
2.2 Required Conversion Time:
• 10 to 20 minutes
2.3 Adjustments:
• no adjustments required after package style conversion
3 Packages
3.1 Conversion Kits for:
• QFP, BGA, QFN, SO, TO, LGA, other package styles on request
3.2 Min. and Max. Size of Packages:
• 2x2 to 70x70 mm min. pitch: 0.4 mm (standard set-up) smaller pitches on request
4 Loading/ Unloading
4.1 Loading/Unloading Material and Size:
• all commonly used trays acc. to JEDEC standard CO-012, CO-029 and CO-034, others on request.
4.2 Type of Loader:
• tray stack, separate input/output tray loop
4.3 Loading/Unloading Possible During Operation:
• Yes
5 Contacting
5.1 Plunger Force
• up to 5,000 N
5.2 6 DOF Self Alignment
5.3 Soft Touch (optional)
6 Temperature
6.1 Soak Capacity
• equal to 3 – 4 JEDEC trays
6.2 Dynamic Contact Site Accuracy:
• +/- 2º C
• +/- 1º C with ATC
6.3 Temperature Control Stability (static measurement):
• +/- 0.2º C
7 Bin Categories
7.1
• 6 tray categories (stack or manual)
• software binning categories: 32
8 Docking
8.1 Vertical Docking
8.2 Docking Height:
• 990 mm (Floor to CUH Centre)
8.3 Compatibility:
• all commonly used docking systems and test heads are supported.
9 Performance
9.1 Throughput:
• example x16 mode: 15,000 uph at 3 s test time
9.2 Index Time: (virtual index time for multiple contact sites)
• single mode: 0.700 s
• dual mode: 0.350 s / device
• quad mode: 0.175 s / device
• octal mode: 0.088 s / device