TEL Tokyo Electron ACT 8 Single block DUV photo track with I/F for Nikon EX14, L to R flow for Sale

All tools still power-up in the FAB and will be decommissioned and moved to clean room facility in early SEP.
Please see the details as attached
 
p.s) HDD will be removed by FAB End-user and Software will not be included.
T&H Controller is not included.

1. Maker : TEL/Tokyo Electron Limited
2. Model : Clean Track ACT 8
3. Serial Number :
4. Vintage : 2001
5. Description : Photo Resist Coat and Develop System
6. Configuration
1) Block Diagram (Left to Right Wafer Flow) - See image attached


2) Chemical Cabinet Details
1
2-7 ADH
HMDS
Buffer Tank Tray

2
Solvent
Filter Tray

3
DEV
Filter Tray

4
Solvent
3L Buffer Tank 2ea

5
Solvent
Degas Tray

6
DEV
Degas Tray

7
DEV 3L Buffer
Tank 2ea

3) Detailed Hardware Specification
A. Wafer Size : 200mm, DUV Application, Single Block System
B. Wafer Flow : Left to Right (CSB Unit is in Left side and Interface Station Unit is in Right side)
C. Process Block : 1ea (Single Block System)

D. Block #1
a. TEL Clean Track ACT 8 EC/Equipment Controller Type#2
b. Stage/Indexer : 3 SMIF Integrated CSB/Cassette Stage Block
c. CRA/Cassette Block Robotics Arm : 1ea
d. FFU: Installed

E. Block #2
a.
2-1 Standard Coat Unit
1 4 Standard Photo Resist Dispense Nozzles
2 4 TEL OEM RRC F-T100-2 Photo Resist Pumps
3 1 Solvent Pre-wet RRC/Reduced Resist Coat Nozzle
4 1 Side Rinse Nozzle (Programmable Side Rinse EBR)
5 Dual Back Rinse Nozzles
6 Coat Cup Temperature Synchronized Control System
7 Photo Resist Temperature Control
8 Motor Flange Temperature Control
9 Photo Resist Drain Type : Direct Gravity Drain Type
10 Auto Dummy Dispense System
11 Photo Resist Bottle Quantity :
Resist #1 Resist #2
COT 2-1 1 Bottle
1 Bottle
COT 2-2 1 Bottle
1 Bottle
Resist #3
1 Bottle
1 Bottle
Resist #4
1 Bottle
1 Bottle
b. 2-1 Standard Coat Unit : Same as 2-1 Standard Coat Unit
c. 2-3 Develop Unit
1 1 H Nozzle
2 Develop Temperature Control
3 Motor Flange Temperature Control
4 Drain Type : Direct Gravity Drain Type
5 Top Rinse Nozzle
6 Dual Back Rinse Nozzle
7 Auto Damper
8 Auto Dummy Dispense System
d. 2-4 Develop Unit : Same as 2-3 Develop Unit
e. Plate Units
1 PRA/Process Block Robotics Arm: 1ea
2 ADH/Adhesion Process Station: 1ea
3 HHP/High Temperature Hot Plate Station : 2ea
4 LHP/Low Temperature Hot Plate Station : 6ea
5 CPL/Chilling Plate Process Station : 5ea
6 TRS/Transition Stage Unit : 2ea
7 TCP/Transition Chilling Plate : 1ea
8 PHP/High Precision Hot Plate Process Station : 4ea
9 CWH/Cup Washer Holder Unit : 1ea
Block #3 : Standard Interface Block
a. IRA/Interface Robotics Arm : 1ea
b. Interfaced for NIKON 2205EX14C
c. WEE/Wafer Edge Exposure Process Station :1ea
d. THS/Temporary Holding Stage : 1ea
e. SBU/Stationary Buffer Unit : 2ea
f. TRS/Transition Stage Unit : N/A
g. CPL/Chill Plate Process Station : N/A
h. EIS/Interface Stage Module : 1ea
i. FFU: Installed
G. T&H/Temperature and Humidity Controller : N/A
H. External Chemical Supply System/Cabinet (HMDS, Solvent, DEV Solutions)
a.HMDS Supply System
1 HMDS Chemical Type: 1ea
2 Bulk-Fill CSS/Central Chemical Supply Type with 3 Liter Teflon Buffer Tanks (1)
3 1 Buffer Tank (3 Liter/Tank, Teflon, N2 Bubbling) for 1 ADH Unit
b.Solvent Supply System for 2 Standard Coat Units (2-1, 2-2)
1 Solvent Chemical Type: 1ea
2 Bulk-fill CSS/Central Chemical Supply Type with 3Liter Teflon Buffer Tanks (2)

3 2 Buffer Tanks (3 Liter/Tank, Teflon) to support 2 Standard Coat Units (2-1, 2-2)
c. Developer Supply System for 2 Develop Units (2-3, 2-4)
1 Developer Chemical Type: 1ea
2 Bulk-Fill CSS/Central Chemical Supply Type with 3 Liter Teflon Buffer Tanks (2)
3 2 Buffer Tanks (3 Liter/Tank, Teflon) to support 2 Develop Units (2-3, 2-4)

TEL OEM TCU/Temperature Control Unit : 1ea
(SMC Circulator Pumps and Thermo Controller with 9 Channels)
a. 2 Chilling Channels for 2 Coat Spin Units
b. 2 Chilling Channel for 2 Develop Units
c. 5 Chilling Channel for 5 CPL/Chill Plate Process Station Units
J. Power Transformer AC Cabinet : 208VAC, 3 Phases, 50/60Hz
K. Software Options : Hard Disk Removed
L. Utility connection Position : Bottom/Back Side