Applied Materials P5000 CVD System, 2 Chamber TEOS Oxide CVD for Sale

SDI fabsurplus.com is pleased to announce the availability of the following listed used Applied Materials P5000 CVD System, 2 Chamber TEOS Oxide CVD.
Please click on the "Send More Details" button at the end of the P5000 description, if you'd like to get more details, photos and specifications of this CVD System, 2 Chamber TEOS Oxide CVD, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Applied Materials P5000 CVD System, 2 Chamber TEOS Oxide CVD is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.

Applied Materials P5000 Equipment Details

SDI ID: 3419
Manufacturer: Applied Materials
Model: P5000
Description: CVD System, 2 Chamber TEOS Oxide CVD
Version: 200 MM
Vintage: 01.01.1994
Quantity: 1
Sales Condition: inquire
Lead Time: immediately
Sales Price: Inquire


The objective of the work was centered in two steps:check of the missing parts on the mainframe components:cassette indexer-LLC-wafer transfer chamber,both chambers C and D,major electronic PCBs(looking for their power and signal connecting cables) and the support equipments.

Missing parts:nothing to point out.

Cassette Indexer:check of the rotary actuator,optical sensor,speed control valve,air lines,window crank and turnbuckle,status of the cassette I/O window (plexiglas).

Note:this component of the mainframe has all the items present for its proper operation.

LLC Chamber:control of the wafer storage elevator,control of the physical presence of the centerfinder board,I/O slit valve.

Note:everything is present.

Wafer transfer chamber:from the upper side:check wafer sensor and LED emitter,transfer robot,chambers slit valves and from the bottom:check of the actuactors(particularly look for the presence of air lines close and open,reed switch magnetic,pneumatic cylinder),lower part of the robot(essentially extension and optical sensors,flag,rotation and extension motor,rotation pulley,drive belt,winder gear.

Note:this important component of the system has all the parts in there.

Chamber C and D:all the process chambers have been open.They were in bad conditons due to the fact that they did not undergo the required decontamination process when a tool has been turned off in the manufacturing environment. Hazardous cleaning effort has been performed.All the process kits are present.The susceptor and its assembly status are pretty good but the susceptor would need a further reconditioning process before being able to hold a wafer for process. Dismantle and re-install of the lamp module,the RF matching box.

Note:both process chambers present no defects.

Major electronic subsystems:check of the presence of the pcbs on the system controller and system electronic rack.

Conclusion:the gas panel has been only clean and the gas line well fixed in the gas panel box.At the end,all the P5000 underwent a cleaning process.The tool is ready for being shipped.

Originally configured for TiN but converted to TEOS.
Lines and heaters were added for TDMAT process.
RF Generators ENI
CH B P5000 CVD Universal chamber number 4161B, serial number 35393
CH C P5000 CVD Universal chamber number 4161C, serial number 35593-18
MKS baratrons Model 127AA-001008
TDMAT Schumacher Asolute qty 2
RF Match Phase IV
Gas panel configuration:
-configured for 4 lines per chamber
-Each chamber has the following MFCs configured:-
STEC 4400M He 500 sccm (He)
UNIT UFC 1100A N2 2slm (Ar)
UNIT UFC 1100 N2 300 sccm (NF3)
UNIT UFC 1660 N2 500 sccm N2
Amat gs panel analog board 0100-09115 rev C
Equipment Description: A CVD Applied Materials® wafer equipment with two TiN previously configured chambers for 200mm wafer.
History of the equipment:this tool underwent an upgrade process from TiN to TEOS with subsequent addition of the heated lines,TDMAT controllers and heaters. The equipment has two process chambers installed on it,chamber B and chamber C,although it has been configured for four process chambers.
Decontamination Process consisted in:
chamber cleaning,
gas line pumpdown and conditioning,
gas line pressurizing(N2) and sealing,
pipeline flushing and sealing and vacuum of the process line and its sealing.
Equipment general components and parts:
•AMAT Heat Exchanger
•RF Generator(ENI OEM 12B)
•P5000 Mainframe with two process chambers.
•RF Cable
•Liquid Source
Load Locks main components:
Robot Handler
-Cassette Handler
-Storage Elevator
-Storage Elevator Wafer Orienter
-Elevator Brakes
-Load Lock Particle Reduction Kit
-Load Lock Chamber Bolt Down Lids
-Load Lock Lid Lift
-Wafer Positioning Sensor
-I/O Wafer Sensor.
AMAT Ozonator
-Ozone Monitor
-Liquid Source Delivery Cabinet
-Wafer Cooling System
-Turbo Flow Meter for both chambers
-Endpoint System.
-Thermo Electric Drivers
-Chamber Interconnect PCBs
-ESC Controller Rack/Electronics
Mainframe type:208VAC 3 PHASE 50 HZ
AC Box type: 0010-09142 100A 480 VAC
High Purity Gas Panel.
0150-09027 25 ft
0150-09145 50 ft
0150-09109 50 ft
0150-09108 50 ft
0150-09107 50 ft
0150-09106 50 ft
0150-70036 55 ft qty 2
0150-75041A 40 ft
Dryvac pump cables
CH 1 aux and gas 20ft
CH 3 aux and gas 25 ft
Edwards T1 pump controller panel for 3 process chambers and L/L.

Attachments: 51 Files
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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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