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SDI ID: 51845
Model: DX-III
Version: 150mm
Quantity: 1
Sales Condition: as is where is
Lead Time:
Application: Scribing, PRODUCT BENEFITS: Zero kerf loss allows higher die density on the wafer, Increased production rates, Chip free results, Less residual stress, No toxic water discharge, No D.I. water costs, More real estate; narrower street widths, PRODUCT FEATURES: Automatic: Capable of complete, automatic scribing and breaking of many substrate materials, Cost effective: System integration allows easy hook-up and transport, Superior yield and improved efficiency, Reduced production time, Environmental: No DI or toxic waste water, Versatile: Fully programmable for all scribing and breaking parameters, including TrueAngle?, Diamond tool positioning, Infinitely programmable with Pentium? powered Windows? interface, Easy: Few operator adjustments are required when changing between wafer types, SPECIFICATIONS: Wafer Size 150mm max, Minimum Wafer Index 5 um with Std. Encoders; 1 um with Optional Hi-Res. Encoders, Break Method: Patented impulse bar, Vision System: Digital Hires BW/Color Camera; 17" Color Monitor; Pattern Recognition System for Auto Alignment, Edge Detection, and Auto Step-Correction, Programmable: Scribe Tool Life, Scribe Angle, Scribe, Approach Speed, Scribe Force, Scribe Speed, Scribe Extension, Break Force, Multiple Die, Size, Fiducial Image Storage, Wafer Type and Profile, Multiple Wafer Profile Storage (Profiles programmable in metric or imperial units), Wafer Mounting: Std: Metal Saw Frames (Max 6" wafers - FF105/DY-NFR-007 and FF108/DY-WFR-001; Max 4" wafers - 6" hoops and 7" hoops), Substrates: GaAs, LiNbO3, Glass, InP, GaP, Silicon, Quartz
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