SDI fabsurplus.com is pleased to announce the availability of the following listed used Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System.
Please click on the "Get Quote" button at the end of the C7103 description, if you'd like to get a quotation, photos and specifications of this PC Controlled IC Back-side Lapping and Wafer Grinding System, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
| SDI ID: | 71907 |
|---|---|
| Manufacturer: | Hamamatsu |
| Model: | C7103 |
| Description: | PC Controlled IC Back-side Lapping and Wafer Grinding System |
| Version: | 200 mm and packages |
| Vintage: | 30.09.2001 |
| Quantity: | 1 |
| Sales Condition: | as is where is |
| Lead Time: | immediately |
| Sales Price: | Inquire |
| Comments: | The C7103 is a computerised IC backside polishing system for use when preparing a |
Get Quote |
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