ESEC 2008HS3Plus BONDER for Sale

SDI fabsurplus.com is pleased to announce the availability of the following listed used ESEC 2008HS3Plus BONDER.
Please click on the "Get Quote" button at the end of the 2008HS3Plus description, if you'd like to get a quotation, photos and specifications of this BONDER, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This ESEC 2008HS3Plus BONDER is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.

ESEC 2008HS3Plus Equipment Details

SDI ID: 86241
Manufacturer: ESEC
Model: 2008HS3Plus
Description: BONDER
Version: 200 mm
Vintage: 31.05.2007
Quantity: 5
Sales Condition: as is where is
Lead Time: immediately
Sales Price (each): Inquire
  1. The system full detail configuration as follows:


    • OS : Window2000

    • SCS version : 21.0 and 22.2

    • WH software version : WH800.3 and WH800.10

    • PP software version : PP800.3 and PP800.8

    • IN software version : IN800.3 and IN800.8


  1. These ESEC 2008 HS3Plus support Lead Frame size width 70 mm


  1. What is Wafer size tool for 8" or 12"?


    • On machine support wafer size 8” (Have conversation kits support wafer size 12”wafer frame)


  1. Do it has wafer wafer mapping on the system?


    • Yes


  1. What is wafer mapping software type installed & version?


    • See attach


  1. All systems are integrated with wafer conversion package included


  1. There is no availability option of lead frame marking on unit


  1. All Systems are inclusive with Die bond link module


  1. Is it for PPD, FPD, PPS?


  1. Can support parallel pre-Bond IQC & rejection Paf Detection?


  1. Can support Post Bond IQC


  1. Input wafer handler & Dual Input handler?


    • Yes

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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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