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EVG 540 Automatic Wafer Bonder for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used EVG 540 Automatic Wafer Bonder.
Please click on the "Send More Details" button at the end of the 540 description, if you'd like to get more details, photos and specifications of this Automatic Wafer Bonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This EVG 540 Automatic Wafer Bonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


EVG 540 Equipment Details

SDI ID: 90373
Manufacturer: EVG
Model: 540
Description: Automatic Wafer Bonder
Version: 150 mm to 300 mm
Vintage: 01.06.2005
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: 265,000 USD
Comments:

-Currently de-installed, and located in an inspection warehouse.

-See attached photos for details.

-EVG 540 Wafer Bonder for all wafer bonding processes, such as anodic, thermo-compression and silicon direct bonding.
Main Features:-
Fully-automated processing with automated loading and unloading bond chucks
Single chamber production bonder
Automatic handling of up to four bond chucks
Modular bond chamber design
Active bottom side cooling
Max. contact force: 3.5 kN
Power supply for anodic bonding: 0-2.000V / 50mA
Loading chamber: 3-axis robot
Process (recipe) compatible with GEMINI
Customer / application: pilot-line +manufacturing, high volume manufacturing

-The equipment is currently set up for 300 mm wafer use.
• One universal bond chamber with automated opening/closing
• Control unit and PC
• Cooling station
• Send/Receive Station for bond chuck to be processed
• Fully automated bond chuck handling with motorized linear axis
Bond Module
• Fully compatible with GEMINI Production Bonder
• Aluminium bond chamber, O-ring sealed
• Universal cover with top side heater and pressure insert
• Up to 550 °C
• High voltage fed through
• Atmospheric capabilities down to 1x10 -5 mbar (7.5 x 10 -6 Torr). The pumps are 2 x Varian Turbo-V301 pumps.
• Pump time < 3min from 1000 to 1 x 10 -3 mbar • Purge time < 10sec from high vacuum to 1 bar
• Separate connections for evacuation, purge and vent
Electronics and Pneumatics:
• High voltage power supply 0 - 2000 V / 0 - 50 mA
• Independent temperature controllers for top and bottom side
• Electronic pressure regulator for controlled contact force
• Valve controller for vacuum equipment with analog input for fullrange gauge
Exterior Dimensions : 36 in x 56 in x 80 in (h)
Weight:     1284  lb

An EVG Smartview Wafer to Wafer Bond Aligner is also available for purchase separately.

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The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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