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KLA-TENCOR 2132 Wafer Inspection - 200mm silicon for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used KLA-TENCOR 2132 Wafer Inspection - 200mm silicon. This KLA-TENCOR 2132 Wafer Inspection - 200mm silicon is available for immediate sale. Please click on the "Send More Details" button if you'd like to get more details, photos and specifications of this Wafer Inspection - 200mm silicon and your request will be forwarded to our customer representatives automatically. Crating, refurbishment and delivery can be quoted on request.


KLA-TENCOR 2132 Equipment Details

SDI ID: 90662
Manufacturer: KLA-TENCOR
Model: 2132
Description: Wafer Inspection - 200mm silicon
Version: 200 mm
Vintage: 01.04.1996
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price (each): Inquire
Comments:

-Was still installed and operational until August 2018.
-Currently de-installed and warehoused.
-Can be inspected by appointment in the USA.
-This equipment can either be sold "as is", or in working condition, operational at extra cost.

Facilities: 120v 3 phase 25A per phase

General Description (May include features not included with this specific sales item.).
-------------------
The KLA 2132 is capable of inspecting at the following rates:
Sensitivity: 0.62 ------- Speed: 5 sec/cm2
Sensitivity: 0.39 ------- Speed: 15 sec/cm2
Sensitivity: 0.25 ------- Speed: 30 sec/cm2
and includes the following:-
wafer inspection module for 4, 5, 6 or 8 inch wafer size image Computer Minimum inspectable feature size of 0.25 um in die to die mode Defect Clustering and Auto Review Sampling Blanket Wafer Inspection Automated Inspection Automatic Focusing SECS-GEM KLA SAT segmented auto threshold imaging processing hardware and software using mean and range functions on the KLA 2132 and KLA 2135 platforms that allows. improved inspection performance on noisy surfaces like CMP and metal reduced inspection setup time enhanced threshold algorithm for all process levels KLA ADC Automated Defect classification Package Includes image processing and analysis software for inspection station .The system has internally two computers: one is the system computer, which controls the machine in run mode; and the other is the ADC computer, which controls the machine in automatic review mode (you can also do manual review mode). The ADC Manager is not included. Fully automatic, non-contact wafer alignment Uses image recognition without special test site requirement Accomodates SEMI standard 25 wafer cassettes Uses pick-and-place, random access wafer handling system Image hard copy Remote image access XV Tencor 6000 loader
SUBSTRATES: For silicon wafers conforming to SEMI standard M1.1
Wafer diameter (mm): 100 100 125 150 200
Wafer thickness (?m): 525 625 625 675 725
SENSITIVITY AND INSPECTION SPEED:
Die to Die Mode
Sensitivity (um) Speed (sec/cm2)
0.60 05
0.50 1.5
0.40 15

Cell to Cell Mode
Sensitivity (um) Speed (sec/cm2)
0.30 05
0.25 30
0.20 15
Full performance specifications are available on request

Categories:
Attachments: 4 Files
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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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