EVG 805EZD Debonder for Sale

SDI fabsurplus.com is pleased to announce the availability of the following listed used EVG 805EZD Debonder.
Please click on the "Get Quote" button at the end of the 805EZD description, if you'd like to get a quotation, photos and specifications of this Debonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This EVG 805EZD Debonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.

EVG 805EZD Equipment Details

SDI ID: 90667
Manufacturer: EVG
Model: 805EZD
Description: Debonder
Version: 200 mm / 300 mm
Vintage: 31.05.2013
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire

-still installed

-see attached photos for details

Edge Zone Debonding (EZD®) is a mechanical separation method at room temperature, ideally suited for devices with lower thermal budget. EVG's proprietary EZD module provides optimum support for even the thinnest substrates while introducing minimum stress to the device wafer during debonding. Mechanical debonding is a non-complex and reliable technology that can be implemented for applications with challenging requirements in 3D IC and Advanced Packaging.


The EZD module can accommodate substrates up to 300 mm in diameter, and is available either as a semi-automated standalone tool (EVG805 EZD) for R&D purposes or as an integrated module in a fully automated EVG850 platform for high-volume manufacturing (HVM) applications. During debonding the device wafer is fully supported throughout the whole process while the carrier is removed. Minimum force is applied to the carrier without additional mechanical or chemical initiation which allows repeated recycling for maximum periods. This is crucial for any HVM application, as repeated recycling is a key contributor to achieving the lowest cost of ownership.

EZD is suitable for several different applications. Multiple adhesives and adhesive systems are available, and with the EVG850's flexible layout it is possible to optimize the throughput for the dedicated process flow. There is no need to insert a blade or other mechanical object to initiate debonding, so there is no risk of scratching the device wafer surface.

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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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