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Applied Materials Endura Extensa PVD Barrier Film Deposition System: FAB Interface Module for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used Applied Materials Endura Extensa PVD Barrier Film Deposition System: FAB Interface Module.
Please click on the "Get Quote" button at the end of the Endura Extensa description, if you'd like to get a quotation, photos and specifications of this PVD Barrier Film Deposition System: FAB Interface Module, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Applied Materials Endura Extensa PVD Barrier Film Deposition System: FAB Interface Module is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


Applied Materials Endura Extensa Equipment Details

SDI ID: 92048
Manufacturer: Applied Materials
Model: Endura Extensa
Description: PVD Barrier Film Deposition System: FAB Interface Module
Version: 300 mm
Vintage: Inquire
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

-FAB Interface module for Endura Estensa PVD system for immediate sale: parts only
-Located in USA
-Deinstalled, warehoused
-In OEM original packaging materials
-Can be inspected by appointment
-See attached photos for details

The Applied Materials Endura Extensa product was introduced in July 2008 for depositing critical barrier films for Copper interconnects in sub 55 nm processes.
It features deposition of Ti and TiN to enable diffusion barrier films with benchmark step coverage and less than 3% film thickness variation accross the wafer whilst allowing low defectivity (Less than 10 particles geater than 0.12 um) and a low cost of ownership.
The extensa Ti/TiN deposition chamber has a dual-magnet PVD source with flux-shaping lateral electromagnets to give a better field shape which also leads to a 30% imporvement in the life of the target.
The Extensa platform can be used to replace Tantalum with Ti based layers and allows deposition of Cu-Al and Cu-W barrier layers during the integration of copper with Al layers and Tungsten vias.
Other possible applications for this platform are : Contact liner for memory devices, and metal gate, silicide cap barrier for logic manufacturers.

Parts included:-

 

Part No.
0010-07172 REV 002
IATAMT019511597 or 0195-11597
IATAMT019511517
AMAT 0190-08896B
AMAT 0190-18418
AMAT 0190-33634
AMAT 0242-48049
AMAT 0190-34492W
AMAT 0190-A1261W
AMT 0242-47746
AMAT 0195-00228
AMAT 0190-A4201W
AMAT 0041-38660
AMAT 0190-B0150W
ITU Drive Assembly
AMAT 0190-18419
AMAT 0190-22925B
AMAT 0195-08340
AMAT 3920-00645
AMAT 0190-34492
AMAT 0240-64376
AMAT 0010-76467B
AMAT HX-150W High Temp Recirculating Chiller
Automatic High-frequency Impedance Matching Unit
AMAT Heat Exchanger CONB-16095
SMC Thermo Chiller INR-496-003D
Edwards Water Cooled Motor D112M

 

 


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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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