STS (SPTS) Multiplex ICP Deep Reactive Ion Etcher for Sale

SDI fabsurplus.com is pleased to announce the availability of the following listed used STS (SPTS) Multiplex ICP Deep Reactive Ion Etcher.
Please click on the "Send More Details" button at the end of the Multiplex ICP description, if you'd like to get more details, photos and specifications of this Deep Reactive Ion Etcher, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This STS (SPTS) Multiplex ICP Deep Reactive Ion Etcher is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.

STS (SPTS) Multiplex ICP Equipment Details

SDI ID: 95631
Manufacturer: STS (SPTS)
Model: Multiplex ICP
Description: Deep Reactive Ion Etcher
Version: 150mm
Vintage: 01.12.2000
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: 130,000 USD

Full working order at shutdown.

Chamber configuration:    

 Deep Silicon Etch Process Package  

 SOI Trench Etch Package  

 Gasline:    Valve‐MFC‐Filter (VCR) (Qty. 4x units included)  

 ICP 240BF Source (ASE‐exc.PSU and Matching Unit)  

 Electrode Temperature Control (+5 to +40deg C)   Multiplex ICP SC160M Process Chamber (MESC)  

 Mechanical Wafer Clamp Electrode(tripod) with He Backside Cooling  

 300/30W (13.56MHz) RF Supply and Matching Unit  

 1kW (13.56MHz) RF Supply and Matching Unit  

 Chamber parts for 1x150mm substrate (Mechanical Clamping)  

 Turbo Pump: Leybold MAG900CT   Dry Pump:    Edwards iQDP80 (M)  

 Process Chamber: ICP V2 unified ISO250 (inc. insulation spacers) SR with 160 adaptor  

 Chamber Externals: ICP V2 (inc. Edwards D146 penning gauge + MKS 51A & SMC ZSE6B  

pressure switches + Edwards 655 100mT cap. man. gauge + NW16 bypass pump line)  

 Chamber Insulation Jackets: None  

 Lower Electrode: ICP WTC Tripod Lift  

 Electrode Temp Monitoring: None  

 Substrate Clamping/ Platen: ICP WTC Tripod 150mm   Lower RF Enclosure/ MU:ICP V2 WTC H/F + L/F (SOI)  

 Electrode Lift Stops:   96mm (136mm electrode spacing)  

 HBC Assy: ICP V2 (inc.Tylan CDLD 10T cap. man gauge + Tylan FC2901 50sccm He cal. MFC)  

 HBC Delay Unit:     None  

 Upper Electrode:   With aperture mounting  

 Upper Electrode Aperture:     None   Upper Electrode Source:   ICP Balun  

 Upper RF Enclosure/ MU:Balun 1kW (high cool)  

 Chamber Lid:     ICP Heated  

 Electrode Switching:     None

 RF Generators:    Upper:    ENI ACG10B 1kW (13.56MHz) +Lower:    ENI ACG3B 300/30W  

(13.56MHz) +LF5+pulse gen+switchgunit  

 APC/ Hivac Valve:   VAT Series 65 DN160 + PM7  

 Turbo Pump:Leybold MAG900CT (DN200 ‐ inc.Norcal NW40 foreline valve + MKS 750B 10T  

cap. man. + purge PS305259)  

 Bypass Pumping:   Automatic NW16  

 Heated Foreline:   ICP  

 Pumping Line:   NW40 (1m)  

 Backing Pump:   Edwards iQDP80(M)  

 Pump Acoustic Panels:None  

 Backing Pump Interface:Edwards iQDP80 (STSCR287)  

 Pump N2 Trip Level (l/min):See gas schematics  

 Lower Electrode Cooling:   Affinity RWA‐012J  

 Chamber Heating:Watlow 4x 700W cartridge heaters  

 Upper Electrode Cooling:   None  

 Platen Chiller Temp Monitoring:   Proteus flowswitch only  

 Chiller Transformers:   None  

 Stacking Frame:   None  

 Gasbox:   Mini ‐ 4 line (inc. 1x PFC1 module)  

 Solid Source:   None  

 Vapour/ Liquid Delivery Unit:   None  

 Low Temp. Gas Interlock:   None  

 End Point Detector:   None  

 End Point Detector Options:   None  

 Chamber Lid Lift:   None  

 Chamber Cover Panels:   ICP V2  

 Process Computer:   None   Computer Monitor:None  

 E‐Rack Electronics Modules:   ICP V2 (HCL1 +DIW +HCU3 +HCU5 +VAC3Y +2x AMC1  


 Warning Labels:   English  

 Substrate Lift Type:   Tripod  

 Platen Type:   Domed  

 Electrode Shield:   Alumina, Round  

 Clamp Type:   Standard WTC  


Gas Name

MFC Size





Seal Type

Line Type

Gas Type































G12, G15 & G16 gaslines have Inlet Valve  

G15 & G16 gaslines have Bypass & Purge line including Purge Valve  

G16 & G18 gaslines have NOValve Hardware Interlock  

(S) denoted 'Switched' Gasline, (SP) denotes 'Spare' Gasline  


Loadlock Configuration:  

 Carousel Vacuum Loadlock  

 Carousel Loadlock Parts for 2x 150mm Substrates  

 Rotary Pump: Edwards E2M40F (Fomblin)  

 Loadlock:    MMPlexMkIV ‐ R/H (standard ‐ inc. SMC XLD softpump valve + Edwards APG  

pirani gauge + MKS 51A pressure switch)  

 Loadlock Cable Kit:   

 Loadlock Spatula:   MMPlex carousel variable 2x 150mm  

 Loadlock Pallet: None  

 Loadlock Adaptor:   MMPlex Carousel (inc. wafer sense laser & SMAC actuator)  

 MACs Robot:      None   MACs Spatula:    None   Wafer Aligner:    None  

 Rectangular Gate Valve:   VAT DN46 x 236  

 Thermal Break Kit:   For VAT DN46 x 236 gate valve  

 Compressed Air Backup:  V2 high pressure vent   Turbo Pump:   None (Norcal NW40 angle valve)  

 Backing Pump:Edwards E2M40F 208V 60Hz  

 Backing Pump Interface:   Edwards E2M40F (ST8111‐035)  

 Pump N2 Trip Level (l/min): See Gas Schematics  

 N2 Bleed:   Yes  

 Pumping Line:   ISO40 (1m)  


Attachments: 10 Files
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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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