SDI fabsurplus.com is pleased to announce the availability of the following listed used TEL Tokyo Electron TBDB Synapse Series coater + bonder + debonder.
Please click on the "Send More Details" button at the end of the TBDB Synapse Series description, if you'd like to get more details, photos and specifications of this coater + bonder + debonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This TEL Tokyo Electron TBDB Synapse Series coater + bonder + debonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
| SDI ID: | 96075 |
|---|---|
| Manufacturer: | TEL Tokyo Electron |
| Model: | TBDB Synapse Series |
| Description: | coater + bonder + debonder |
| Version: | 300 mm |
| Vintage: | Inquire |
| Quantity: | 1 |
| Sales Condition: | inquire |
| Lead Time: | Inquire |
| Sales Price: | Inquire |
| Comments: | Fully-automated Tokyo Electron Synapse-series adhesive coater, bonder and room temperature, mechanical debonder. TEL Synapse V: coater TEL Synapse V: bonder TEL Synapse Z: debonder TEL Synapse V: Coater Specifications Adhesive dispense lines Two pump dispense lines and one N2 pressure dispense line Adhesive delivery container type 1L bottle for pressure tank, 1L NOWPak for pump dispense lines High viscosity adhesive line 0.3MPa (for up to 10,000cp) Low viscosity adhesive line 0.2MPa (for up to 100cp) Solvent cabinet 20L pressure tanks: 2 containers switchable online 2 containers backup Bevel rinse Two nozzles Back rinse Two nozzles EBR 0.7-35mm +/- 0.3mm Spin speed 0-4000rpm +/- 1rpm Dispense head control Programmable position including dynamic dispense Atmosphere hotplate Up to 350C +/- 2% N2 hotplate Up to 350C +/- 2% Cold plate 2 cooling plates control by process cooling water Drain tank 10L drain tank for nozzle bath 10L drain tank for spin cup
TEL Synapse V: Bonder Pressure 49kN Temperature 200°C Vacuum level 30Pa Alignment X,Y: +/- 30µm; Theta +/- 0.02°
TEL Synapse Z: Debonder Type Mechanical peel Debond initiation Physical initiation Force Up to ~50N Wet clean station 3 solvent dispense lines (2 center, 1 edge) Solvent cabinet 20L pressure tanks: 2 containers switchable online (center) 2 containers backup 1 container edge dispense Spin speed 0-1500rpm +/- 1rpm Drain tank 10L Wafer loading 300mm metal tape frames (7 wafers max) Carrier unloading 300mm FOUP
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| Attachments: | 6 Files |
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