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SUSS Microtec MA6BA6 Mask Aligner (Remanufactured) for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used SUSS Microtec MA6BA6 Mask Aligner (Remanufactured).
Please click on the "Send More Details" button at the end of the MA6BA6 description, if you'd like to get more details, photos and specifications of this Mask Aligner (Remanufactured), and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This SUSS Microtec MA6BA6 Mask Aligner (Remanufactured) is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


SUSS Microtec MA6BA6 Equipment Details

SDI ID: 96674
Manufacturer: SUSS Microtec
Model: MA6BA6
Description: Mask Aligner (Remanufactured)
Version: 150mm
Vintage: Inquire
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: 230,000 USD
Comments:

1 SUSS MA/BA6 MASK AND BOND ALIGNER /WD-33/MAN Remanufactured  

basic system prepared for  

    manual alignment stage with: 

    +   automatic wedge compensation system 

      in contact or without contact between 

      mask and wafer (with reference balls), 

      alignment gap programmable from  

      1 to 1000 micron, resolution 1 micron 

    +   movement range mask aligner mode: 

      X +/-10.0mm, Y +/-5.0mm, Theta +/-5° 

    +   movement range bond aligner mode: 

      X +/-3.0mm, Y +/-3.0mm, Theta +/-3° 

    +   Safety labelling in English 

    basic equipment consisting of: 

    +   machine base with mechanical, 

      pneumatic and electrical equipment 

      230V/50/60Hz  

    +   adapter system for mask holders   

      for use in combination with 

      mask holders for masks up to 7" x 7" max. 

    +   TSA microscope stage with 

      motorized X-Y-manipulator  

      and manual rotation for microscope 

    +   with integrated microscope tilt for 

      exposure and to create access for 

      mask loading 

    +   prepared for movable exposure unit 

      (necessary for BA function) 

    +   manual loading and unloading of 

      wafers or substrates 

    +   microprocessor control with LCD display 

    +   for wafers 2" up to 150 mm dia. 

      or substrates 2" x 2" up to 6" x 6" 

      for lithography applications 

    +   for wafers 3" up to 150 mm dia. 

      for bond applications 

    +   operator manual on CD 

    +   prepared for BSA microscopes with working  

      distance 33mm 

    +   among other things to be ordered separately: 

       +    manual alignment stage system dependent on 

        necessary BSA microscope objective separation 

       +    TSA and/or BSA microscopes 

       +    exposure unit, lamp and optics 

       +    mask holders and chucks 

       +    bond adapter frame 

       +    transport fixture and bond align chucks 

       +    other accessories are available 

2 ALIGNMENT STAGE MA/BA6-8/WD-33/MAN 

    +   X-Y-THETA alignment stage with  

      high precision micrometer screws 

      for manual alignment 

    +   WEC Head for BSA microscope objective 

      separation in X direction from 

      15mm to 100mm 

    +   motorized Z axis 

3 BOTTOM SIDE ALIGNMENT SYSTEM MA6/BA6/BA8 AA=33 FOR EISS 

    +   two special video microscopes 

      with selectable magnification 

      128X/410X (refers to 17" monitor) 

    +   motorized stages  

    +   separation in X: 15mm ...100mm  

    +   travel in Y: - 20mm to + 50mm 

    +   motorized focus 6mm  

    +   two 1/2" CCD video cameras 

4 ENHANCED IMAGE STORAGE SYSTEM (EISS) FOR MA8/BA6 

    image storage and fine focus controller 

    for simultaneous focussed images of 

    mask and wafer for easy and precise  

    alignment with large object magnification  

    or large alignment gaps  

    +   PC with image and fine focus control 

    +   for M306/8, DVM6/8 and BSA  

    +   17" TFT flat screen 

    +   integrated trackball 

    +   S-VGA resolution 1280x1024 

    +   contrast integration function for pure 

      contrast images 

    +   electronic brightness, contrast and 

      magnification adjustment 

    +   adjustment of brightness ratio 

      stored/live image 

5 SUSS M306 SPLITFIELD MICROSCOPE CPL. FOR MA6/BA6 

    Ergonomic microscope for precise top side alignment of wafers, substrates, chips

and pieces

    +   Base module, trinotube, 2 eyepieces 10X 

    +   Manual fine focus drive 600 micron 

    +   Incident illumination, fibre optics 

    +   Microscope adapter, rotation, focus drive 

 

    +   Objective separation in X from 27mm to 160mm  

6 MICROSCOPE ILLUMINATION MA6/BA6 TSA LLQ   

7 SINGLE OBJECTIVE MPLFLN 2.5X/0.08 

    +   Working distance 10.7mm 

    +   Polarizer is removed from original objective G160052 

    +   Not suitable for ring illumination G201177 

8 SINGLE OBJECTIVE UMPL FL 5X/0.15 

    +   Working distance 20mm 

9 SINGLE OBJECTIVE UMPL FL 10X/0.30 

    Caution: not to be used with SCIL substrate conformal imprint lithography 

    +   Working distance 10.1mm 

    +   For masks up to 3.05mm thickness 

    +   not to be used in combination with LCMM maskholder  

10 SET OF TURRETS FOR 3 OBJECTIVES DVM6/8 

    +   Consisting of two 3X turrets 

11 EXPOSURE UNIT MA6/BA6/350W 

    +   Optics housing and mirror housing with ellipsoidal mirror and surface mirror 

    +   For wafer/substrate sizes up to 150mm diameter / 6“ x 6“ 

    +   For exposure lamps up to 500W 

    +   Prepared for use in combination with exposure optics optimized for high uni-

formity and high intensity for various wavelengths and applications:

    +   Range of wavelengths: 250nm to 400nm 

    +   With components for optimized diffraction reduction for high resolution prox-

imity or contact printing

    +   For large gap exposure or thick resists 

12 LAMP ADAPTER LH350/HBO350W/S  

13 LAMP POWER SUPPLY UNIT CIC1200 FOR LH350  

    +   Constant light intensity mode  

    +   Constant power mode  

    +   For the DC lamps 200W, 350W/S, 500W, XE 500W  

    +   Operation of additional lamp with a current of up to 35A possible (has to be

specified and agreed upon)

    +   Easy operation due to microprocessor control  

    +   Simultaneous digital display of light intensity and lamp power 

    +   Integrated connector for UV-probe for easy calibration  

    +   Dual channel mode for 2-channel light-sensors with various wave-lengths 

    +   Interlock for machine and lamp protection  

    +   For input voltages of 230V +/- 10%, 50/60Hz  

    +   Power consumption: maximum 2300 VA  

    +   Single pulse ignition ensures gentle operation, provides easy lamp start and

increases lamp durability

14 HG LAMP 350W /Osram    

15 MO EXPOSURE OPTICS UV400/W-150/LH350/MA6/MA100e  

    +   Ellipsoidal mirror UV400HP 

    +   Cold light mirror UV400 

    +   Condenser Lens 

    +   Front lens, dia. 180mm 

    +   Surface mirror 

    +   MO Integrator #1 and #2 for highest uniformity and source decoupling 

    +   Fourier lens 

    +   Set of illumination aperture plates to define the illumination angular spectrum

16 SUSS 2-CHANNEL LIGHT-SENSOR 365/405NM 

    +   For lamp power control 

    +   Installed inside mirror house 

17 CHUCK MA6/BA6/VAC/W-150 

    +   For wafer dia. 150mm 

    +   For soft and hard contact as well as vacuum contact exposures in combination

with mask holder for contact and proximity processes

    +   For proximity contact exposures in combination with mask holder for proxim-

ity processes

    +   With prealigner pins for flat length 57.5mm 

18 MASK HOLDER MA6/BA6/BL/CONT/M-7/W-150 

    +   Bottom loading 

    +   Contact wedge-error-compensation 

    +   For masks 7“x7“ 

    +   Exposure opening for wafers dia. 150mm 

    +   With stop pins 

    +   With additional mechanical clamping 

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Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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