SDI fabsurplus.com is pleased to announce the availability of the following listed used Dynatex DX III Wafer Scriber/Breaker.
Please click on the "Send More Details" button at the end of the DX III description, if you'd like to get more details, photos and specifications of this Wafer Scriber/Breaker, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Dynatex DX III Wafer Scriber/Breaker is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Sales Condition:||as is where is|
For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System Internal PC Control System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM
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Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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