SDI fabsurplus.com is pleased to announce the availability of the following listed used Dynatex DX III Wafer Scriber/Breaker.
Please click on the "Get Quote" button at the end of the DX III description, if you'd like to get a quotation, photos and specifications of this Wafer Scriber/Breaker, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Dynatex DX III Wafer Scriber/Breaker is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Sales Condition:||as is where is|
For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System Internal PC Control System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM
The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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