Please find below a list of Used , surplus and pre-owned CMP Equipment (Chemical mechanical planarization equipment) for sale by fabsurplus.com -Click on any list item to see further data. Chemical mechanical polishing, or CMP, also known as chemical mechanical planarization, is a process of smoothing and thinning surfaces with a mixture of chemical and mechanical forces. We can consider it to be a hybrid of chemical etching and abrasive polishing. It is used in the semiconductor industry to polish and thin semiconductor wafers as part of the IC manufacturing process.
| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 110708 | Accretech | PG200RM | Fully Automatic Wafer Back Grinder | 200 MM | 01.06.2004 | 1 | as is where is | immediately |
| 96534 | Applied Materials | Mirra Mesa | CMP system | 200 mm | 1 | inquire | ||
| 96537 | Applied Materials | Mirra Ontrak | Poly/STI CMP | 200 mm | 31.05.1999 | 1 | inquire | |
| 96538 | Applied Materials | Mirra Ontrak | Poly/STI CMP | 200 mm | 31.05.1999 | 1 | inquire | |
| 100868 | Applied Materials | Mirra Mesa | CMP System | 200 mm | 1 | inquire | 5 months | |
| 100873 | Applied Materials | Mirra Mesa Integrated | Oxide/STI CMP | 200 mm | 31.05.1999 | 1 | inquire | |
| 105881 | Applied Materials | Reflexion GT | CMP system with integrated cleaner | 300 MM | 01.05.2011 | 1 | as is where is | immediately |
| 106065 | Applied Materials | Mirra ® 3400 | Stand-Alone CMP System | 200 mm | 01.06.2001 | 1 | as is all rebuilt | immediately |
| 106203 | Applied Materials | Mirra 3400 Stand-Alone | Oxide/STI CMP | 200 mm | 01.06.1998 | 1 | inquire | |
| 106980 | Applied Materials | Reflexion | CMP system | 300 mm | 1 | inquire | immediately | |
| 106981 | Applied Materials | Reflexion LK | CMP system | 300 mm | 1 | inquire | immediately | |
| 106982 | Applied Materials | Mesa | CMP cleaning system | 300 mm | 1 | inquire | immediately | |
| 106983 | Applied Materials | Desica | CMP Cleaning system | 300 mm | 1 | inquire | immediately | |
| 106984 | Applied Materials | Kawasaki 4.0 | Fab Interface Module | 300 mm | 1 | inquire | immediately | |
| 109063 | Applied Materials | Mirra Mesa | Oxide CMP system, with SMIF | 200 mm | 1 | inquire | 1 month | |
| 109153 | Applied Materials | Reflexion - Dielectric | Dielectric CMP | 300mm | 1 | as is where is | ||
| 109154 | Applied Materials | Reflexion LK Oxide | Dielectric CMP | 300mm | 1 | as is where is | ||
| 110767 | Applied Materials | Mirra 3400 Ontrak | CMP Polisher with Cleaning System | 200 mm | 01.05.1997 | 1 | as is where is | immediately |
| 91136 | Daitron | CVP-320 | Wafer Edge Grinder | 300 mm | 01.11.2008 | 1 | as is where is | immediately |
| 108155 | DISCO | DFG-82IF/8 | Rotary Surface Grinder | 200 mm | 01.06.1992 | 1 | as is where is | |
| 108398 | Disco | DFS8910 | Surface Planarization | 300 mm | 1 | as is where is | ||
| 110721 | Disco | DFG 850 | Wafer Back Grinder | 200 MM | 01.06.2000 | 1 | as is where is | immediately |
| 110722 | Disco | DFG 850 | Wafer Back Grinder | 200 MM | 01.06.2004 | 1 | as is where is | immediately |
| 110800 | Disco | DGP8761 with DFM2800 | Wafer Back Grinder with Wafer Taper | 300 mm | 01.06.2012 | 1 | inquire | immediately |
| 98460 | Ebara | Frex 300 | W CMP | 300mm | 1 | as is where is | immediately | |
| 98461 | Ebara | Frex 300 | STI CMP ( missing front end robot and load port) | 300mm | 1 | as is where is | ||
| 108408 | Ebara | FREX300 Tungsten | Tungsten CMP | 300 mm | 1 | as is where is | ||
| 108409 | Ebara | FREX300S Poly/STI | Poly/STI CMP | 300 mm | 1 | as is where is | ||
| 108410 | Ebara | FREX300S Tungsten | Tungsten CMP | 300 mm | 9 | as is where is | ||
| 108411 | Ebara | FREX300S2 Tungsten | Tungsten CMP | 300 mm | 2 | as is where is | ||
| 109172 | Ebara | FREX300 Tungsten | Tungsten CMP | 300mm | 1 | as is where is | ||
| 109173 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm | 1 | as is where is | ||
| 109174 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm | 1 | as is where is | ||
| 110757 | Ebara | FREX 300 | Tungsten CMP system | 300 mm | 2 | as is where is | immediately | |
| 110796 | Ebara | FREX 300 | Tungsten CMP tool | 300 mm | 01.05.2005 | 2 | as is where is | immediately |
| 71907 | Hamamatsu | C7103 | PC Controlled IC Back-side Lapping and Wafer Grinding System | 200 mm and packages | 30.09.2001 | 1 | as is where is | immediately |
| 98465 | IPEC | 472 | CMP Polishing system | 150 MM / 200 mm | 3 | as is all rebuilt | immediately | |
| 98466 | IPEC | 472 | CMP | 150 mm | 2 | as is where is | immediately | |
| 109184 | IPEC | 372M | Multi-Process CMP | 200mm | 1 | as is where is | ||
| 109235 | IPEC | 472 | Multi-Process CMP | 100mm | 1 | as is where is | ||
| 106820 | Lam Research Ontrak | Synergy | Post CMP cleaner with HEPA mini-environment | 200 mm | 2 | as is where is | immediately | |
| 108846 | MICROAUTOMATION | M-1100 | Wafer Dicing Saw, for up to 6" Wafers | 150 MM | 1 | inquire | ||
| 108191 | NOVELLUS | 676 | CMP System Polisher | 200 mm | 01.06.1997 | 1 | as is where is | |
| 108490 | Strasbaugh | 6DS-SP | Multi-Process CMP | 200 MM | 1 | as is where is | ||
| 109605 | Strasbaugh | 7AA-SP | Grinder | 1 | inquire | |||
| 109606 | Strasbaugh | 6EC | CMP Wafer Polisher | 1 | inquire |