Please find below a list of Used , surplus and pre-owned CMP Equipment (Chemical mechanical planarization equipment) for sale by fabsurplus.com -Click on any list item to see further data. Chemical mechanical polishing, or CMP, also known as chemical mechanical planarization, is a process of smoothing and thinning surfaces with a mixture of chemical and mechanical forces. We can consider it to be a hybrid of chemical etching and abrasive polishing. It is used in the semiconductor industry to polish and thin semiconductor wafers as part of the IC manufacturing process.
SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
---|---|---|---|---|---|---|---|---|---|
111447 | Accretech / TSK | HRG-200X | Fully Automatic Grinder | 200 mm | 01.12.2022 | 1 | as is where is | immediately | |
96534 | Applied Materials | Mirra Mesa | CMP system | 200 mm | 1 | inquire | |||
96537 | Applied Materials | Mirra Ontrak | Poly/STI CMP | 200 mm | 01.05.1999 | 1 | inquire | ||
96538 | Applied Materials | Mirra Ontrak | Poly/STI CMP | 200 mm | 31.05.1999 | 1 | inquire | ||
100868 | Applied Materials | Mirra Mesa | CMP System | 200 mm | 1 | inquire | 5 months | ||
100873 | Applied Materials | Mirra Mesa Integrated | Oxide/STI CMP | 200 mm | 01.05.1999 | 1 | inquire | ||
105881 | Applied Materials | Reflexion GT | CMP system with integrated cleaner | 300 MM | 01.05.2011 | 1 | as is where is | immediately | |
106065 | Applied Materials | Mirra ® 3400 | Stand-Alone CMP System | 200 mm | 01.06.2001 | 1 | as is all rebuilt | immediately | |
106203 | Applied Materials | Mirra 3400 Stand-Alone | Oxide/STI CMP | 200 mm | 01.06.1998 | 1 | inquire | ||
106980 | Applied Materials | Reflexion | CMP system | 300 mm | 1 | inquire | immediately | ||
106981 | Applied Materials | Reflexion LK | CMP system | 300 mm | 1 | inquire | immediately | ||
106982 | Applied Materials | Mesa | CMP cleaning system | 300 mm | 1 | inquire | immediately | ||
106983 | Applied Materials | Desica | CMP Cleaning system | 300 mm | 1 | inquire | immediately | ||
106984 | Applied Materials | Kawasaki 4.0 | Fab Interface Module | 300 mm | 1 | inquire | immediately | ||
109063 | Applied Materials | Mirra Mesa | Oxide CMP system, with SMIF | 200 mm | 1 | inquire | 1 month | ||
109154 | Applied Materials | Reflexion LK Oxide | Dielectric CMP | 300mm | 1 | as is where is | |||
110767 | Applied Materials | Mirra 3400 Ontrak | CMP Polisher with Cleaning System | 200 mm | 01.05.1997 | 1 | as is where is | immediately | |
111636 | Applied Materials | Mirra Integra Dielectric | Dielectric CMP | 150mm | 1 | as is where is | |||
111651 | Applied Materials | Reflexion LK | Multi-Process CMP | 300mm | 1 | as is where is | |||
111652 | Applied Materials | Reflexion LK Oxide | Dielectric CMP | 300mm | 5 | as is where is | |||
112116 | Applied Materials | Reflexion | CMP Oxide | 300 mm | 01.06.2006 | 1 | as is where is | ||
112117 | Applied Materials | Reflexion LK | CMP Oxide | 300 mm | 01.06.2008 | 1 | as is where is | ||
112118 | Applied Materials | Reflexion LK | CMP W | 300 mm | 01.06.2012 | 1 | as is where is | ||
113203 | Applied Materials | Reflexion LK Oxide | Low K Oxide CMP | 300 mm | 1 | as is where is | |||
113204 | Applied Materials | Reflexion LK Oxide | Low K Oxide CMP | 300 mm | 1 | as is where is | |||
111438 | Buehler | Beta Series Twin Variable Speed Grinder-Polisher | GRINDER-POLISHER | 01.04.2008 | 1 | as is where is | immediately | ||
111443 | Buehler | 49-5102-230 | Twin Variable Speed Grinder Polisher with Vector Power Head | 01.06.2001 | 1 | as is where is | immediately | ||
111682 | BUEHLER | EcoMet 3000 | Grinder Polisher | 200mm | 1 | as is where is | |||
111683 | BUEHLER | HandiMet 2 | Grinder Polisher | 1 | as is where is | ||||
111684 | BUEHLER | MetaServe 2000 | Grinder Polisher | N/A | 1 | as is where is | |||
91136 | Daitron | CVP-320 | Wafer Edge Grinder | 300 mm | 01.11.2008 | 1 | as is where is | immediately | |
108155 | DISCO | DFG-82IF/8 | Rotary Surface Grinder | 200 mm | 01.06.1992 | 1 | as is where is | ||
108398 | Disco | DFS8910 | Surface Planarization | 300 mm | 1 | as is where is | |||
110800 | Disco | DGP8761 with DFM2800 | Wafer Back Grinder with Wafer Taper | 300 mm | 01.06.2012 | 1 | inquire | immediately | |
98460 | Ebara | Frex 300 | Tungsten CMP tool | 300 mm | 1 | as is where is | immediately | ||
98461 | Ebara | Frex 300 | STI CMP ( missing front end robot and load port) | 300 mm | 1 | as is where is | immediately | ||
108409 | Ebara | FREX300S Poly/STI | Poly/STI CMP | 300 mm | 1 | as is where is | |||
110757 | Ebara | FREX 300 | Tungsten CMP system | 300 mm | 2 | as is where is | immediately | ||
110796 | Ebara | FREX 300 | Tungsten CMP tool | 300 mm | 01.05.2005 | 2 | as is where is | immediately | |
111596 | Ebara | EPO 222 | Oxide CMP | 200 mm | 01.02.1999 | 1 | as is where is | immediately | |
111726 | Ebara | FREX300S Dielectric | Dielectric CMP | 300mm | 1 | as is where is | |||
111727 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm | 1 | as is where is | |||
111728 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm | 1 | as is where is | |||
111729 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm | 1 | as is where is | |||
112173 | EBARA | EPO-2228 | CMP Oxide | 200 mm | 01.06.1999 | 1 | as is where is | ||
112174 | EBARA | EPO-223 | CMP W | 200 mm | 01.06.1997 | 1 | as is where is | ||
112175 | EBARA | F-REX300 | CMP W | 300 mm | 01.06.2010 | 1 | as is where is | ||
112176 | EBARA | F-REX300S2 | CMP W | 300 mm | 01.06.2009 | 1 | as is where is | ||
113214 | Ebara | FREX300X | Tungsten CMP | 300 mm | 01.05.2014 | 1 | as is where is | immediately | |
71907 | Hamamatsu | C7103 | PC Controlled IC Back-side Lapping and Wafer Grinding System | 200 mm and packages | 01.09.2001 | 1 | as is where is | immediately | |
98465 | IPEC | 472 | CMP Polishing system | 150 MM / 200 mm | 3 | as is where is | immediately | ||
98466 | IPEC | 472 | CMP | 150 mm | 2 | as is where is | immediately | ||
109184 | IPEC | 372M | Multi-Process CMP | 200mm | 1 | as is where is | |||
106820 | Lam Research Ontrak | Synergy | Post CMP cleaner with HEPA mini-environment | 200 mm | 1 | as is where is | immediately | ||
111584 | Lam Research Ontrak | Synergy | Post CMP cleaner with HEPA mini-environment | 200 mm | 1 | as is where is | immediately | ||
108846 | MICROAUTOMATION | M-1100 | Wafer Dicing Saw, for up to 6" Wafers | 150 MM | 1 | inquire | |||
108191 | NOVELLUS | 676 | CMP System Polisher | 200 mm | 01.06.1997 | 1 | as is where is | ||
108490 | Strasbaugh | 6DS-SP | Multi-Process CMP | 200 MM | 1 | as is where is | |||
109605 | Strasbaugh | 7AA-SP | Grinder | 01.08.2004 | 1 | as is where is | immediately | ||
109606 | Strasbaugh | 6EC | CMP Wafer Polisher | 1 | inquire | ||||
111884 | Strasbaugh | 6DS-SP | Multi-Process CMP | 200mm | 12 | as is where is |