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Second hand, used and surplus CMP Chemical Mechanical Planarization Equipment for sale by fabsurplus.com

Please find below a list of Used , surplus and pre-owned CMP Equipment (Chemical mechanical planarization equipment) for sale by fabsurplus.com -Click on any list item to see further data. Chemical mechanical polishing, or CMP, also known as chemical mechanical planarization, is a process of smoothing and thinning surfaces with a mixture of chemical and mechanical forces. We can consider it to be a hybrid of chemical etching and abrasive polishing. It is used in the semiconductor industry to polish and thin semiconductor wafers as part of the IC manufacturing process.


SDI ID Manufacturer Model Description Version Vintage Q. ty Sales Conditions Lead Time
110708 Accretech PG200RM Fully Automatic Wafer Back Grinder 200 MM 01.06.2004 1 as is where is immediately
96534 Applied Materials Mirra Mesa CMP system 200 mm 1 inquire
96537 Applied Materials Mirra Ontrak Poly/STI CMP 200 mm 31.05.1999 1 inquire
96538 Applied Materials Mirra Ontrak Poly/STI CMP 200 mm 31.05.1999 1 inquire
100868 Applied Materials Mirra Mesa CMP System 200 mm 1 inquire 5 months
100873 Applied Materials Mirra Mesa Integrated Oxide/STI CMP 200 mm 31.05.1999 1 inquire
105881 Applied Materials Reflexion GT CMP system with integrated cleaner 300 MM 01.05.2011 1 as is where is immediately
106065 Applied Materials Mirra ® 3400 Stand-Alone CMP System 200 mm 01.06.2001 1 as is all rebuilt immediately
106203 Applied Materials Mirra 3400 Stand-Alone Oxide/STI CMP 200 mm 01.06.1998 1 inquire
106980 Applied Materials Reflexion CMP system 300 mm 1 inquire immediately
106981 Applied Materials Reflexion LK CMP system 300 mm 1 inquire immediately
106982 Applied Materials Mesa CMP cleaning system 300 mm 1 inquire immediately
106983 Applied Materials Desica CMP Cleaning system 300 mm 1 inquire immediately
106984 Applied Materials Kawasaki 4.0 Fab Interface Module 300 mm 1 inquire immediately
109063 Applied Materials Mirra Mesa Oxide CMP system, with SMIF 200 mm 1 inquire 1 month
109153 Applied Materials Reflexion - Dielectric Dielectric CMP 300mm 1 as is where is
109154 Applied Materials Reflexion LK Oxide Dielectric CMP 300mm 1 as is where is
110767 Applied Materials Mirra 3400 Ontrak CMP Polisher with Cleaning System 200 mm 01.05.1997 1 as is where is immediately
108644 Buehler Ecomet 6 Variable speed benchtop grinder 150 mm/200 mm 01.06.2006 1 as is where is immediately
91136 Daitron CVP-320 Wafer Edge Grinder 300 mm 01.11.2008 1 as is where is immediately
108155 DISCO DFG-82IF/8 Rotary Surface Grinder 200 mm 01.06.1992 1 as is where is
108398 Disco DFS8910 Surface Planarization 300 mm 1 as is where is
109171 DISCO DGP8760/DFM2700 Wafer Backside Grinder 300mm 1 as is where is
110721 Disco DFG 850 Wafer Back Grinder 200 MM 01.06.2000 1 as is where is immediately
110722 Disco DFG 850 Wafer Back Grinder 200 MM 01.06.2004 1 as is where is immediately
98460 Ebara Frex 300 W CMP 300mm 1 as is where is immediately
98461 Ebara Frex 300 STI CMP ( missing front end robot and load port) 300mm 1 as is where is
108408 Ebara FREX300 Tungsten Tungsten CMP 300 mm 1 as is where is
108409 Ebara FREX300S Poly/STI Poly/STI CMP 300 mm 1 as is where is
108410 Ebara FREX300S Tungsten Tungsten CMP 300 mm 9 as is where is
108411 Ebara FREX300S2 Tungsten Tungsten CMP 300 mm 2 as is where is
109172 Ebara FREX300 Tungsten Tungsten CMP 300mm 1 as is where is
109173 Ebara FREX300S Tungsten Tungsten CMP 300mm 1 as is where is
109174 Ebara FREX300S Tungsten Tungsten CMP 300mm 1 as is where is
110757 Ebara FREX 300 Tungsten CMP system 300 mm 2 as is where is immediately
71907 Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System 200 mm and packages 30.09.2001 1 as is where is immediately
98465 IPEC 472 CMP Polishing system 150 MM / 200 mm 3 as is all rebuilt immediately
98466 IPEC 472 CMP 150 mm 2 as is where is immediately
109184 IPEC 372M Multi-Process CMP 200mm 1 as is where is
109235 IPEC 472 Multi-Process CMP 100mm 1 as is where is
106820 Lam Research Ontrak Synergy Post CMP cleaner with HEPA mini-environment 200 mm 2 as is where is immediately
108846 MICROAUTOMATION M-1100 Wafer Dicing Saw, for up to 6" Wafers 150 MM 1 inquire
108191 NOVELLUS 676 CMP System Polisher 200 mm 01.06.1997 1 as is where is
108490 Strasbaugh 6DS-SP Multi-Process CMP 200 MM 1 as is where is
109605 Strasbaugh 7AA-SP Grinder 1 inquire
109606 Strasbaugh 6EC CMP Wafer Polisher 1 inquire


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