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SDI ID Manufacturer Model Description Version Vintage Q. ty Sales Conditions Lead Time
84557 AP CIS-FTV4 Autotester 1 as is where is
84558 AP CIS-FTV4 Autotester 1 as is where is
84559 AP CIS-FTV4 Autotester 1 as is where is
84560 AP CIS-FTV4 Autotester 1 as is where is
84561 AP CIS-FTV4 Autotester 1 as is where is
84562 AP CIS-FTV4 Autotester 1 as is where is
84563 AP CIS-FTV4 Autotester 1 as is where is
84564 Artograph 255-940 Lightpad A940 lightbox 1 as is where is
84780 ASM SIPLACE D4 chip shooter / pick and place wafer size 150 mm 2 as is all rebuilt immediately
93875 ASM BP 2000 Automatic Ball Placement Assembly 01.06.2009 1 as is where is immediately
95272 BESI Datacon 8810 FC Flip Chip Bonder ASSEMBLY 01.06.2007 1 as is where is
84565 Bibby Scientific SS10 Overhead Stirrer 1 as is where is
84566 Binder KBF115 Constant Climate Chamber 1 as is where is
84567 Carbolite CR/130 Curing Oven 1 as is where is
84568 Carbolite CR/130 Curing Oven 1 as is where is
79764 Datacon PPS 2210 Multi-Chip Die Bonder Assembly 01.06.1999 1 as is where is immediately
84569 ESI 5330 Laser Drill 1 as is where is
84570 Eurostat Three Door Drying Cabinet 01.06.2007 1 as is where is
84571 Eurostat Three Door Drying Cabinet 1 as is where is
84572 EVG 40 Alignment mesurement system 01.06.2008 1 as is where is
90373 EVG 540 Automatic Wafer Bonder 150 mm to 300 mm 01.06.2005 1 as is where is immediately
90666 EVG 805 Debonder 200 mm 01.06.2010 1 as is where is immediately
90667 EVG 805EZD Debonder 200 mm / 300 mm 01.06.2013 1 as is where is immediately
94382 EVG 820 Dry Film Lamination System Min 200 MM max 300 MM 01.06.2007 1 as is where is
94383 EVG 820 Dry Film Lamination System Min 200 MM max 300 MM 01.06.2007 1 as is where is
92858 GSI CSP200 Wafer Level Die Marking System 200 mm 1 as is where is immediately
84576 Hacker VICO520 Pick and Place 01.06.2010 1 as is where is
84577 Hacker VICO520 Pick and Place 01.06.2010 1 as is where is
84578 Hacker VICO520 Pick and Place 01.06.2010 1 as is where is
84579 Jenway 1 as is where is
88433 Karl SUSS CBC200 Wafer Bonder 200 mm 01.06.2013 1 as is where is immediately
91001 Karl SUSS CB200M Wafer Bonder 200 mm 01.06.2012 1 as is where is immediately
84581 Labo-Moderne Hood KL 8692 Hood 01.06.2008 1 as is where is
84582 Labo-Moderne KL 8692 Hood 01.06.2008 1 as is where is
79196 Lintec RAD-3600F/12 Fully Automatic Die Bonding Sheet Laminator 300 mm 01.06.2013 1 as is where is immediately
84583 Mettler Toledo T50 Auto Titrator 1 as is where is
86812 Minami MK-838SV Flux Printer 200 mm 1 as is where is
86813 Minami MK-838SV Flux Printer 200 mm 1 as is where is
86814 Minami MK-BP2000 Solder Ball Mount 200 mm 1 as is where is
86815 Minami MK-BP2000 Solder Ball Mount 200 mm 1 as is where is
84584 Mitutoyo VL-50AS Litematic Digimatic Measuring Unit 1 as is where is
84585 MTM / SDI Wafer spreading machine 01.06.2008 1 as is where is
84586 Muhlbauer Variation 15K W2W Pick and Place 01.06.2011 1 as is where is
84587 Oerlikon TRIVAC 65 Vacuum Pump 01.06.2008 1 as is where is
84588 OPTEK DPL 24 Laminator 01.06.2008 1 as is where is
84589 OPTEK DPL 24 Laminator 01.06.2011 1 as is where is
64071 Panasonic FCB3 NM-SB50A Flip Chip Bonder 150 mm, 200 mm, 300 mm 01.12.2004 1 as is where is immediately
87650 Panasonic FCB3 Flip-Chip Bonder Assembly 01.06.2006 1 as is where is immediately
86817 Shibuya SBM362 Solder Ball Mount 200 mm 1 as is where is
84590 Stangl Wetbench 1 as is where is
84591 Stangl Wetbench 1 as is where is
84592 Stangl Wetbench 1 as is where is
84593 Stangl Wetbench 1 as is where is
84594 Stangl Wetbench 1 as is where is
84595 Stangl Wetbench 1 as is where is
90897 Suss FC300 Flip Chip Bonder 300mm 01.06.2011 1 as is where is immediately
84596 SUSS MicroTec Alta Spray Spray coater 01.06.2010 1 as is where is
84597 SUSS MicroTec Alta Spray Spray coater 01.06.2010 1 as is where is
94929 Suss Microtec ABC 200 Wafer bonder 200 mm 1 as is where is
94930 Suss Microtec BA 300 MIT Automated Inspection System 13 in x 14 in capacity 1 as is where is
94931 Suss Microtec PA 300 MIT Semi-automatic wafer probing system 300 mm 1 as is where is
94932 Suss Microtec XBC 300 Automatic wafer bonding system 300 mm 1 as is where is
84598 TESSERA Clam Shell 01.06.2000 1 as is where is


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