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SDI ID Manufacturer Model Description Version Vintage Q. ty Sales Conditions Lead Time
84780 ASM SIPLACE D4 chip shooter / pick and place wafer size 150 mm 2 as is all rebuilt immediately
93875 ASM BP 2000 Automatic Ball Placement Assembly 01.06.2009 1 as is where is immediately
90373 EVG 540 Automatic Wafer Bonder 150 mm to 300 mm 01.06.2005 1 as is where is immediately
90666 EVG 805 Debonder 200 mm 01.06.2010 1 as is where is immediately
90667 EVG 805EZD Debonder 200 mm / 300 mm 01.06.2013 1 as is where is immediately
94382 EVG 820 Dry Film Lamination System Min 200 MM max 300 MM 01.06.2007 1 as is where is
94383 EVG 820 Dry Film Lamination System Min 200 MM max 300 MM 01.06.2007 1 as is where is
92858 GSI CSP200 Wafer Level Die Marking System 200 mm 1 as is where is immediately
88433 Karl SUSS CBC200 Wafer Bonder 200 mm 01.06.2013 1 as is where is immediately
91001 Karl SUSS CB200M Wafer Bonder 200 mm 01.06.2012 1 as is where is immediately
79196 Lintec RAD-3600F/12 Fully Automatic Die Bonding Sheet Laminator 300 mm 01.06.2013 1 as is where is immediately
96397 NGK Megcon PRC II-2000ACD Antistatic System For DI water facilities 01.06.2013 1 as is where is immediately
96601 NTS NBM-SE3-4 Wafer Bonding Machine Up to 24.8 cm diamater 01.06.2011 1 as is where is immediately
64071 Panasonic FCB3 NM-SB50A Flip Chip Bonder 150 mm, 200 mm, 300 mm 01.12.2004 1 as is where is immediately
87650 Panasonic FCB3 Flip-Chip Bonder Assembly 01.06.2006 1 as is where is immediately
90897 Suss FC300 Flip Chip Bonder 300mm 01.06.2011 1 as is where is immediately
96908 TDK AFM-1503 Flip Chip Bonder ASSEMBLY 01.06.2014 1 as is where is
96909 TDK AFM-1503 Flip Chip Bonder ASSEMBLY 01.06.2005 1 as is where is
96910 TDK AFM-1503 Flip Chip Bonder ASSEMBLY 01.06.2005 1 as is where is
96911 TDK AFM-1503 Flip Chip Bonder ASSEMBLY 01.06.2005 1 as is where is
96912 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is
96913 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is
96914 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is
96915 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is
96916 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is
96917 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is
96918 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is
96919 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is
96920 TDK AFM-1505 Flip Chip Bonder ASSEMBLY 01.06.2017 1 as is where is


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