| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 93875 | ASM | BP 2000 | Automatic Ball Placement | Assembly | 01.06.2009 | 1 | as is where is | immediately |
| 90373 | EVG | 540 | Automatic Wafer Bonder | 150 mm to 300 mm | 01.06.2005 | 1 | as is where is | immediately |
| 90666 | EVG | 805 | Debonder | 200 mm | 01.06.2010 | 1 | as is where is | immediately |
| 90667 | EVG | 805EZD | Debonder | 200 mm / 300 mm | 01.06.2013 | 1 | as is where is | immediately |
| 94383 | EVG | 820 | Dry Film Lamination System | Min 200 MM max 300 MM | 01.06.2007 | 1 | as is where is | immediately |
| 97451 | EVG | 820 | Dry Film Lamination System | 01.06.2010 | 1 | as is where is | immediately | |
| 100055 | EVG | 850TB L-200/150 | Production Bonding system | 150 mm-200 mm | 01.06.2001 | 1 | as is where is | immediately |
| 92858 | GSI | CSP200 | Wafer Level Die Marking System | 200 mm | 1 | as is where is | immediately | |
| 88433 | Karl SUSS | CBC200 | Wafer Bonder | 200 mm | 01.06.2013 | 1 | as is where is | immediately |
| 91001 | Karl SUSS | CB200M | Wafer Bonder | 200 mm | 01.06.2012 | 1 | as is where is | immediately |
| 96397 | NGK | Megcon PRC II-2000ACD | Antistatic System For DI water | facilities | 01.06.2013 | 1 | as is where is | immediately |
| 96601 | NTS | NBM-SE3-4 | Wafer Bonding Machine | Up to 24.8 cm diamater | 01.06.2011 | 1 | as is where is | immediately |
| 64071 | Panasonic | FCB3 NM-SB50A | Flip Chip Bonder | 150 mm, 200 mm, 300 mm | 01.12.2004 | 1 | as is where is | immediately |
| 87650 | Panasonic | FCB3 | Flip-Chip Bonder | Assembly | 01.06.2006 | 1 | as is where is | immediately |
| 98368 | TAZMO | WSS12101M | BONDER | 300 mm | 1 | inquire |