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SDI ID Manufacturer Model Description Version Vintage Q. ty Sales Conditions Lead Time
93875 ASM BP 2000 Automatic Ball Placement Assembly 01.06.2009 1 as is where is immediately
90373 EVG 540 Automatic Wafer Bonder 150 mm to 300 mm 01.06.2005 1 as is where is immediately
90666 EVG 805 Debonder 200 mm 01.06.2010 1 as is where is immediately
90667 EVG 805EZD Debonder 200 mm / 300 mm 01.06.2013 1 as is where is immediately
94383 EVG 820 Dry Film Lamination System Min 200 MM max 300 MM 01.06.2007 1 as is where is immediately
97451 EVG 820 Dry Film Lamination System 01.06.2010 1 as is where is immediately
100055 EVG 850TB L-200/150 Production Bonding system 150 mm-200 mm 01.06.2001 1 as is where is immediately
92858 GSI CSP200 Wafer Level Die Marking System 200 mm 1 as is where is immediately
88433 Karl SUSS CBC200 Wafer Bonder 200 mm 01.06.2013 1 as is where is immediately
91001 Karl SUSS CB200M Wafer Bonder 200 mm 01.06.2012 1 as is where is immediately
96397 NGK Megcon PRC II-2000ACD Antistatic System For DI water facilities 01.06.2013 1 as is where is immediately
96601 NTS NBM-SE3-4 Wafer Bonding Machine Up to 24.8 cm diamater 01.06.2011 1 as is where is immediately
64071 Panasonic FCB3 NM-SB50A Flip Chip Bonder 150 mm, 200 mm, 300 mm 01.12.2004 1 as is where is immediately
87650 Panasonic FCB3 Flip-Chip Bonder Assembly 01.06.2006 1 as is where is immediately
98368 TAZMO WSS12101M BONDER 300 mm 1 inquire


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