| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 93875 | ASM | BP 2000 | Automatic Ball Placement | Assembly | 31.05.2009 | 1 | as is where is | immediately |
| 106446 | DELTA | CUSTOM | Homemade Hotplate with transfer arm | 150 mm/200 mm | 1 | as is where is | immediately | |
| 106467 | EO Technic | CSM-2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 01.06.2002 | 1 | as is where is | immediately |
| 106468 | EO TECHNICS | CSM2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 01.06.2011 | 1 | as is where is | immediately |
| 106469 | EO Technics | CSM2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 1 | as is where is | immediately | |
| 106470 | EO TECHNICS | CSM2000 | CHIP SCALE LASER MARKER | 200 mm | 01.06.2005 | 1 | as is where is | immediately |
| 90667 | EVG | 805EZD | Debonder | 200 mm / 300 mm | 31.05.2013 | 1 | as is where is | immediately |
| 101819 | EVG | 820 | Mold Carrier Lamination System | 200mm | 1 | inquire | ||
| 103000 | EVG | EV640 | Wafer to Wafer Bond Aligner | 1 | as is where is | |||
| 103001 | EVG | Smartview | Wafer to Wafer Bond Aligner | 300 mm | 31.05.2005 | 1 | as is where is | |
| 106091 | EVG | Gemini | Fully automated wafer bonding system | 200 mm | 01.06.2017 | 1 | as is where is | immediately |
| 106092 | EVG | 820 | Dry wafer lamination system | 200 mm | 01.06.2007 | 1 | as is where is | immediately |
| 106158 | EVG | 850 TB | Temporary Bond Aligner | 150 mm | 01.06.2001 | 1 | as is where is | immediately |
| 88433 | Karl SUSS | CBC200 | Wafer Bonder | 200 mm | 31.05.2013 | 1 | as is where is | immediately |
| 91001 | Karl SUSS | CB200M | Wafer Bonder | 200 mm | 31.05.2012 | 1 | as is where is | immediately |
| 103167 | Logitech | 1WBT5 r | Wafer Substrate Bonder | 150 mm | 1 | inquire | ||
| 103168 | Logitech | 1WBS1 | Wafer Substrate Bonder | 100 mm | 1 | inquire | ||
| 96397 | NGK | Megcon PRC II-2000ACD | Antistatic System For DI water | facilities | 31.05.2013 | 1 | as is where is | immediately |
| 64071 | Panasonic | FCB3 NM-SB50A | Flip Chip Bonder | 150 mm, 200 mm, 300 mm | 01.12.2004 | 1 | as is where is | immediately |
| 87650 | Panasonic | FCB3 | Flip-Chip Bonder | Assembly | 31.05.2006 | 1 | as is where is | immediately |
| 103635 | Toray | SP-500w | Bump Height Measurement | 300 mm | 1 | as is where is | ||
| 106557 | Ultron | UH108 | Ultron Tabletop Laminator | 150 mm/200 mm | 01.06.2005 | 1 | as is where is | immediately |
| 106558 | Ultron | UH108 | Ultron Tabletop Laminator | N/A | 1 | as is where is | immediately | |
| 106559 | Ultron | UHI08-12 | Ultron Tabletop Laminator | 200 mm / 300 MM | 1 | as is where is | immediately | |
| 106560 | V-Tek | TM-330 | TM-330 | 150 mm/200 mm | 1 | as is where is | ||
| 106561 | V-Tek | TM-50 | DSD REWORK HEAT SEAL | 1 | as is where is | |||
| 106562 | V-Tek | Versacount II | Versacount Tape & Reel Counter | N/A | 1 | as is where is | ||
| 106563 | Veeco Wyko | NT3300 | 3D Bump Height (Veeco) | 150 mm/200 mm | 1 | as is where is | immediately |