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SDI ID Manufacturer Model Description Version Vintage Q. ty Sales Conditions Lead Time
93875 ASM BP 2000 Automatic Ball Placement Assembly 01.06.2009 1 as is where is immediately
90667 EVG 805EZD Debonder 200 mm / 300 mm 01.06.2013 1 as is where is immediately
94383 EVG 820 Dry Film Lamination System Min 200 MM max 300 MM 01.06.2007 1 as is where is immediately
100055 EVG 850TB L-200/150 Production Bonding system 150 mm-200 mm 01.06.2001 1 as is where is immediately
101819 EVG 820 Mold Carrier Lamination System 200mm 1 inquire
103000 EVG EV640 Wafer to Wafer Bond Aligner 1 as is where is
103001 EVG Smartview Wafer to Wafer Bond Aligner 300 mm 01.06.2005 1 as is where is
92858 GSI CSP200 Wafer Level Die Marking System 200 mm 1 as is where is immediately
88433 Karl SUSS CBC200 Wafer Bonder 200 mm 01.06.2013 1 as is where is immediately
91001 Karl SUSS CB200M Wafer Bonder 200 mm 01.06.2012 1 as is where is immediately
103167 Logitech 1WBT5 r Wafer Substrate Bonder 150 mm 1 inquire
103168 Logitech 1WBS1 Wafer Substrate Bonder 100 mm 1 inquire
96397 NGK Megcon PRC II-2000ACD Antistatic System For DI water facilities 01.06.2013 1 as is where is immediately
64071 Panasonic FCB3 NM-SB50A Flip Chip Bonder 150 mm, 200 mm, 300 mm 01.12.2004 1 as is where is immediately
87650 Panasonic FCB3 Flip-Chip Bonder Assembly 01.06.2006 1 as is where is immediately
103368 TORAY FC-1200 SEMI Automatic Flip Chip Bonder Assembly 1 as is where is immediately


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