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| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 106039 | 6 inch | Complete | MEMS Production Facility for Sale | 4 inch and 6 inch | 01.06.2005 | 1 | as is where is | immediately |
| 108727 | ALPHASEM | Swissline 9006 (Spares) | Automatic Epoxy Die Bonder, Parts Tool Only | 200 mm | 01.04.1993 | 1 | as is where is | immediately |
| 106884 | ASM | AS899 (Spare Parts) | Spare Parts for Pick and Place Die Bonder | Spares | 01.06.2009 | 51 | as is where is | immediately |
| 108264 | ASM | Siplace CA4 | High volume automatic flip-chip bonder | 200 mm | 01.06.2014 | 1 | as is where is | |
| 109030 | ASM | AD810 | Automatic Die Attach Tool | Assembly | 01.09.2017 | 1 | as is where is | immediately |
| 110720 | Datacon | 2200 apm | MultiChip Die Bonder | 300 MM | 01.06.2007 | 1 | as is where is | immediately |
| 110594 | Delvotec | 4500/Siplace A2 | Die Bonder | Assembly | 01.06.2006 | 1 | as is all rebuilt | immediately |
| 110595 | Delvotec | 6200 | Gold Ball Wire Bonder | Assembly | 01.06.2007 | 1 | inquire | immediately |
| 111398 | Delvotec | 4500/Siplace A2 | Die Bonder | Assembly | 01.06.2006 | 1 | as is all rebuilt | immediately |
| 100704 | ESEC | 3018 | Gold Ball Bonder | Assembly | 1 | as is where is | immediately | |
| 100705 | ESEC | 3088 | Gold Ball Bonder | Assembly | 1 | as is where is | immediately | |
| 108749 | ESEC | BU-050-N | Parts Unloader for Micron 2 Automatic Die Attacher | 1 | inquire | |||
| 108750 | ESEC | BL-050-N | Parts Loader for Micron 2 Automatic Die Attacher | 1 | inquire | |||
| 108815 | ESEC | CT-2000 | Automatic Flip Chip Die Attacher, 3ea Available | ASSEMBLY | 1 | inquire | ||
| 110778 | ESEC | 2008-XP | Die Bonder | Assembly | 01.06.2004 | 1 | ||
| 110779 | ESEC | 2006HR | Die Bonder, with Eutectic bonding capability | Assembly | 1 | inquire | immediately | |
| 103140 | EVG | 520 | Manual Wafer Load Substrate Bonder | 150 mm | 01.05.2003 | 1 | as is where is | 2 months |
| 109593 | EVG | Gemini | Automated Production Wafer Bonder | 300 mm | 1 | inquire | ||
| 109610 | EVG | 501 | Wafer Bonder | 200 mm | 1 | inquire | ||
| 109611 | EVG | 520 | Wafer Bonder | 150 mm | 1 | inquire | ||
| 106894 | FINETECH GmbH | Fineplacer 96 | Manual FlipChip Bonder | 1 | as is where is | immediately | ||
| 109282 | Hesse & Knipps | BJ855 and BJ820 | Wedge Bonders , magazine to Magazine | Assembly | 01.06.2019 | 26 | as is where is | immediately |
| 109578 | HITACHI | CM-700H | WIRE BONDER | ASSEMBLY | 01.05.2007 | 20 | inquire | immediately |
| 18866 | K AND S | 98060-0000-001-01 | Manual for Model 8060 automatic wedge bonder | 1 | as is where is | |||
| 106917 | K AND S | SPRINT | HIGHSPEED AUTOMATIC WIRE BONDER | ASSEMBLY | 1 | as is where is | immediately | |
| 109028 | K AND S | 8028 | Automatic Ball Bonder | Assembly | 01.03.2000 | 1 | as is where is | immediately |
| 108756 | K&S | 1471 | Automatic wedge bonder | Assembly | 2 | as is where is | immediately | |
| 108757 | K&S | 1488 Plus | Automatic Gold Ball Bonder | Assembly | 01.05.1997 | 1 | as is where is | immediately |
| 108823 | K&S | 4123 | Manual Wedge Bonder | ASSEMBLY | 1 | inquire | ||
| 108824 | K&S | 4124 | Manual Thermosonic Ball Bonder | ASSEMBLY | 1 | inquire | ||
| 108825 | K&S | 4129 | Manual Deep Access Wedge Bonder | ASSEMBLY | 1 | as is all rebuilt | ||
| 108826 | K&S | 4526 | Manual Wedge Bonder, with Vertical Wire Feed | ASSEMBLY | 1 | inquire | ||
| 108827 | K&S | 6497 | Semi-Automatic Flip Chip Epoxy Die Bonder | ASSEMBLY | 1 | as is all rebuilt | 1 month | |
| 108828 | K&S | 8020 | Automatic Ball Bonder | ASSEMBLY | 1 | inquire | ||
| 108829 | K&S | 8028 | Automatic Ball Bonder | ASSEMBLY | 1 | inquire | ||
| 108830 | K&S | 8060 | Automatic Wedge Bonder | ASSEMBLY | 1 | inquire | ||
| 108832 | K&S | 4524AD | Manual Thermosonic Ball Bonder | ASSEMBLY | 1 | inquire | ||
| 111380 | K&S | Power Fusion HT1 | Wedge Bonder | 1 | as is where is | immediately | ||
| 109029 | MRSI | 505 | Die Attach/ Multichip Module | assembly | 01.01.2001 | 1 | as is where is | immediately |
| 108859 | ORTHODYNE | 20B | Heavy Wire Bonder | ASSEMBLY | 1 | inquire | ||
| 103819 | Palomar | 3500-III | Die Bonder | Assembly | 1 | as is where is | immediately | |
| 108594 | SHINKAWA | COF 300 | Flip Chip Bonder | Assembly | 01.05.2005 | 5 | as is where is | immediately |
| 108595 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.05.2008 | 1 | as is where is | immediately |
| 108596 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.05.2007 | 21 | as is where is | immediately |
| 108597 | SHINKAWA | UTC-3000WE | Wire Bonder | Assembly | 01.05.2012 | 1 | as is where is | immediately |
| 108128 | TOK | 12262 | Wafer bonder | 1 | as is where is | |||
| 109033 | WEST BOND | 10490 | Convertible Bonder , Wedge to Ball | Assembly | 1 | as is where is | immediately | |
| 109034 | WEST BOND | 2416B | Automatic Wedge Bonder | Assembly | 1 | as is where is | immediately | |
| 108783 | WEST-BOND | 7200A | Manual Epoxy Die Bonder | Assembly | 1 | as is all rebuilt | immediately |