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| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 91137 | DISCO | DFG-82IF/8 | Rotary Surface Grinder | 200 mm | 01.06.1992 | 1 | as is where is | immediately |
| 95238 | Disco | DFD6361 | Wafer Saw | 300 mm | 01.06.2006 | 1 | as is where is | immediately |
| 87815 | Disco | DFL 7340 | Saw 8”, power-up | 01.01.2007 | 1 | as is where is | ||
| 95239 | Disco | DFD6361 | Wafer Saw | 300 mm | 01.06.2006 | 1 | as is where is | immediately |
| 95240 | Disco | DFG 841 | Back Grinder | 150 mm | 01.03.1997 | 1 | as is where is | immediately |
| 83981 | Disco | DFG 821F / 8 | Back Grinder | 200 MM | 1 | as is where is | immediately | |
| 93968 | DISCO | DFG841 | wafer grinder | 01.06.2000 | 2 | inquire | ||
| 93969 | DISCO | DFD6361 | wafer saw | 2 | inquire | |||
| 93970 | DISCO | DFL7340 | Laser Saw for Stealth dicing process | 200 mm | 01.06.2010 | 3 | as is where is | immediately |
| 93971 | DISCO | DFD641 | wafer saw | 1 | inquire | |||
| 93972 | DISCO | DFD651 | wafer saw | 01.01.2001 | 1 | inquire | immediately | |
| 93973 | DISCO | DAD321 | wafer saw | 6 | inquire | |||
| 94485 | Disco | DFG 8540 | Back Grinder, 8 inch | 200 mm | 01.05.2016 | 1 | as is where is | immediately |
| 93974 | DISCO | DFP8140 | wafer polisher | 01.06.2004 | 1 | inquire | ||
| 87833 | Disco | DAD6450 | Dicing and handler | 200mm | 1 | as is where is | immediately | |
| 93982 | DISCO | DFL 7340 | Stealth Process Laser Saw | 200 mm | 01.06.2014 | 2 | inquire | immediately |
| 93983 | Disco | EAD 6750 with Hanmi 3800LD | Package Singulation Saw with Cleaner | 178 mm x 127 mm | 01.06.2012 | 1 | as is where is | immediately |
| 84001 | Disco | DAC551 | Dicing Saw | 150mm | 1 | as is where is | immediately | |
| 92467 | Disco | DFL 7340 | Stealth Process Laser Saw | 300 mm | 01.06.2017 | 1 | as is where is | immediately |
| 87099 | Disco | DAD3350 | Dicing Saw | 200mm | 4 | as is where is | immediately | |
| 92731 | Disco | DFL 7160 | Laser Saw (For micro-grooving.). | 300 mm | 01.06.2010 | 1 | as is where is | immediately |
| 92737 | Disco | DFD6360 | DICING SAW (PKG) | 300 mm | 01.06.2004 | 1 | as is where is | |
| 92738 | Disco | DFD6360 | DICING SAW (PKG) | 300 mm | 01.06.2004 | 1 | as is where is | |
| 92739 | Disco | DFD6360 | DICING SAW (PKG) | 300 mm | 01.06.2003 | 1 | as is where is | |
| 92740 | Disco | DFD6360 | DICING SAW (PKG) | 300 mm | 01.06.2002 | 1 | as is where is | |
| 92741 | Disco | DFD6360 | DICING SAW (PKG) | 300 mm | 01.06.2004 | 1 | as is where is | |
| 88445 | Disco | DFD6360 | Dicing Saw | 200 mm , 300 mm | 01.06.2003 | 1 | as is where is | |
| 65918 | Disco | DFL7160 | LASER SAW | 1 | as is where is | |||
| 79244 | Disco | DFG 8561 | Backside Grinder | 1 | as is where is | immediately | ||
| 93605 | Disco | DAC-2SP/86 | Dicing Saw | ASSEMBLY | 1 | as is where is | ||
| 93606 | Disco | DAD522 | Dicing Saw | ASSEMBLY | 1 | as is where is | ||
| 94378 | DISCO | DFD640 | WAFER SAW | 150 MM | 01.06.1996 | 1 | as is where is | |
| 94379 | DISCO | DFD640 | WAFER SAW | 150 MM | 01.06.1996 | 1 | as is where is | |
| 94380 | DISCO | DFD640 | WAFER SAW | 150 MM | 01.06.1996 | 0 | as is where is | |
| 75706 | Disco | DFD 640 | Dicing Saw | 3 | as is where is | |||
| 79553 | Disco | DFD6360 | Dicing Saw | 01.06.2005 | 1 | inquire | immediately | |
| 79043 | DISCO | DFD640 | Dicing saw | 200 mm | 1 | as is where is | immediately | |
| 79556 | Disco | DFD640 | Dicing Saw | 4 | as is where is | immediately | ||
| 95173 | DISCO | DGP-8761 | Wafer Back Grinder | 01.04.2012 | 1 | as is where is | ||
| 86727 | Disco | DFL7160 | 01.04.2012 | 0 | ||||
| 93383 | Disco | DFP 8140 | Polisher | Assembly | 01.02.2005 | 1 | as is where is | |
| 92365 | Disco | DFD6360 | Dicing saw | 300 mm | 01.01.2004 | 1 | as is where is | immediately |
| 92366 | DISCO | DFD6360 | Dicing saw | 01.01.2004 | 1 | as is where is | ||
| 93391 | Disco | DFL7340 | Laser dicing | assembly | 01.06.2007 | 1 | as is where is | |
| 93392 | Disco | DFL7340 | Laser dicing Saw | assembly | 01.06.2007 | 1 | as is where is | immediately |
| 92369 | Disco | DAG 810 | R and D wafer lapping system | 150 mm | 01.07.2003 | 1 | as is where is | immediately |
| 86484 | Disco | DFL 7340 | Laser Saw for LED applications (Sapphire) | 200 mm | 01.06.2010 | 15 | as is where is | immediately |
| 94430 | DISCO | DFD6360 | Dicing saw | 300 mm | 01.10.2004 | 1 | as is where is | immediately |
| 90337 | Disco | EAD6361 + 3000D | Dicing saw with Hanmi cleaner | 150 mm | 1 | as is where is | immediately | |
| 90087 | DISCO | DFL7160 | WBL LASER SAW | 300 mm | 01.06.2012 | 1 | as is where is | immediately |
| 90089 | DISCO | DFL7160 | WBL LASER SAW (DAF Type) | 300 mm | 01.06.2012 | 1 | as is where is | immediately |
| 88819 | DISCO | DGP8761HC | BACK GRINDER | 01.06.2009 | 1 | inquire | immediately | |
| 86262 | Disco | DAD2H6 | Dicing Saw | 01.06.1994 | 1 | as is where is | immediately | |
| 86263 | Disco | DCS 141 | Wafer spinner | 01.06.2007 | 3 | as is where is | immediately |