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| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 90373 | EVG | 540 | Automatic Wafer Bonder | 150 mm to 300 mm | 01.06.2005 | 1 | as is where is | immediately |
| 90374 | EVG | 850TB /200 | Wafer Bonding system | 150 mm | 01.06.2007 | 2 | as is where is | immediately |
| 71967 | EVG | 101 | SPRAY COATER | 200 mm | 01.08.2003 | 1 | as is where is | immediately |
| 90655 | EVG | 520IS | Semi-automated Wafer Bonding System | 200 mm | 01.06.2006 | 1 | inquire | immediately |
| 90666 | EVG | 805 | Debonder | 200 mm | 01.06.2010 | 1 | as is where is | immediately |
| 90667 | EVG | 805EZD | Debonder | 200 mm / 300 mm | 01.06.2013 | 1 | as is where is | immediately |
| 84572 | EVG | 40 | Alignment mesurement system | 01.06.2008 | 1 | as is where is | ||
| 84574 | EVG | IQA | Replication IQ-ALIGNER | 01.06.2008 | 1 | as is where is | ||
| 84575 | EVG | IQA | Replication IQ-ALIGNER | 01.06.2010 | 1 | as is where is |