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Shibaura CDE -80 Dry Etcher for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used Shibaura CDE -80 Dry Etcher.
Please click on the "Get Quote" button at the end of the CDE -80 description, if you'd like to get a quotation, photos and specifications of this Dry Etcher, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Shibaura CDE -80 Dry Etcher is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


Shibaura CDE -80 Equipment Details

SDI ID: 111464
Manufacturer: Shibaura
Model: CDE -80
Description: Dry Etcher
Version: 200 mm
Vintage: Inquire
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

De-installed from working condition and warehoused. Please refer to the attached photos to see the condition. Can be inspected by appointment.
Parts included:-
-Main body.
-SMIF Loader
-Controller
-CRT
-Keyboard
-Through the wall config.
-SUS Front panel
-Al Side panel: Ni Coated
-Pump interface
Gas system:
(5) MFC Tylan FC-2900 CF4, C12, N2, 02, NF3
Quartz tube protection
C mictube
ESC Universal chuck,
8" Water auxiliaries

This isotropic etching system applicable to wafers of diameter 75 mm to 300 mm has been favoured by customers for many years. While having many achievements for round etching including Si and SiO2, recently this system has also been used for the improvement of device properties by using its remote plasma feature. Its plasma damage-free technology contributes to the designing of high-quality devices.
Features
・Isotropic etching
By generating plasma outside of the chamber and performing the etching processing with radical compounds only, this system is capable of perfect isotropic etching processing.
This system is applied for round processing for trench pattern opening sections.
・Plasma damage-free feature
Due to the long distance from a plasma to a wafer, the ion generated within the plasma is deactivated and does not impact the wafer. This feature is applied to removal of damaged layers after RIE processing.


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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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