KLA-Tencor UV-1280SE Thin Film Measurement System with Ellipsometer option for Sale

-The equipment was operational in the wafer fab up until August 2024.
-The equipment was Converted to 200 mm open cassette wafer loading in 2023.
-Prior to that it was being used for 6 inch open cassette wafer loading.
-In any case, it will load both 6 inch wafers and 8 inch wafers.
-The robot has two load stations for open 8 inch and 6 inch cassettes.
-The system was professionally de-installed to an inspection facility in around June of 2025.
-The system can be inspected by appointment.
-The system can either be purchased "as is", or else, purchased in a refurbished condition, including a demonstration of the equipment in operational condition.
-The system was being used in Europe, and it has a Eu "CE" marking certificate.
-Please refer to the attached photos showing the system condition prior to it being removed from the wafewr fab in 2025.
Here are the performance specifications for the KLA UV1280Se model:-

- This equipment is capable of measuring Film Thickness, Refractive Index (RI) and Extinction Coefficient of Single and Multi-Layer Thin Film Stacks Simultaneously without Referencing.
- Reflectivity Range of 220 nm to 800 nm 
- Intel Pentium Computer 
- Operations Manuals Included 

MEASUREMENT CAPABILITIES:
  Single Layer Thickness (t): 
  - Thermal Oxide: 0 Angstroms to 40 µm 
  - Oxynitride: 0 Angstroms to 30 µm 
  - Nitride: 0 Angstroms to 25 µm 
  - BPSG: 0 Angstroms to 40 µm 
  - Photoresist: 0 Angstroms to 40 µm 
  - Polyimide: 0 Angstroms to 40 µm 
  - Poly on Oxide: 50 Angstroms to 2 µm Poly on 40 Angstroms to 4000 Angstroms Oxide 
  - Poly on Nitride: 50 Angstroms to 2 µm Poly on 40 Angstroms to 4000 Angstroms Nitride 
  - Amorphous Silicon: 50 Angstroms to 2 µm Amorphous on 40 Angstroms to 4000 Angstroms Oxide or Nitride 
  - Oxide on Poly: 50 Angstroms to 1 µm Oxide on <500 Angstroms Poly 
  - Nitride on Poly: 50 Angstroms to 1 µm Nitride on <500 Angstroms Poly 
  - TiN: 80 Angstroms to 500 Angstroms 
  - Oxide on Aluminum: <1000 Angstroms to 25 µm 
  - Oxide on Tungsten: <1000 Angstroms to 25 µm Single Layer Refractive Index (N, k): 
  - Thermal Oxide: <100 Angstroms 
  - Oxynitride: <100 Angstroms 
  - Nitride: <100 Angstroms 
  - BPSG: <500 Angstroms 
  - Poly on Oxide: <100 Angstroms 
  - Amorphous Silicon: <100 Angstroms 
  - TiN: <200 Angstroms Simultaneous MultiLayer and Simultaneous MultiVariable Measurements: 
  - Up to 7 Unknowns in up to an 8 Layer Stack 

ABSOLUTE ACCURACY: 
Thickness: 
+/-1.5 Angstroms of NIST Certified Range for Oxide <125 Angstroms: 
+/-1 Angstroms of NIST Certified Range for Oxide 125 Angstroms to 300 Angstroms 
+/-1% of NIST Certified Range for Oxide 300 Angstroms to 1.0 µm 

Index: 
+/-0.025 for >350 Angstroms to 1.0 µm Oxide 
+/-0.025 for >250 Angstroms to 1.0 µm Nitride

STABILITY (MEAN 3 Sigma):

Oxide and Nitride Thickness: 
  - 20-100 Angstroms 3 sigma <0.48 Angstroms 
  - 100-300 Angstroms 3 sigma <0.9 Angstroms 
  - 200-2000 Angstroms 3 sigma <0.3 Angstroms 
  - 2000 Angstroms-1.0 µm 3 sigma <0.1% 
(Two Parameter Measurements)