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Disco DGP 8761 Fully Automatic Back Grinder / Polisher with universal chuck for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used Disco DGP 8761 Fully Automatic Back Grinder / Polisher with universal chuck.
Please click on the "Get Quote" button at the end of the DGP 8761 description, if you'd like to get a quotation, photos and specifications of this Fully Automatic Back Grinder / Polisher with universal chuck, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Disco DGP 8761 Fully Automatic Back Grinder / Polisher with universal chuck is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


Disco DGP 8761 Equipment Details

SDI ID: 114420
Manufacturer: Disco
Model: DGP 8761
Description: Fully Automatic Back Grinder / Polisher with universal chuck
Version: 200 mm / 300 mm
Vintage: 01.07.2019
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

- This Stand-alone Disco DGP 8761 Back Grinder was fully operational in the fab in working condition before shutdown.

-This DGP8761 has a universal chuck.
It's possible to set up with both 200mm and 300mm Wafer loading and FOUP loader ports.
- It was deinstalled by DISCO engineers and it has been relocated to the warehouse.
- Please check attached for photos.
- Photos were taken in the fab before removal.
- Inspection at the warehouse is available by appointment.

Configuration:-
FULLY AUTOMATIC GRINDER/POLISHER DGP8761
Spindle output : 6.3kW
Maximum RPM : Z1-4000/Z2-4000/Z3-3000

Options
Option Universal specification (except spinner table) For Dry polish (for wafers with orientation flat)
Option Universal Specification (Spinner Table) For Wafers With Orientation Flat
Option Foup Opener Unit 300 mm wafers dedicated (with 200 mm adapter)
Option Transport jig Machine hoisting jig+ Export packing hardware
Primary Piping Joint For DGP8761 (Dry Polish Specification)
2 Option Primary Piping Joint For Sub-Air Switching Unit
2 Option Primary Piping Joint For Water Temperature Control Unit (DTU1531)
2 Option Automatic Wheel Position Setup
2 Option Vacuum Maintenance Using Vacuum Ejector
2 Option Sub-Air Switching Unit
2 Option Host communication SECS-1/-2 and GEM compliant
2 Option Bar-Code Reader
2 Option EMO Guard Ring For DGP8761
2 Option EMO Guard Ring For DTU1531
2 Option Scrub Washing Unit For Dry Polish/Poligrind specification
2 Option Power Cable For The DGP8761 5M
2 Option Power Cable For The Water Temperature Control Unit (DTU1531) 5 M
2 Option Water Temperature Control Unit (DTU1531) With The English Instruction Manual
2 Option Uninterruptible Power Supply External Type With English Instruction Manual

DPR
DPR DGP8761 Specialized Spec (DP. Stand Alone)
Specialized Handy BCR Spec (S/W included)

Parts included:-
Main Body* 1set
DTU1531 * 1sets
Pump * 1sets
Dust Collector * 1set
UPS * 1set
Robot hand * 1set
Robot pick * 1set
Touch panel * 1set
Torque wrench * 1set

The DGP8761  integrates backside grinding and stress relief processing and performs stable thin grinding to wafer thicknesses less than 25 μm. The DGP8761 is equipped with a new designed spindle to support high-speed grinding. This gives a shorter thin wafer processing time (compared to previous models). Additionally, an optimized handling layout shortens the cycle time (not including processing time).
Various Z3 spindle configurations
The following Z3 spindle configurations for thin wafer processing can be selected:
Stress relief
• Dry polishing - an environmentally friendly process without chemicals or water
• CMP (optional)
Super fine grinding (optional)
• Poligrind
• UltraPoligrind

Specifications
Supported workpiece size mm
Φ300(Φ200 / Φ300)
Grinding Method (Z1/Z2 axis) - In-feed grinding with wafer rotation
Grinding Method (Z3 axis) - Anomalous in-feed grinding with wafer rotation
Grinding Wheels -
Φ300 mm Diamond wheel (grinding-axis)
Φ450 mm Dry polishing pad (DP-axis)
Φ450 mm CMP pad (CMP-axis)
Equipment dimensions (W×D×H)
1,690 × 3,315 × 1,800 (open cassette) mm
Equipment weight
1,690 × 3,452 × 1,800 (FOUP)
Approx. 6,700(DP, Poligrind) kg
Approx. 6,900 (CMP) kg


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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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