MRSI M3 Flip-Chip Die Bonder for Sale

Qty 2 systems available.

Still installed and please refer to the attached photos for technical details.

General Specifications for the MSRI M3 Bonder Platform

MRSI-M3 3-MICRON FLIP-CHIP DIE BONDER
https://www.mycronic.com/product-areas/die-bonding/products/high-precision-flip-chip-die-bonders/mrsi-m3/

3-micron flip-chip die bonder
High speed and high accuracy
Provides all the capability and flexibility to assemble the most advanced packages

The MRSI-M3 3-Micron Flip-chip Die Bonder sets the industry standard for ultra-precision, high-complexity die attach in high volume production environments. With features such as force control, ultra precise placements, and 360° die orientation, the MRSI-M3 die bonder ensures high yields, high quality and high reliability in advanced packaging.

The highly configurable, MRSI-M3 platform ensures optimum asset protection. The system delivers an unmatched combination of 3-micron accuracy, automation, speed and reliability; in-situ assembly processes such as eutectic die bonding, UV epoxy die attach and flip chip assembly are all possible. The MRSI-M3 3-Micron die bonder is ideally suited for manufacturers of microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages.

From small dies to large sensors, the MRSI-M3 3-Micron die bonder provides all the capability and flexibility to assemble the most advanced packages, without compromising on manufacturing efficiency, quality and reliability.

Benefits

The MRSI-M3 uses an advanced cast composite base, enabling fast and accurate moves with virtually no settling time. The large work envelope enables a wide range of configurations (see options tab) to meet customer requirements.

Advanced functionality equates to significant benefits:

    High Speed AND High Accuracy – An advanced axis system driven by brushless DC linear servomotors with linear glass-scale encoder feedback for high speeds and accurate movements.
    High Machine Efficiency AND High Product Quality – Built-in internal temperature monitoring ensures consistent placement. Known heat sources, such as motors are designed with gas cooling; ensuring that thermal expansion is kept to a minimum.
    Optimum Placement Yields – The system’s closed-loop force control enables placement of delicate Gallium Arsenide (GaAs) dies with as little as 10 grams of force. At the other end of the scale, forces up to 2kg are programmable.
    Flexible Component Supply Options – Die are picked from waffle pack, Gel-Pak®, wafer, tape and reel and custom trays.
    Maximum Asset Use – MRSI-M3 machines are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping and eutectic bonding with scrub and temperature control, are all configuration options that make the MRSI-M3 3-micron die bonder a complete assembly solution (see features tab for details).

Configuration for Higher Volume

The MRSI-M3 offers an optional patented turret for “on-the-fly” tool change to significantly increase the production volume from our machine without sacrificing flexibility. The patented turret has the capacity for 12 tools with zero tool change time.

This leads to increased machine efficiency, higher output and lower manufacturing costs. Applications include processes requiring a large number of parts-specific tools, using eutectic bonding, and the need to assemble complex products with a multitude of compo­nent types.

Features

The base MRSI-M3 3-Micron Flip-chip Die Bonder comes already equipped with industry-leading functionality. Additional capability is available to reflect specific application needs. Standard Features include:

Large Work Area
The MRSI-M3’s large configurable work area holds up to 72 waffle packs; Gel-Paks®, tape feeders, and wafers may also be used. Waffle packs may be loaded from the front and back on easily removable and reloadable sector plates. Waffle pack feeders are easily integrated. Also, waffle pack adapters may be used with the automatic wafer changer. Epoxy stamping, in-situ eutectic, and other custom options can all be accommodated simultaneously in the work space.

High Speed Production
The MRSI-M3 die bonder is designed for high-speed movements AND ultra-precise 3 micron placements. The composite base, low weight gantry, and powerful linear motors are engineered for fast acceleration at submicron resolution. Overall, the system is characterized by an unprecedented level of capability and technology that translates into high value and investment protection. The net result is unrivaled accuracy at high production rates.

Force Control
Closed-loop force feedback enables delicate handling of III-V semiconductor components, such as Gallium Arsenide (GaAs) and Indium Phosphide (InP) devices as well as MEMS with fragile microstructures. Die are processed with forces as low as 10 grams applied to the component. Force values and speeds are programmable per component type, which means that each die type can be picked and placed with its unique programmed and controlled force.

Advanced Vision System with 360° Die Orientation
The MRSI-M3’s advanced vision system enables rapid detection and orientation of die over a full 360°. Boundary trace or pattern recognition is used to locate the die center or application-critical features. Fast and accurate orientation detection enables die such as MMICs and laser diodes to be used directly from the supplier, eliminating the need for pre-orientation. Global and local vision alignment schemes are used for nested substrates and features, enabling fast and error-free processing of complex assemblies. The machine is configured with an upward looking camera that can be used for processing flip chips and other components with bottom features

Programmable Multi-Color Lighting
Lighting intensity is programmable for both ring and collimated light functions, for each camera. Optimal light conditions may be set for die recognition and for alignment. Multi-color lighting may be used to enable optimum imaging of a low-contrast components. Red, green and blue programmable lighting is a powerful tool when processing challenging alignment surfaces such as gold on alumina. Such an advanced vision toolbox ensures optimum performance, which directly translates into less machine interruptions due to vision errors.

MRSI Systems Windows Software
The MRSI-M3’s intuitive graphical user interface runs on Windows™ and simplifies the set-up and production process. The software includes a pre-programmed library of waffle pack and die. Additional components are easily taught and are available for all substrate programs. Calibration routines, offline programming, and CAD download mean programming is quick and easy. The MRSI-M3 is the perfect companion to MRSI Systems dispense equipment since it shares the same software user interface.