EVG Gemini Wafer to Wafer Bonder for Sale

With 1 process module beside SVA, automated handling. Consisting of: Wafer Handling Module, Alignment Stage and Bonding Module for Wafer Bonding Applications up to 200mm. Tooled for 200mm Wafers

Features of the equipment:

1. Continuous Mode of Operation (CMO)
 - Lot and slot integrity, even when lots get mixed in the machine during lot change.
 - System allows processing of different lots at the same time with different recipes and/or using different process modules.
 - No interruption of processing during lot changes.

2. Ballroom Substrate handling module including:
 -  For wafer handling between load cassette and alignment stage.
 -  3 ergo cassettes (optional).
 -  4 axis industrial robot for loading/unloading.
 -  Wafer handling end effector for robot unit.
 -  Programmable for all wafer  sizes up to 200mm.
 -  With external optical prealigner.
 -  Robot control is fully integrated into the graphical user interface.
 -  Standard: wafer handling with vacuum from bottom side.

3. Bondchuck handling module including:
 -  For Bond chuck handling between alignment station and the bond chamber.
 -  For automated operation of up to four bond modules.
 -  4 axis industrial robot for loading/unloading of bond chucks to bond chamber.
 -  Integrated cooling station for each bond chamber for increased throughput
 -  Unclamp station with handshake to Linear Transfer Station

4. Linear Transfer Station including: 
 -  To move substrate to receive station next to send station
 -  Using SMIF stations (optional) instead of open cassettes possible
 -  Positioned next to alignment station

5. Ergo Load Cassette Station including:
 -  Cassette present sensor
 -  Cassette empty sensor
 -  Adjustable for different semi standard wafer cassette sizes
 -  Tilt mechanism for wafer cassette according to Semi S8.

6. Scanning end effector for wafer handling robot unit
 - Designed to detect missing or cross-slotted substrates in send cassettes.

7. Loading Chuck for 200mm Wafer.
 - For loading and alignment of top wafer.
 - Recess for spring loaded clamping pins.

8. Automatic alignment configuration
 - With vision system (integrated in PC).
 - Storage of trained substrate patterns on hard disk.
 - Software fully integrated in the alignment system computer control.
 - User trainable alignment marks.
 - Easy operation with menu assisted training of alignment marks.

9. Bonding modules configuration:
Bond module features:
 - Universal bond chamber with top and bottom side heaters.
 - Flag pulling mechanism.
 - Up to 550°C and 3.5KN , with optional 10kN, 20KN, 40kN, 60KN or 100kN.
 - Atmospheric capabilities down to 1x 10 -3 mbar (7.5 x 10 -4 Torr)
   Optional: 1x10 -5 mbar (7.5 x 10 -6 Torr).
 - 3 bar abs. pressure.
 - Separate connections for evacuation, purge and vent.
 - Independent temperature controllers for top and bottom side of each chamber.
 - Electronic pressure regulator for controlled contact force.
 - Bond chamber will have maintenance port to connect RGA.
 - Pneumatic wafer bow pin:
- For most accurate alignment of separated wafers
- Spring-loaded pin in bond chamber
 - Rapid Cooling: 
 - for Bottom Side Heater
 - for Top Side Heater
- For symmetric top/bottom side cooling at identical rate
- Forced water cooling
- Silent operation
- Programmable cooling rate
- Secure fluidic path without seals in vacuum

- The Gemini bond chamber does have the ability to initiate contact with the bow pin feature only.
This feature is in the current system configuration. Bow Pin can be selected in recipe control with the flags in place to evacuate and initiate minimal contact.
Piston force applied during bond sequence: EVG Product Management does not recommend applying force with the spacer flags in place.
This will inevitably cause wafer breakage. This is the reason EVG bonders have hard coded software not allowing this function.
EVG bonders can be configured with 500um flags.

10. General features:
 - EC Declaration of conformity (certification done by EVG)
 - PC controlled operating environment
 - Solid State Drive and Hard Drive - for high availability and reliability
 - Separated control rack for remote operation of GEMINI
 - Graphical User Interface for manual and fully automated operation.
 - DVD backup system - system software and data backup tool integrated
 - Separate process capability of each chamber, independent sequence, monitoring and data storage.

11. NRTL Certification
 - NRTL labeling (depending on AHJ (Authorities Having Jurisdiction) requirements (e.g. UL61010A-1, NFPA79 — current version at time of evaluation).
 - System is designed for UL61010 and NFPA79 compliance 
 - Evaluation will be performed at EVG prior to shipment of the system
 - Letter of compliance will be supplied to buyer at time of installation
 - NFPA79: Electrical Standard for Industrial Machinery
 - UL61010: Electrical equipment for laboratory use — general requirements