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ASML TWINSCAN NXT:1980Di Immersion Scanner for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used ASML TWINSCAN NXT:1980Di Immersion Scanner.
Please click on the "Get Quote" button at the end of the TWINSCAN NXT:1980Di description, if you'd like to get a quotation, photos and specifications of this Immersion Scanner, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This ASML TWINSCAN NXT:1980Di Immersion Scanner is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


ASML TWINSCAN NXT:1980Di Equipment Details

SDI ID: 116630
Manufacturer: ASML
Model: TWINSCAN NXT:1980Di
Description: Immersion Scanner
Version: 300 mm
Vintage: Inquire
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

The TWINSCAN NXT:1980Di Step-and-Scan system is a high-productivity, dual-stage immersion
lithography tool designed for volume production 300-mm wafers at the sub 10-nm node.
The TWINSCAN NXT:1980Di is equipped with the successful in-line catadioptric lens design, having
a numerical aperture (NA) of 1.35 – the highest in the industry.
In-situ measurement and correction of optic aberrations enable maximum imaging performance for
each wafer exposed when imaging at very low-k 1 .
Advanced in-situ metrology per wafer together with a comprehensive set of options to input off-line
metrology data to the scanner enable maximum overlay, focus and CDU performance on product
wafers.
By combining high productivity and excellent image resolution with unprecedented overlay and focus
performance, the TWINSCAN NXT:1980Di addresses multiple patterning requirements and thus
provides a cost-effective solution for the sub 10-nm nodes.

Lens
Wavelength:193 nm
NA:0.85–1.35 (variable)
Resolution:≤ 38 nm (single exposure)
Field size, for reticle with pellicle
• Max X:26.0 mm
• Max Y:33.0 mm
Overlay
Single-machine (dedicated chuck):≤ 1.6 nm full wafer coverage
Matched-machine (to reference wafer):≤ 2.5 nm full wafer coverage
Production Throughput
30 mJ/cm2 exposure dose
• 300-mm wafers, 96 shots:≥ 275 wph

1.35-NA 193-nm Catadioptric Projection Lens
Production resolutions down to 40 nm (C-quad) and 38 nm (dipole). In-line catadioptric lens design
supporting full 26 x 33-mm field size, 4X reduction and reticle compatibility with existing designs. Lens
elements are equipped with manipulators to correct for optical aberrations, thus enabling maximum
productivity for low-k 1 applications.

The FlexRay Prepared Illuminator extends the range of conventional and off-axis illumination to enable
advanced pupil shaping for low-k 1 imaging. Since the system will be hardware prepared it can be
upgraded to full FlexRay functionality, and thus support an unlimited range of freeform pupil shapes by
means of a simple software upgrade

Innovative focus control and field-by-field leveling measurement using ultra violet light significantly
reduces the system's sensitivity to process stack variations during off-line mapping of the wafer
surface. Furthermore the sensor has an increased measurement density which allows for improved
leveling accuracy at the edge of the wafer.

The Parallel ILIAS (PARIS) sensor allows for a parallel measurement of optical aberrations throughout
the projection slit, thus enabling a more accurate alignment, improved reticle heating correction and on
the fly lens heating correction.

6-kHz ArF laser technology provides high power to support high throughput, provided via a CYMER XLR-660 193nm, 60W, 6khz Laser.

SMASH NXT Alignment System

Track Interface: TEL Lithius

Other installed options:-
-Quasar XL illumination module
- Next Generation Magnetically Levitated Dual-Stage Technology delivering <2.5nm (chuck dedicated) single machine overlay
- Alignment System:
o   SMASH NXT Alignment System
-      Advanced Lens Control X/Y
-      Image Tuner
-      Focus Spot monitoring
-      Polarization Control
-      CD-FEC
-      LS MATCH2
-      Reticle System:
o   Reticle error compensation
o   Reticle shape correction
o   Reticle management and E-connectivity support
-      In-situ metrology (ILIAS)
-      LITHOGUIDE ILIAS
-      DOSEMAPPER
-      Athena Narrow Marks
-      Inform (SECS)
-      User interface UNIX/SUN Architecture
Other Features:
-      Azimuthal Polarization
-      AUX Port 300mm FOUP/25 Wafer
-      FOUP Lock-out system
-      Universal Pre-alignment
-      Chuck Dedication
-      Integrated Reticle Library
-      IRIS XT
-      Reticle CIDRW Asyst (RF)
-      2D Barcode reader
-      24-char barcode reader twinscan
-      PEP High Dose (60W)
-      Agile for NXT
-      Spotless NXT
-      Exposure
-      GRIDMAPPER
-      GRIDMAPPER IF
-      Green Laser Attenuation
-      INFORM
-      BASELINER
-      BASELINER MMO Stability
-      BMMO2
-      InformPro
-      InformPro2
-      Overlay Optimizer FO
-      Overlay Optimizer 2
-      Water cooling for electronics cabinet
-      122mm Pellicle Frame Compatibility
-      Reorder Lot Service
-      Recipe Creator Light
-      Soft Wafer Load
-      Water Leak detection


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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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