Applied Materials UVision 600SP DUV Brightfield Wafer Defect Inspection System for Sale

Introduced in 2007, the Applied UVision 3 system allows high productivity DUV Brightfield wafer inspection  with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL and immersion lithography. This system triples the number of laser beams scanning the wafer to provide 40% faster throughput. Two new imaging modes extend sensitivity to 20nm, and a new ADC engine enables quick access to defects of interest and faster yield learning.
Multi-beam DUV laser architecture allows extendibility beyond the resolution limits of traditional optical inspection.
With this system,memory and immersion lithography manufacturers can run volume production at engineering tool sensitivity with a shorter cycle time to generate meaningful data.
By coupling laser DUV architecture with a sensitive photo-multiplier tube (PMT) and variable polarization, the UVision 3 system can be used for 32nm memory development. New Brightfield imaging modes, both in the illumination and collection path, address the contrast versatility required for immersion lithography. In addition, the system's algorithms of high defect accuracy and stitch-to-stitch detection enable sufficient sensitivity on periphery areas, a key advantage not addressed by other Brightfield systems.

This system was professionally de-installed from running condition in the Fab in Asia.
Whilst in use in the fab, it was maintained under an OEM service contract.
It is currently warehoused, and can be inspected by appointment.
Configuration details:
-Loading Configuration - FOUP, 2 Positions
-Loadport type- ASYST Isoport
-Carrier Reader ID
-OHT
-Operating Software - Windows XP
-SW_Version - 7.5_I
-Operation Console
-Yaskawa Teach Pendent
-TKM PDC Deep UV
-Laser type: Coherent
-CE MAKED
-208V 3 PHASE 5 WIRE 50/60 HZ
-MAX CURRENT RATING 63A, LEAK CURRENT RATING 30 mA
-LARGEST LOAD: 25A
-MAX SYSTEM RATING: 10KVA
-FULL LOAD CURRENT: 35A
-INTERRUPT CURRENT: 25KA
-WEIGHT: 5000 KG
-During removal, locking fixtures were applied to Bilz leg, Granite, ETU, Stage X axis, Turret, Stage Y axis and laser head. Please refer to attached photos.