SDI fabsurplus.com is pleased to announce the availability of the following listed used Singulus SILEX II CLEANTEX 2800 Etch - Cell Fabrication.
Please click on the "Send More Details" button at the end of the SILEX II CLEANTEX 2800 description, if you'd like to get more details, photos and specifications of this Etch - Cell Fabrication, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Singulus SILEX II CLEANTEX 2800 Etch - Cell Fabrication is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Model:||SILEX II CLEANTEX 2800|
|Description:||Etch - Cell Fabrication|
|Sales Condition:||as is where is|
In Fab - Disconnected, Decontaminated, Not Deinstalled WET PROCESSING SYSTEMInstallation in clean roomIncluding Mainframe CLEANTEX, Ozone Generator, Water Heater, 400 kVA Transformer, Lifting pump station, Manual SILEX II Batch Wet Processing Equipment The SILEX II ALTEX machine is designed to apply IPA-free texturing processes, offering substantial cost advantages compared to traditional etching systems. This texturing process can be adjusted to the individual requirements of standard and advanced cell technologies. The SILEX II CLEANTEX combines common etching and cleaning steps of monocrystalline Si with advanced cleaning and conditioning processes. Efficient cleaning steps are an indispensable requirement to improve cell efficiencies and reduce operation costs. Ozone-based cleaning operations, applied on SILEX II wet bench, combine efficient organic and metal removal with an appropriate surface conditioning. Due to low chemical costs and consumption, simple process control and high metal removal efficiency, ozonized cleaning baths are the perfect substitute for traditional, expensive multi-step RCA cleanings, known from the solar and semiconductor industry. The SILEX II CLEAN is provided to run dedicated cleaning sequences for pre- or post-deposition processes. Depending on cell process flow and requirement the configuration can be designed individually, involving RCA or Ozone based cleanings as well as slight etching steps. Typical Features • High throughput performance up to 550 MW annual production• High uptime up to 95 %• Low breakage rate down to 0.01 %• Wafer thickness down to 120 µm (wafer size M6) (‹120 µm on request)• Individual, flexible process sequencing• Onboard scheduler software for throughput tuning• Onboard performance analyzer software• Ozone-enhanced cleaning and etching processes• Short and stable IPA-free texturing process • Appropriate and effective rinsing and drying Alkaline TexturingThe core of the current and future batch process applications is the alkaline texturing process of mono-crystalline silicon, generating pyramidal-etched surfaces with optimal light trapping, passivation and contacting properties. State-of-the-Art Texturing Additive• Commercially available, worldwide supported • Multiple pyramid size tuning options• Short and robust etching process with large process window and close uniformity range• Stable composition with long bath lifetime• Non-hazardous, non-flammable, non-dangerous• Readily biodegradableOzone CleaningOzone is one of the most powerful oxidizing agents. Effective Ozone-gas injection, low chemicalconcentrations and ambient process temperatures guarantee stable and highly effective process sequences for oxidation, cleaning and etching. • Reduced CoO cost saving effect vs. RCA cleaning (high chemical cost)• Higher minority carrier lifetime (combined Si etch-back and advanced cleaning)• Smaller machine footprint (reduced number of process tanks)• Improved surface passivation• Environmentally friendly process using
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