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AKT New Aristo G4.5 NAR 1200L Vertical In-line Sputtering Machine for LCD / TFT panel G4.5 for Sale


fabsurplus.com is pleased to announce the availability of the following listed used AKT New Aristo G4.5 NAR 1200L Vertical In-line Sputtering Machine for LCD / TFT panel G4.5. This AKT New Aristo G4.5 NAR 1200L Vertical In-line Sputtering Machine for LCD / TFT panel G4.5 is available for immediate sale. Please click on the "More Details" button if you'd like to get more details, photos and specifications of this Vertical In-line Sputtering Machine for LCD / TFT panel G4.5 and your request will be forwarded to our customer representatives automatically. Crating, refurbishment and delivery can be quoted on request.


AKT New Aristo G4.5 NAR 1200L Equipment Details

SDI ID: 84763
Manufacturer: AKT
Model: New Aristo G4.5 NAR 1200L
Description: Vertical In-line Sputtering Machine for LCD / TFT panel G4.5
Version: 730mm x 920 mm
Vintage: 01.06.2013
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price (each): 2,000,000 USD
Comments:

Technical Specification Vertical In-Line Sputtering Machine
TYPE: NAR 1200 L
Cycle time: 40sec
Mo-Al-Mo Application
Glass size: 730mm x 920mm

1 APPLICATIONS
To meet the present and future demands of LCD / TFT manufacturers, AKT America Inc. has designed and developed a vertical In-Line sputtering system, called NEW ARISTO. With the NEW ARISTO FAMILY, single and multiple layers can be coated on large glass substrates
The following features characterize the machine concept:
Modular design of the chambers
Full range of process options: e.g. heating, cooling, sputtering, glow discharge
Superior vacuum
Small footprint in the industry
High productivity due to fast cycle time.
Very high collection efficiency
Ease of maintenance
High uptime
Low particle generation resulting in a superior cost of ownership

4

PROCESS DATA

 

 

4.1

 

Vacuum Data

Ultimate pressure* by the:

 

  • Entrance / exit chamber

2 E-02 hPa

 

  • Transfer chamber

5 E-06 hPa

 

  • Process chamber

5 E-06 hPa

    1. Layer Data

 

 

      1. Properties of Al single layer

All data are based on glass


Layer Material

Al

Units

Layer Thickness:

2500 ± 10%

Å

Thickness Uniformity within substrate ≤±

5

%

Thickness Uniformity within carrier ≤±

5

%

Average resistance ≤

(as annealed)

0.14

Uniformity of resistance (on spec value) ≤±

5

%

Reproducibility from carrier to carrier ≤±

5

%

 

      1. Properties of Mo single layer

All data are based on glass


Layer Material

Mo

Units

Layer Thickness:

250 ± 10%

Å

Thickness Uniformity within substrate ≤±

5

%

Thickness Uniformity within carrier ≤±

5

%

Average resistance ≤

(as annealed)

10.0

Uniformity of resistance (on spec value) ≤±

5

%

Reproducibility from carrier to carrier ≤±

5

%

 

NOTE: max. Mo thickness: 500A

 

Target Material see Attachment 13.10

Glass specification Corning E2K Display Grade or equal

 

 

    1. Productivity

 

Throughput: 180 Substrates/h (2 Substrates / carrier) Target utilization: ≥ 40% in average over all targets

    1. Cycle Time

 

All mechanical operations, move of carriers, pump down, venting and process speed are optimized to meet a cycle time of 40sec.

 

The process data described in chapter 4.2 and 4.3 have to be achieved under a cycle time of 40sec.

 

  1. TECHNICAL DATA

 

    1. Dimensions of Machine

      • Required floor space in the gray room area for the machine (chamber, roughing pump sets, cabinets, service zone, w/o atmospheric handling) approx.: 19m x 7m x 4m (l x w x h)

 

    1. Substrate Carrier

 

 

      • Substrate Dimensions: 730mm x 920mm x (0.4 / 0.5 – 1.1) mm

 

      • Material: TBD

 

      • Carrier Dimensions: approx. 1800 mm length approx. 1718 mm height

 

      • Carrier loading capacity: two substrate

 

      • No masking

 

    1. Vacuum Measuring Equipment

 

for vacuum chamber:

 

      • Pirani vacuum meter

Range: 103 hPa to 1*10-3 hPa

 

      • Ionization gauge

Range: 10-2 hPa to 1*10-9 hPa

 

in addition for each cathode :

 

      • Capacitance vacuum meter sensor head Range: 10-2 hPa to 10-4 hPa

 

    1. Pumps and Power Supplies

 

      • High vacuum pump set: Turbo-molecular pump Shimadzu TPH1503

 

      • Rough vacuum pumps: AMAT P1000LL plus WSU 2001

AMAT S400 plus WSU 2001

 

      • Mo cathode*: DC power supply ADL 45 KW + 25kW

 

      • Al cathode*: DC power supply ADL 45 KW + 25KW

 

*Max power of cathode will be limited to 40kW via Software limit.

    1. Sputter Cathodes Cathode

      • Type of cathode: Planar Cathode

 

      • Material of backing plate: Ti, water cooled

 

      • Magnetic field: Move Mag

 

      • Target fixing: Bonding

 

    1. Heater System

 

      • Heating chamber equipped with resistance heater which emits IR radiation

 

      • Mode of operation: PID regulation Shielding

 

      • Shielding material is stainless steel

      • Shielding surface is designed and manufactured with a high sticking coefficient to prevent particle generation.

 

      • Transfer- and buffer modules which are installed adjacent to process modules are partly covered with shielding to avoid coating of the chamber walls. This shielding set is not considered as a consumable and is not part of the additional operational parts.

 

      • Substrate temperature distribution: 100°C ± 15 °C

 

    1. Machine performance (required system utilities)

 

      • Electric power: 3 phases, 400 V +-10 % 50/60 Hz, five wires

(3 AC, N, PE)

 

      • Power consumption: TBD

 

      • Cooling water specification

        • pressure min/max.: 5/7 bar absolute

        • max. back pressure: open drain

        • water inlet temperature range: 18 - 25 C

        • selected temperature level should

be kept constant within: ± 2 °C (for TMP’s only)

        • hardness of water: 6 - 8 °dH (equivalent 107 - 143 ppm CaCO3)

        • electric conductivity: 100 - 200 µS/cm

        • pH-value: 8 - 10

        • foreign particles size: max. 100 µm

        • foreign particles

concentration: max. 10/cm3

        • dissolved Cl: max. 20 mg/l

        • dissolved CO2: max. 15 mg/l

      • Water consumption TBD

 

      • Compressed air

Pressure min/max.: 6/8 bar absolute

 

      • Sputter gas: Argon

 

      • Purity of sputter gas: 99.999 %

 

      • Venting gas: Nitrogen or dry compressed air

        • dew point - 30 °C

        • pressure max. 1.5 bar absolute

 

      • Ambient requirements

        • for temperature at machine and

machine control room: 20 - 30°C

        • for relative humidity: 60 %



SYSTEM LAYOUT AND PHYSICAL DIMENSIONS INCLUDING KUKA LOADING ROBOT AND CLEANING SYSTEM:-

type OEM Model and Configuration Chamber Height Panel Size
Dimensions of Module # Doors voltage Facilities Tact
Time
comments
CLN MANZ O390-0002 2,011 730*920           含AP
t 0.3mm ~ 2
speed 1000 ~ 20000 mm/min
LD CV 730*920 1100×1400×2600 1 220V CDA
Exhaust
DI
22
Sec
 
CV2 730*920 1100×1400×2600 1 220V  
ISO+DIW BR1 730*920 1400×2400×2000 1 220V  
DIW BR2 730*920 1000×2400×2000 1 220V  
Rinse 730*920 800×2400×2000 1 220V  
BJ+HPR 730*920 800×2400×2000 1 220V  
FR 730*920 800×2400×2000 1 220V  
AK 730*920 1000×2400×2000 1 220V  
ULD 730*920 1800×1400×2600 1 220V  
ALL CV MIC   2,011 730*920       CDA 22
Sec
 
ROBOT MANZ H010 Revision 01 2,011 730*920 5000×4500×3600     CDA
VAC
22
Sec
單ROBOT
Robot Type: KR – 60CR3
Axis number: 6
Length of arms: 820mm
SPT AKT NAR1200L
AM-10032009-ML-v6
2,011 730*920     400V CDA
PCW
AR
O2
N2
22
Sec
G4.5
Entrance chamber SNL 730*920 1950×1000×2122 4 400V      
NL chamber 730*920 1950×990×2122 4 400V      
N chamber 730*920 1350×990×2122 2 400V      
R chamber 730*920 2400×1690×2345 2 400V      


















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The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
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