Please find below a list of used APCVD Atmospheric Pressure CVD equipment for sale by fabsurplus.com . Click on any listed item of used APCVD equipment to see further data. APCVD is a CVD technique done at atmospheric pressure used for the deposition of doped and undoped oxides. The deposited oxide has a low density and the coverage is moderate due to a relatively low temperature. The high wafer throughput possible is a big advantage of this technique hence it is used by semiconductor wafer manufacturers. As process gases, silane SiH4 and oxygen O2 are used. The gases are decomposed thermally at about 400 celcius and react with each other to form the required film.
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