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| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
|---|---|---|---|---|---|---|---|---|---|
| 116677 | EVG | 850 TB | Organic Wafer Bonding , with in-chamber wafer centering | 200 mm | 01.06.2024 | 1 | as is where is | ||
| 116678 | EVG | 850 TB | Organic Wafer Bonding , with in-chamber wafer centering | 200 mm | 01.06.2024 | 1 | as is where is |