KLA 2367 Brightfield wafer defect inspection system for Sale

-Install Type: Stand-Alone
-Please refer to the attached photos to see the details of the tool's current condition.
The 2367 UV/visible brightfield inspection system will allow you to see many types of yield-relevant defects down to the 65nm level.
Throughput is much improved, so you can sample more defects which occur during production.
Data rate is increased by 2x over previous generation brightfield tools.
Low false defects and automatic defect classification algorithms reduce time for SEM review and so allow you to do corrective actions quicker.
Buy doing a UV/DUV mix-and-match strategy with another 28xx inspection system maximises efficiency.
Connects with other KLA-Tencor inspectors and review tools optimize inspector capacity; reduce production integration time; and enable faster, more accurate inspection recipe setup on the SEM
Process Window Qualification application enables detection of systematic defects

Typical Uses:
Critical Pattern Layers (≥65nm): High resolution and noise-suppression technologies produce sensitivity to critical patterning defects, including: lithography CD variations and missing contacts; gate etch stringers; STI voids; and copper CMP corrosion.

Photo Cell Monitoring (PCM): Using the 2367 with optimized test wafers, PCM accelerates learning on lithography processes, helping you to quickly find and eliminate lithography-related micro defects.

After-Develop Inspection (ADI): The 2367 minimizes process-induced noise on photo product wafers, enabling the detection of yield-limiting defects, such as poisoned photoresists, micro-bridges, and resist bubbles.

PWQ: The Process Window Qualification (PWQ) application identifies printed reticle design errors, enabling lithographers to qualify the process window for their designs prior to production.