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EVG 850TB L-200/150 Production Bonding system for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used EVG 850TB L-200/150 Production Bonding system.
Please click on the "Send More Details" button at the end of the 850TB L-200/150 description, if you'd like to get more details, photos and specifications of this Production Bonding system, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This EVG 850TB L-200/150 Production Bonding system is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


EVG 850TB L-200/150 Equipment Details

SDI ID: 100055
Manufacturer: EVG
Model: 850TB L-200/150
Description: Production Bonding system
Version: 150 mm-200 mm
Vintage: 01.06.2001
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

Specifications

Max. wafer size: 200mm, different substrate/carrier combinations

Loading of chamber: 5 axis robot

Configuration: Coat, bake and bond

Options:

ID reading

Spray coating

Contact force: 10 kN

Temperature: 550°C

Vacuum: 0.1 mbar

Features

Bubble-free bonding in a controlled atmosphere

Wide temperature range for low- and high- temperature adhesives and tapes

Device wafers are precisely centered with respect to the carrier wafers regardless of diameter differences

Various carriers (silicon, glass, sapphire, etc…)

Bridge tool capability

Modular integration of standardized modules

Extendable layout

Options

ID reading

Spray coating

Optional integrated inline metrology module for automated feedback loop

More Info

EVG 850TB L-200/150 SOI Production Bonding System

EVG®850TB Automated Temporary Bonding System

For temporary bonding of a substrate on a rigid carrier.

The temporary bonding process includes the application of the intermediate material on the carrier wafer before assembly is done in a bond chamber.

The different types of intermediate materials, e.g. thermo-plast adhesives, waxes, resists or tapes require different technologies to apply them on the wafer.

For liquid materials like adhesives, waxes and resists, a spin coating process is used traditionally. The process usually includes spin coating followed by a bake step before the bonding takes place. As for dry film tapes, the tape will be laminated onto the substrate in a lamination station before the final bonding step with the device wafer takes place.

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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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