SDI fabsurplus.com is pleased to announce the availability of the following listed used EVG 850TB L-200/150 Production Bonding system.
Please click on the "Send More Details" button at the end of the 850TB L-200/150 description, if you'd like to get more details, photos and specifications of this Production Bonding system, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This EVG 850TB L-200/150 Production Bonding system is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||Production Bonding system|
|Version:||150 mm-200 mm|
|Sales Condition:||as is where is|
Max. wafer size: 200mm, different substrate/carrier combinations
Loading of chamber: 5 axis robot
Configuration: Coat, bake and bond
Contact force: 10 kN
Vacuum: 0.1 mbar
Bubble-free bonding in a controlled atmosphere
Wide temperature range for low- and high- temperature adhesives and tapes
Device wafers are precisely centered with respect to the carrier wafers regardless of diameter differences
Various carriers (silicon, glass, sapphire, etc…)
Bridge tool capability
Modular integration of standardized modules
Optional integrated inline metrology module for automated feedback loop
EVG 850TB L-200/150 SOI Production Bonding System
EVG®850TB Automated Temporary Bonding System
For temporary bonding of a substrate on a rigid carrier.
The temporary bonding process includes the application of the intermediate material on the carrier wafer before assembly is done in a bond chamber.
The different types of intermediate materials, e.g. thermo-plast adhesives, waxes, resists or tapes require different technologies to apply them on the wafer.
For liquid materials like adhesives, waxes and resists, a spin coating process is used traditionally. The process usually includes spin coating followed by a bake step before the bonding takes place. As for dry film tapes, the tape will be laminated onto the substrate in a lamination station before the final bonding step with the device wafer takes place.
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The data provided herein is not an offer capable of acceptance.
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Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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