| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
|---|---|---|---|---|---|---|---|---|---|
| 115586 | Applied Microengineering | AWB08 | Wafer Bonder | 200 mm | 1 | as is where is | |||
| 111664 | ASM | NUCLEUS XP | Wafer Substrate Bonding | 300mm | 1 | as is where is | |||
| 115608 | Athlete-FA Corporation | BM-2000WI | Solder Ball Mount | 300 mm | 1 | as is where is | |||
| 115686 | CyberOptics | SE600 | Solder Paste Inspection (SPI) | N/A | 1 | as is where is | |||
| 115700 | DEK | Galaxy | Solder Paste Inspection (SPI) | 200 mm | 1 | as is where is | |||
| 115712 | Dynatex | DXB-120 | Wafer Bonder | 150 mm | 1 | as is where is | |||
| 115713 | Dynatex | DXE 5 | Wafer Expander | 150 mm | 1 | as is where is | |||
| 106467 | EO Technic | CSM-2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 01.06.2002 | 1 | as is where is | immediately | |
| 106469 | EO Technics | CSM2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 1 | as is where is | immediately | ||
| 106470 | EO TECHNICS | CSM2000 | CHIP SCALE LASER MARKER | 200 mm | 01.06.2005 | 1 | as is where is | immediately | |
| 115729 | EV Group | EVG40 NT | Wafer Inspection Equipment | 200 mm | 1 | as is where is | |||
| 115730 | EV Group | EVG850TB | Temporary Bonding System | 200 mm | 1 | as is where is | |||
| 115731 | EV Group | Gemini | Fully-Automated Wafer Bonder | 200 mm | 1 | as is where is | |||
| 101819 | EVG | 820 | Mold Carrier Lamination System | 200 mm | 1 | as is where is | immediately | ||
| 108816 | EVG | Smart View | Wafer Aligner - Parts Only | 1 | as is where is | ||||
| 109611 | EVG | 520 | Wafer Bonder | 150 mm | 1 | inquire | |||
| 110746 | EVG | Gemini | Wafer Bonding system - permanent bonding system | 150 mm | 01.06.2015 | 5 | as is where is | immediately | |
| 111732 | EVG | 850DB | Automated Debonding System | 200mm | 1 | as is where is | |||
| 112763 | EVG | EV640 | Wafer to Wafer Bond Aligner | 1 | as is where is | ||||
| 112764 | EVG | Smartview Bond Aligner | 300mm Wafer to Wafer Bond Aligner | 300 mm | 1 | as is where is | |||
| 113957 | EVG | 501 | Wafer Bonder | 150 mm | 1 | inquire | |||
| 112844 | Logitech | BC1 | Wafer Bonder Controller | 1 | as is where is | ||||
| 112894 | Osiris International | DEFIXX 15m | Wafer Debonding Tool -- Manual 0 150mm | 150 mm | 1 | as is where is | |||
| 116199 | Suss | ABC200 | Wafer Bonder | 200 mm | 1 | as is where is | |||
| 116200 | Suss | ABC200 | Wafer Bonder | 200 mm | 1 | as is where is | |||
| 111449 | SUSS Microtec | MCS8 + SBS6 Gen 2 + DB12T + SD12 | Spin Coater + Wafer Bonder + Debonder _ Debonded wafer Cleaner | 200 mm | 01.09.2022 | 1 | as is where is | immediately | |
| 108128 | TOK | 12262 | Wafer bonder | 1 | as is where is | ||||
| 108129 | TOK | 12263 | Wafer Debonder | 1 | as is where is | ||||
| 103635 | Toray | SP-500w | Bump Height Measurement | 300 mm | 1 | as is where is | |||
| 108130 | TORAY | FC3000L2 | FLIP CHIP Line | 0 | as is where is | ||||
| 111997 | Toray Engineering Co., Ltd. | FC3000WL | Flip Chip Bonder | Assembly | 1 | as is where is | |||
| 111998 | Toray Engineering Co., Ltd. | PB3000 | Flip Chip Bonder | Assembly | 1 | as is where is | |||
| 106557 | Ultron | UH108 | Ultron Tabletop Laminator | 150 mm/200 mm | 01.06.2005 | 1 | as is where is | immediately | |
| 106560 | V-Tek | TM-330 | TM-330 | 150 mm/200 mm | 1 | as is where is | |||
| 106563 | Veeco Wyko | NT3300 | 3D Bump Height (Veeco) | 150 mm/200 mm | 1 | as is where is | immediately | ||
| 116402 | VERSA CONN CORP. | WB-302 Triple+ | Semi Automated High Force Wafer Bonder | 150 mm | 1 | as is where is |