| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
|---|---|---|---|---|---|---|---|---|---|
| 116628 | Camtek | Condor 302M | Wafer inspection system for surface defects, 2D bump metrology, and 3D measurement | 150 mm and 200 mm | 01.06.2011 | 1 | as is where is | immediately | |
| 106467 | EO Technic | CSM-2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 01.06.2002 | 1 | as is where is | immediately | |
| 106469 | EO Technics | CSM2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 1 | as is where is | immediately | ||
| 106470 | EO TECHNICS | CSM2000 | CHIP SCALE LASER MARKER | 200 mm | 01.06.2005 | 1 | as is where is | immediately | |
| 101819 | EVG | 820 | Mold Carrier Lamination System | 200 mm | 1 | as is where is | immediately | ||
| 108816 | EVG | Smart View | Wafer Aligner - Parts Only | 1 | as is where is | ||||
| 109611 | EVG | 520 | Wafer Bonder | 150 mm | 1 | inquire | |||
| 112763 | EVG | Smartview EV640 | Wafer to Wafer Bond Aligner | 150 - 200 mm | 01.06.2001 | 1 | as is where is | immediately | |
| 112764 | EVG | Smartview Bond Aligner | Wafer to Wafer Bond Aligner | 150 mm to 300 mm | 01.06.2005 | 1 | as is where is | immediately | |
| 116626 | EVG | Gemini | Wafer to Wafer Bonder | 200 mm | 01.06.2012 | 1 | as is where is | immediately | |
| 116652 | EVG | 620 NT | Wafer Bond Alignment System | up to 150 mm | 01.06.2022 | 1 | as is where is | immediately | |
| 116653 | EVG | 520 IS | Wafer Bonding System | up to 150 mm | 01.06.2022 | 1 | as is where is | immediately | |
| 116677 | EVG | 850 TB | Organic Wafer Bonding , with in-chamber wafer centering | 200 mm | 01.06.2024 | 1 | as is where is | ||
| 116678 | EVG | 850 TB | Organic Wafer Bonding , with in-chamber wafer centering | 200 mm | 01.06.2024 | 1 | as is where is | ||
| 116832 | EVG | Gemini | Automated Production Wafer Bonder | 300 mm | 1 | as is where is | |||
| 116841 | EVG | EV501 | Wafer Bonder | 150 mm | 1 | as is where is | immediately | ||
| 116844 | EVG | 560 | Automatic Wafer Bonder | 200 mm | 1 | as is where is | |||
| 118270 | EVG | 540 | Wafer Bonder | 150mm - 200 mm | 01.06.2012 | 1 | as is where is | immediately | |
| 116867 | Karl Suss | BA8 Gen 3 | Bond Aligner | 200 mm | 1 | as is where is | |||
| 116870 | Karl Suss | SB8e | Wafer Bonder | 200 mm | 1 | as is where is | immediately | ||
| 112844 | Logitech | BC1 | Wafer Bonder Controller | 1 | as is where is | ||||
| 112894 | Osiris International | DEFIXX 15m | Wafer Debonding Tool -- Manual 0 150mm | 150 mm | 1 | as is where is | |||
| 111449 | SUSS Microtec | MCS8 + SBS6 Gen 2 + DB12T + SD12 | Spin Coater + Wafer Bonder + Debonder _ Debonded wafer Cleaner | 200 mm | 01.09.2022 | 1 | as is where is | immediately | |
| 116959 | SUSS Microtec | SB6e | Substrate Bonder | up to 150 mm | 01.01.2011 | 1 | as is where is | immediately | |
| 116960 | SUSS Microtec | PL12 | Plasma activation system for Fusion Bonding | 100-150 mm | 01.01.2011 | 1 | as is where is | immediately | |
| 103635 | Toray | SP-500w | Bump Height Measurement | 300 mm | 1 | as is where is | |||
| 106557 | Ultron | UH108 | Ultron Tabletop Laminator | 150 mm/200 mm | 01.06.2005 | 1 | as is where is | immediately | |
| 106560 | V-Tek | TM-330 | TM-330 | 150 mm/200 mm | 1 | as is where is | |||
| 106563 | Veeco Wyko | NT3300 | 3D Bump Height (Veeco) | 150 mm/200 mm | 1 | as is where is | immediately |