EVG Smartview Bond Aligner Wafer to Wafer Bond Aligner for Sale

De-installed, warehoused. Can be inspected by appointment.

EV GROUP SMARTVIEW® BOND ALIGNER
This Semi-Automatic Wafer-to-Wafer Bond Aligner can be used with an EVG 540 Wafer Bonder for production of MEMs, 3D IC Packaging and  TSV (Through-Silicon Via) interconnects.

You can make a 3D integrated circuit by putting silicon wafers and/or dies one on top of another and interconnecting them vertically. To do this, one must precisely align devices on two silicon wafers and then bond them together. The result is they act like a single device. By using TSV technology, 3D ICs can pack a lot of functionality into a small package. Such technology is used in MEMS, CMOS image sensors and memory devices.
• Currently configured for 300 mm wafers, this system can also be used with wafers of sizes 150 mm, 200 mm.
• CE marked
• High resolution alignment stage with DC servomotors in X, Y and Theta
• Alignment accuracy +/- 1 um (one sigma) with 20x objectives
• Top and bottom stage with precision measurement system
• Complete computer control of all mechanical movements in the aligner.
• 17" flat screen for operator interface and alignment functions
• Joystick control of all alignment movements and microscope movement in Z.
• Unique three spindle alignment stage for shift free Z movements
• Remote Diagnostics via modem

Dimensions     132 cm x 120 cm x 203 cm
Weight     700 kg