SUSS Microtec SB6e Substrate Bonder for Sale

-still installed

-shut down

-in USA

-see photo for current condition

-Technical specification:-

Includes: 
1 x SUSS SB6e SUBSTRATE BONDER FOR EUTECTIC BONDING
1 x OPTION FOR FUSION BONDING IN THE SB6E
1 x OPTION FOR FUSION BONDING IN THE MA/BA
Comprising:

QTY 1 X SB6e BASE MACHINE p/n 06.1002913
Offering Flexibility and accuracy for production and/or
laboratory wafer bonding of two or more wafers.
All known wafer bond processes supported with user
friendly software allowing unlimited variations of process
parameters for the bonding of aligned substrates 50mm to
150mm in diameter. Aligned bonding requires a SUSS MA/BA,
BA6, or BA. Transport fixture(s) must be ordered according
to size of materials intended to be bonded.
Base machine specifics:
Manual loading/unloading of aligned wafer transport fixture.
Easy process programming
Automatic process data recording with selectable interval
Polished stainless steel cabinet
Motorized Z axis
Transport fixture loading slide
Media Supplies:
- 208-230V/15A/50-60Hz
- clean dry air (CDA) - 6 bar
- process nitrogen 7 - 7.5 bar
- vacuum 100 mbar(abs) for pressure bond tools

Suss SB6e process chamber 
Process bond chamber with software controllable insertion
of gases such as O2 & inert gases.
Small automated open/close process chamber door with
integrated safety light barrier
Automatic chamber purge during process door cycling to
avoid chamber contamination during fixture load & unload.
Class 1 clean room compatible
Innovative rigid design
PC for SB6e
Pentium-based PC
Windows operating system
CD drive, Ethernet network card
PC flat panel monitor
Windows-Based SB6e Software System
One time non transferable Suss software license included
Hot Chuck(s) SB6e
Lower hot bond chuck with temperature control from
ambient to 550C.
Resistive heater with active air cooling.
Temperature uniformity +/- 2%
Kit, Upstream Control
For bonding from atmospheric pressure down to of
5e-5 mbar(with turbo pump option)
Downstream Controller
Pressure range: absolute 1 - 2000 mBar, up to 3000mBar
With overpressure kit option
Flow between 0.5 & 13 l/min (depending on pressure)
Adjustable by manual valve

QTY 1 X P/N 06,1000271 PRESSURE HEAD
Cylinder, Bellows and control system / pressure
doublers allows up to
20kN process force application with 150mm wafers.
Required when ordering bond head option
Includes linear guide bearing for high accuracy linear
Movement of bond head

QTY 1 X P/N 06,1001438
Kit, 6.5 CFM Scroll Pump & Turbo Pump
-For high vacuum to 5e-5 mbar
-Turbomolecular pump
-Scroll pump:
6.5 cfm@60 Hz
Dry, Lubricant free
Chemically resistant

QTY 1 X P/N 06,1000687
BOND-HEAD W/ Center Pin
-For anodic, thermo compression, eutectic and adhesive bonding of
wafers and pieces from 25mm - 150mm.
-Force range capability 300N - 20KN with a 150mm wafer
-Flat bond tool with thermal insulated, contamination free,
exchangeable ceramic surface.
-Spring loaded center pin
-Heater temperature range: ambient - 500 degC

QTY 1 X P/N 06,1001178
PP & SP Kit w-100mm W/O CP SiC
-100mm diameter SiC pressure plate and sandwich plate(upper &
lower) for bond
head w/o center pin.
-Thickness: 6mm

QTY 1 X P/N 06,1029271
BOND-ADAPTER FRAME, MANUAL / A-200 AA33
-Adaption frame for aligning wafers in 150 or 200mm transport
fixtures
-Mounts on alignment stage of MA/BA or BA with AA-33 optics

QTY 1 X P/N 06,1003268
BA LOWER CHUCK, MANUAL/TYPE-A/W-100
-For 100mm wafers
-Mounts in MA/BA or BA

QTY 1 X P/N 06,1023072
BA8 closed fixture pneumatics kit
- Needed for use of Closed Fixtures
1P10-173
Closed Fixture for SB6e A150/W100
-Holds wafers in alignment for insertion into bonder
-Compatible with Suss MA/BA or BA with AA26 or AA33 optics
-For 100mm , closed design
-SiC internal plate replaces sandwich plate
Deliverable:
-One (1) A150/W100 closed fixture with clamp arms
-Five (5) fixture graphite foils
NOTE: Graphite foil under closed fixture must be replaced on a
regular basis. Foil changing frequency will be process dependent.
306,1026462
SPACER FLAG, GEN IV, TYPE-A/W-100/0.1THK/SST
-Install on transport fixture to hold clamped wafers apart.
-For 100mm wafers
-100 microns thick, Stainless Steel, TiN coated


QTY 1 X OPTION FOR FUSION BONDING IN THE SB6E
CONSISTING OF:
QTY 1 X P/N 06,1001172
PP & SP Kit w-100mm CP/ SiC
-100mm diameter SiC pressure plate and sandwich plate(upper &
lower) for bond head with center pin.
-Pressure plate has hole for center pin
-Thickness: 6mm

QTY 1 X P/N 06,1005349
BA LOWER CHUCK, MANUAL/TYPE-B/W-100
-For 100mm wafers
-Inflateable seal allows vacuum chamber to formed in BA
-For Si Fusion bonding in BA module

QTY 1 X P/N 06,1004238
BA UPPER CHUCK, MANULA/TYPE-B/W-100
-For 100mm wafers
-Aligns with type B lower chuck to allow formation of vac chamber
-For Si Fusion Bonding in BA
-Transport fixtures cannot be used with this option