Camtek Condor 302M Wafer inspection system for surface defects, 2D bump metrology, and 3D measurement for Sale

-Still installed in the fab but shut down
-Can be inspected by appointment
-Please refer to the attached photos which show the condition of this system

Configuration:
Base System:
Condor 302M:  Automated Optical Inspection system for up to 200mm (8”) wafers. Base system designed to inspect Surface Defects, 2D Bump Metrology and 3D Measurement. The 302M delivers 20% faster throughput.
Included Features:
Windows XP operating system
Die edit S/W (online and offline)
SPC (Yield maps, histograms and analysis for die level / wafer level / lot level)  
Monochrome inspection camera
Review color camera
Magnifications: 1x, 2.5x, 5x
Supports unframed wafer sizes 150mm (6”) and 200mm (8”)
Defect sensitivity of up to 1.8 micron pixel size
Conforms to CE, SEMI, ISO requirements
Third Magnification (x1): Provides ~ 8.5 micron resolution 
Monochrome Inspection Camera: Proprietary inspection camera designed and optimize to meet advanced comprehensive automated inspection algorithms.
Die Editing: employs a user-friendly graphical interface for recipe configuration that allows the user to define even and odd-shaped zones within the die area. Users can set the required different detection criteria areas for each zone. Off-line License available to provide remote operation support installed on separate computers.
Automatic Wafer Loader: system accommodates  200mm (8") and 300mm (12") wafer FOUP includes a Robot Arm. Will support up to 2 Loadports. (See detailed specification Section II "Tool Architecture" below).
Color Defect Verification: accommodates 6.3x or 10x magnification verification lenses for defect review in color on screen. Lens magnification to be specified by customer at time of purchase.
SPC (Statistic Process Control): generates comprehensive charts to assist the quality engineer in reducing manufacturing process variations, identifying root causes, and enhancing overall production yields.
Fan Filter Unit (FFU): Enables class 100 mini environment
Options:
Color camera and objective x 6.3: Built-in verification camera with 0.9 micron resolution
"Chromatic Confocal System (CCS 4™ - 1mm): Confocal Chromatic 3D System for height measurement and calculation of co-planarity, roughness and bump profiling. Application pending. Height measurement range  - approx. 1000 microns.
Note: CCS is discounted 50% because this is the 2nd 3D sensor for the system. "
CTS 9000™: Triangulation 3D System [applicable for Condor 200/300 series] Equipped with optical magnification x5.  *Application Dependent. (see notes in Section II).
Upgrade of 3D measurement system from CTS 9000 to CTS 15000LC.
High resolution optics [x10 Magnification] for 3D measurement. Can be specified at time of order instead of x5 optical magnification. Throughput will be reduced. Especially applicable for Gold Bump & Micro Bumps application- including special lighting. Field upgradable.
Surface Inspection: Algorithms that find surface defects on predefined scan area.
CD (Critical Dimension) Inspection of Bumps and Pads: Diameter of Solder Bumps, Width and Length of Rectangular Pads and Bumps, X & Y Mislocation.
"One Existing Wafer Map Format: AOI will import and update / create reports based on existing format.
Formats available: STDF, Semi G85, TSK, TEL, EG_SORTNET, SINF, ESC, ITSK, TI_WWWM, STIF, SINF, KLA, etc."
GEM/SECS 200mm: Basic functions package for 200mm systems. Please refer to GEM/SECS manual provided by Camtek
Top Optical Character Recognizer:  Automatically reads the Wafer ID from the Top. Applicable for 200 mm systems
Auto loader for 6" & 8" wafers. Supports two cassettes. Option to support 4" & 5"
Certified 3D performance target: Certified 3D metrology target