EVG 620 NT Wafer Bond Alignment System for Sale

-Still installed

-Has been qualified, but never used in production

-Please refer to the attached photos for details of current condition.

Detailed Configuration:-
1 x Basic Unit
- PC controlled Microsoft Windows® based operating environment
- Self diagnostics during machine start up, automatic initialization of all motors, position end switches, sensors and pneumatics.
- Solid state drive and hard drive for high availability and reliability
- LAN connection for remote connection and diagnostics
- Data backup to USB and/or DVD
- EC Declaration of Conformity
- User interface including keyboard and monitor
- Granite base frame construction for improved alignment accuracy

1 x User Interface
- Graphical User Interface (GUI) for system operation
- User interface including keyboard and monitor
- Effective operation and control of the machine
- Feedback from the machine
- System integrated
- Keyboard
- 24" Monitor

- Facility Connections Through Machine Sidewall
- Does not require a cleanroom with raised floor / sub floor

Software:
- Microsoft Windows® based process software for recipes, processing and diagnostics
- Automated recording of process parameters
- Storage of files and presets on hard disk or network
- Password protected access levels for operator, engineer and maintenance

Process Modules Included:
1 x Optical Alignment Module
- Wafer thickness 0.1 - 4.4 mm with a total stack of thickness of 4.5 mm (extended thickness range optional)
- Loading with mechanical prealignment
- Quick change of chuck with automatic pressure and vacuum transfer
- Recipe parameters and user guidance for processes
- Granite base frame construction for improved alignment accuracy

1 x Alignment Stage Fully Motorized
- Fully motorized X, Y, Theta and Z alignment stage, alignment via three (3) axis joystick
- With DC motor controllers for cursor key fine alignment
- Automatic wedge compensation system designed for optimized print gap control
- Adjustable WEC and exposure contact force

1 x NanoAlign Technology Package
- Increases EVG aligner microscope resolution by factor ~2 (for improvement of alignment results or extended depth of focus)
- Improved image quality due to 100 % digital signal processing
- Enhanced digital zoom capabilities

1 x Bottom Side Microscope
- Motorized splitfield microscopes for alignment in visible light with high resolution CCD-cameras
- Bottom side alignment via digitized alignment keys (mask) or cross hair
- Digital zoom software providing 2x and 4x image magnification for fine alignment with objectives
- Travel range*: X: 78 (58) mm - 150 mm; Y: ± 12 mm
*Actual travel range might be restricted by chuck design

1 x Recipe Controlled Microscope Illumination Spectrum
- Contrast improving illumination system
- Increased pattern visiblity due to spectral adjustment of microscope illumination light source
- Improved alignment reliability for manual and automatic alignment processes
- User definable illumination spectrum composed by two (2) individual adjustable LED light sources per microscope (red, green)

2 x Objective 5x

1 x Automatic Alignment for Top and/or Bottom Side / Cognex VisionPro®
- Vector based image recognition
- EVG proprietary software implementation based on Cognex VisionPro®
- Storage of trained mask and substrate patterns on hard disk
- Comply with user definable alignment marks for top and bottom side alignment
- Key identification feature (detail search) for multi layer alignment key design
- For scaled (over / under etched) alignment keys
- Easy operation with menu assisted training of mask and wafer alignment marks

1 X Software for Bond Alignment
- Recipe parameters and user guidance for bond alignment processes
- Optical alignment of two (2) wafers (after manual loading) for Silicon Direct Bonding (SDB) or other substrate configurations like Si+Glass, Si+Si
- For subsequent anodic, thermo-compression or fusion bonding processes in a EVG500 series bond system

1 X Loading Chuck for 120 mm Substrates (Double Stack)
- Customized design 
- Special Loading Chuck for 120 mm substrates
- Designed to support loading glass (glass not included)
- For loading and alignment of top wafer
- For double stack alignment
- Recess for spring loaded clamping feet

1 X Rack Unit for EVG620 Bond Aligner
- Integrates alignment module, operating elements and monitor
- Vibration isolated
- Prepared for robotic autoload system (Motorized Alignment Stage needed)