EVG 520 IS Wafer Bonding System for Sale

-Still installed

-Has been qualified, but never used in production

-Please refer to the attached photos for details of current condition.

Manufacturer:EVG
Model: 520 IS 
Type: Wafer Bonding System - Production Line (up to 150 mm, 1 x bond module, manual handling)

Comments:
Overview of functionality
Basic Unit
- PC controlled Microsoft Windows® based operating environment
- Self diagnostics during machine start up, automated initialization of all motors, position end switches, sensors and pneumatics.
- Solid state drive and hard drive for high availability and reliability
- LAN connection for remote connection and diagnostics
- Data backup to USB and / or DVD
- EC Declaration of Conformity 

- Facility Connections Through Machine Sidewall

- Modular Machine Platform -  For up to two (2) process modules

Handling
- Manual load and unload of bond chucks and wafers
- Ergonomically accessible chamber design with top loading
- Full process and recipe compatibility to EVG production bonding systems
- Handling tool for unloading and loading of bond chucks (150 mm heater size)

External Cooling Station
- For cooling of bond chuck and unloading of bonded wafers
- With wafer cooling
- With temperature sensor
- Clamping of bond chucks and unloading of bonded wafers

- Signal Tower included

1 x Process Gas Line
- Including magnetic valve for software controllable opening and closing of process gas lines
- Flow rate can be adjusted manually by needle valve
- Configuration supplies all available bond modules in system
- Pressure reduction of process gas from maximum 10 bar to 0.5 - 2 bar
- Digital pressure gauge, range: 0 - 10 bar to check process gas pressure and availability with connection to software for error recognition and display for manual reading of pressure
- High-purity pressure regulator
- For use with N2, He, Ar, N2+H2 and others on request

Software:-
-GUI
-EVG CIMFramework
-EVG Recorder
-EVG Analytics

Process Modules:-

1 x Bond Module for UV Light Source
- For max. 150 mm substrates
- Bond chamber for UV cured adhesive bonding
- Maximum force applicable to the substrate: 3 kN
- Separate connections for evacuation and vent
- Two (2) bar absolute pressure
- For room temperature use only (heat capability optional)
- Electronic pressure regulator for controlled contact force

1 x Flag Pulling Mechanism
- Flag pulling mechanism for standard bond chuck
- For extracting flags between substrates
- Independently controllable mechanics for three (3) flag pullers

1 x Bond Cover for UV-LED Curing
- LED module for 365 nm wavelength
- Highly efficient water cooling system
- Lamp intensity > 160 mW / cm2
- Transparent cover and assembly for force application
- Levelling feature to level with substrate during application of force
- Recipe programmable UV exposure time

1 x Heating and Cooling Capability for Bottom Side Chuck
- Bottom side heater for up to 200 °C
- Forced water cooling
- Silent operation
- Temperature sensor for monitoring bottom side

1 x Increased Piston Force up to 6 kN
Resolution: 6 N steps

1 x Vacuum Equipment with Roughing Pump
- Evacuation over roughing pump including connectors and valves for chamber
- Gas backfill time < 10 s from high vacuum to 1 bar
- Measurement equipment including vacuum gauge for equipped base pressure to display the chamber vacuum on the PC
- Wait command to pressure level
- Oil-free roughing pump, ultimate chamber vacuum 0.1 mbar absolute

Tooling UV Included with tool:-
1 x Pressure Disk UV Bond Cover for 120 mm Substrate
- Material: quartz

2 x Bond Chuck for 120 mm Substrate
- Allows substrate contact in vacuum and defined atmosphere with configured EVG bonding system
- Separation flags (spacers)
- Bond chuck frame made of Aluminium
- For optically aligned wafer bonding
- Tool Insert Material Titanium
- For bonding processes up to 550 °C

MODULE BAY
1 x Empty Module Bay prepared for One (1) UV Bond Module

SUPPLIES
1 X Closed Loop Cooling Water Supply Water to Air Heat Exchanger