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TEL Tokyo Electron ACT 8 DUV Photo Resist Coat and Develop System, 2C,2D,ASML for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used TEL Tokyo Electron ACT 8 DUV Photo Resist Coat and Develop System, 2C,2D,ASML.
Please click on the "Send More Details" button at the end of the ACT 8 description, if you'd like to get more details, photos and specifications of this DUV Photo Resist Coat and Develop System, 2C,2D,ASML, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This TEL Tokyo Electron ACT 8 DUV Photo Resist Coat and Develop System, 2C,2D,ASML is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


TEL Tokyo Electron ACT 8 Equipment Details

SDI ID: 102904
Manufacturer: TEL Tokyo Electron
Model: ACT 8
Description: DUV Photo Resist Coat and Develop System, 2C,2D,ASML
Version: 200 mm
Vintage: 01.06.1998
Quantity: 2
Sales Condition: as is where is
Lead Time: immediately
Sales Price (each): Inquire
Comments:

DUV, Single Block, 2C2D1IFB, 3PHP, Right to Left Flow, 4UNCs, ASML PAS5500.

1. Maker : TEL/Tokyo Electron Limited
2. Model : Clean Track ACT 8
3. Description : Photo Resist Coat and Develop System
4. Vintage : 1998
5. Serial Number : TBA
6. Configuration
 

1. Block Diagram (Right to Left Wafer Flow)
    2,290 x 157 x 2,685 (L x W x H by mm)

 

3-4 WEE   2-24 LHP     2-14 LHP    
    2-23 CHP     2-13 LHP   UNC
    2-22 CHP     2-12 LHP    
    2-21 CHP     2-11 RSV CRA 1-0 (1-4)
3-5 EIS 3-0 IRA 2-20 RSV     2-10 CWH    
    2-19 RSV     2-09 CPL   UNC
    2-18 RSV 2-0 2-08 TRS    
    2-17 CPL PRA 2-07 TRS   (1-3)
  _________ 2-16 TRS   2-06 RSV    
    2-15 CPL     2-05 ADH    
3-3 SBU   2-3   2-4      
              UNC
    DEV     DEV    
3-2 SBU             (1-2)
    2-1   2-2      
              UNC
    COT     TCT PUP  
3-1 THS             (1-1)
            (1-5)  



Chemical Supply System
Develop, Solvent and HMDS Supply
1,400 x 700 x 1,810 (L x W x H, mm)

Thermo Control Unit
SMC INR-244-211D-45
450 x 1,050 x 1,400 (L x W x H, mm)

Temp & Humidity Controller
Shinwa T&H-CPE-2
650 x 950 x 1,493 (L x W x H, mm)

AC Power Rack
600 x 600 x 1,600 (L x W x H, mm)

2) Cable Lengths

No. From            To      Length
                            Power   Signal
1.  AC Power Rack   PRB2    13 M
    AC Power Rack   TCU     13 M
    AC Power Rack   T + H   13 M
2   Chemical Cab.   PRB2    13 M
    Chemical Cab.   TCU              13 M
    Chemical Cab.   T + H            13 M

3) Chemical Cabinet Layout Details

1           2           3           4
2-5 ADH     Solvent     2-3 DEV     2-4 DEV
HMDS        Filter      Filter      Filter
Buffer      Tray        Tray        Tray
Tank Tray   

5                           6
Solvent                     DEV
3L Buffer                   3L Buffer
Tank 2ea                    Tank 2ea

4) General Configuration
 A. Wafer Size : 200mm, DUV/Deep UV Application, Single Block System
 B. Wafer Flow : Right to Left (CSB Unit is in Right side and Interface Station Unit is in Left side)
 C. Process Block : 1ea (Single Block System)
 D. Block #1
  a. TEL Clean Track ACT 8 EC/Equipment Controller #2
  b. Stage/Indexer : Open Uni-Cassette CSB/Cassette Stage Block
  c. CRA/Cassette Block Robotics Arm : 1ea
  d. FFU: N/A

 E. Block #2
  a. 2-1 Standard Coat Unit including:
    1. 4 Standard Photo Resist Dispense Nozzles
    2. 4 TEL OEM RRC F-T201 Photo Resist Pumps
    3. 1 Solvent Pre-wet RRC/Reduced Resist Coat Nozzle
    4. 1 Side Rinse Nozzle (Programmable Side Rinse EBR)
    5. Dual Back Rinse Nozzles
    6. Coat Cup Temperature Synchronized Control System
    7. Photo Resist Temperature Control
    8. Motor Flange Temperature Control
    9. Photo Resist Drain Type : Direct Gravity Drain Type
   10. Auto Dummy Dispense System
   11. Photo Resist Bottle Configuration:
            Resist#1 Resist#2 Resist#3 Resist#4
Coater 2-1  1 Bottle 1 Bottle 1 Bottle 1 Bottle
Coater 2-2  N/A      1 Bottle 1 Bottle N/A

  b. 2-2 TCT (Top ARC/Anti-Reflecting Coat) Unit including:
    1. 2 Standard Photo Resist Dispense Nozzles
    2. 2 TEL OEM RRC F-T201 Photo Resist Pumps
    3. 1 Solvent Pre-wet RRC/Reduced Resist Coat Nozzle
    4. 1 Side Rinse Nozzle (Programmable Side Rinse EBR)
    5. Dual Back Rinse Nozzles
    6. Coat Cup Temperature Synchronized Control System
    7. Photo Resist Temperature Control
    8. Motor Flange Temperature Control
    9. Photo Resist Drain Type : Direct Gravity Drain Type
   10. Auto Dummy Dispense System
   11. Photo Resist Bottle Quantity :
            Resist#1 Resist#2 Resist#3 Resist#4
Coater 2-1  1 Bottle 1 Bottle 1 Bottle 1 Bottle
Coater 2-2  N/A      1 Bottle 1 Bottle N/A

  c. 2-3 Develop Unit, including:
    1. 1 H Nozzle
    2. Develop Temperature Control
    3. Motor Flange Temperature Control
    4. Drain Type : Direct Gravity Drain Type
    5. Top Rinse Nozzle
    6. Dual Back Rinse Nozzle
    7. Auto Damper
    8. Auto Dummy Dispense System
  d. 2-4 Develop Unit : Same as 2-3 Develop Unit
  e. PRA/Process Block Robotics Arm : 1ea
  f. ADH/Adhesion Process Station : 1ea
  g. LHP/Low Temperature Hot Plate Station : 4ea
  h. CPL/Chilling Pate Process Station : 3ea
  i. TRS/Transition Stage Unit : 3ea
  j. CHP/Chilling Hot Plate Process Station : 3ea.
  k. PHP/High Precision Hot Plate Process Station : N/A
  l. CWH/Cup Washer Holder Unit : 1ea

 F. Block #3 : Normal Speed Interface Block, including:
  a. IRA/Interface Robotics Arm : 1ea
  b. Interface for ASML(PAS5500/300C) Scanner.
  c. WEE/Wafer Edge Exposure Process Station :1ea (Deep UV, 365nm)
  d. THS/Temporary Holding Stage : 1ea
  e. SBU/Stationary Buffer Unit : 2ea
  f. TRS/Transition Stage Unit : N/A
  g. CPL/Chill Plate Process Station : N/A
  h. EIS/Interface Stage Module : N/A
  i. FFU: Installed

 G. T&H/Temperature and Humidity Controller : 1ea
   - 1ea of TEL OEM Shinwa T&H-CPE-2

 H. External Chemical Supply System/Cabinet (HMDS, Solvent, Developer)
   a.HMDS Supply System
    1. HMDS Chemical Type: 1ea
    2. Bulk-Fill CSS/Central Chemical Supply Type with 3 Liter Teflon Buffer Tanks (1)
    3. 1 Buffer Tanks (3 Liter/Tank, Teflon, N2 Bubbling) for 1 ADH Unit
   b.Solvent Supply System for 1 Standard COT (2-1) and 1 TCT (2-2)
    1. Solvent Chemical Type: 1ea
    2. Bulk-fill CSS/Central Chemical Supply Type with 3Liter Teflon Buffer Tanks (2
    3. 2 Buffer Tanks (3 Liter/Tank, Teflon) to support 1Standard of COT and 1 TCT
   c.Developer Supply System for 2 Develop Units (2-3 and 2-4)
    1. Developer Chemical Type: 1ea
    2. Bulk-Fill CSS/Central Chemical Supply Type with 3 Liter Teflon Buffer Tanks (2)
    3. 2 Buffer Tanks (3 Liter/Tank, Teflon) to support 2 Develop Units (2-3 and 2-4)

 I. TEL OEM TCU/Temperature Control Unit : 1ea
    (SMC Circulator Pumps and Thermo Controller with 7 Channels)
     a. 2 Chilling Channels for 2 Coat Spin Units (COAT and TARC Spin Unit)
     b. 2 Chilling Channels for 2 Develop Units
     c. 3 Chilling Channel for 3 CPL/Chill Plate Process Station Units

 J. Robots : Total 3 Robots (1 CSB Robot, 1 Main Arm Robots and 1 Interface Station Robot)

 K. Power Transformer AC Cabinet : 208VAC, 3 Phases, 50/60Hz

 L. Software
  a. Software Version : 1.18

 M. Safety Regulation Compliance : TEL S2-93 Safety Specification

 N. Utility connection Position
  a.Connection Position : Bottom/Back Side

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The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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