6 inch Complete MEMS Production Facility for Sale for Sale

Complete MEMS production facility for sale.
-Items for sale include the entire cleanroom facility, its utilities, and equipment.
-Devices being manufactured: Pressure and Flow Sensors
-Approx. production capacity: 100 wpm
-Design rule: 1 uM
-Overall facility mq: 415
-80 m2 class 100 cleanroom

Cleanroom Equipment
All equipment is capable of processing both 4-inch wafers and
6-inch wafers, with a few tools also being capable of running
8-inch wafers. The toolset includes:
- Sputter Deposition System
- E-Beam Evaporator
- High Temperature Furnaces
- Plasma Oxygen Asher
- Solvent Bench
- Acid/Base Benches
- Photo-Resist Spinner
- Rinser/Dryer Tools (4 sets)
- Nanoscope
- Programmable Ovens
- EVG Aligners, 2 sets
- Bonder, 2 sets (anodic, thermal, fusion)
- Mega Sonic Cleaner
- Ultra Sonic cleaner/liftoff
- Screen printer for glass frit printing
- Matrix System Photo Resist Stripper
- Automated Wafer Lithography Track
- Wafer Scrubber
- EDP Reactor Cell

A full equipment list is available on request.

Machine Shop
A machine shop is included with the facility.
Main equipment:-
- CNC Milling and Drilling Machines
- 6-inch Disc Sander, 7-inch Metal Cutting Band Saw, 20-inch
Vertical Band Saw
- Lathe
- Milling and Drilling Machines (Acra & Lagun-Republic)

Centralized Utilities
- DI Water
- Pure Nitrogen
- Comprehensive Piped Waste Management System
- Compressed Air (multiple generators)
- Vacuum
- Chilled Water
- Fire and Security Monitoring System
- Dedicated Power Supply (480 V, 208 V, 3 phase)
- Uninterrupted Power Supply for the Entire Cleanroom Facility
- High-Speed Digital Telephone & Computer Network System

Process Capabilities:-
- Photolithography
- Wafer-to-wafer alignment
- Double-side alignment and photolithography
- Shadow Mask alignment
- Wet chemical processes for a variety of applications (standard wafer clean and chemical
processing for cleaning, etching, photolithography, electroplating, etc.)
- Silicon etching (EDP, KOH and HF/HN- 3 )
- Thermal Oxidation
- Boron Diffusion
- Thermal Annealing
- Evaporation
- Sputtering
- Anodic Bonding
- Pre-Fusion & Fusion Bonding
- Plasma Asher
- Mega Sonic Cleaning
- Ultrasonic cleaning
- Liftoff
- Wyk- (optical surface profilometer)
- Dektak (step measurement)
- Nanoscope (film thickness measurement)